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Ventec VT-901 reliability validated by HATS testing at key Israeli customers

22 September 2016

20th September 2016 – Ventec International is proud to announce that the reliability of its VT-901 polyimide laminates, prepregs and low-flow prepregs has been conclusively demonstrated by Highly Accelerated Thermal Stress (HATS) testing by two leading PCB manufacturers in Israel.

PCB Technologies tested VT-901 materials in complex high layer count rigid multilayer constructions, Eltek’s testing also included high layer count flex-rigid multilayers and VT-901 easily satisfied the test criteria in all examples.

Mark Goodwin, Ventec COO Europe and USA, commented: ‘These remarkable HATS results, from two leading manufacturers of PCBs for military and aerospace applications, further demonstrate the thermal robustness of Ventec VT-901 polyimide and its suitability for use in high reliability rigid and flex rigid multi-layers in this demanding sector. Together with the AS9100 accreditation of our manufacturing and distribution facilities, these results clearly position Ventec as a world leader in the supply of high-reliability polyimide materials. We will now start with the next phase of our business development in Israel, which will involve the local stocking of materials to meet quick turn requirements of customers. This will be managed by our local agent & partner A.J. Englander (1980) Ltd http://englandertlv.co.il/.

For more information about Ventec’s solutions and the company’s wide variety of products, please visit www.venteclaminates.com.

 

About Ventec International Group

With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and quick-turn CCL manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, visit www.venteclaminates.com, www.ventec-usa.com or www.ventec-europe.com.

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