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Reducing manufacturing costs through upscaling panel size for copper plating on Fan-Out Panel-Level Packaging (FO-PLP)

8 October 2018

“Upscaling panel size for copper plating on FO-PLP applications to reduce manufacturing cost” will be the topic of Atotech’s presentation at this year’s iMAPS conference, held in Pasadena, USA, from October 8 to 11, 2018.  

Atotech’s presentation is part of Session TP2 on advanced fan-out and will be held by Christian Ohde, Global Application Manager for Panel and Pattern Plating and Dirk Ruess, Sales Development Manager for Electronics Equipment, on Tuesday, October 9, 2018, from 2:00 – 2:25 pm.  

“Since the successful implementation of Fan-Out Wafer-Level Packaging (FO-WLP) in the production of the iPhone 7 the industry is interested to increase the through-put and lower the total cost of ownership by moving from round wafer to panel format,” explains Christian Ohde. He continues “with Atotech’s MultiPlate®, a revolutionary new plating tool, the plating requirements for both wafer- and panel level packaging are met.”

The presentation will discuss the developments in FO-PLP and explain the current capability for copper distribution over panels for various panel formats (370 × 470 mm² up to 600 × 600 mm²). It will also introduce Atotech’s newly developed electrolytes for high-speed copper deposition in RDL plating – both with and without microvias and tall pillar plating (PoP design).

“Recently obtained process results show that FO-PLP has the potential to be not only a strong competition approach to FO-WLP, but seriously challenge the status quo in the coming years. High speed copper deposition enabled by the combination of new electrolytes and adapted plating equipment technology will be the answer of the challenges the industry currently faces,” adds Dirk.

MultiPlate®PLP, Atotech’s revolutionary new tool for FO-PLP         

The company will also present two topics at the poster session in the foyer on Thursday, October 11, from 11:45 am to 1:15 pm:

  • “Novel formaldehyde-free electroless copper for plating on next generation substrates” in poster session 140 by Christian Wendeln, R&D Scientist for Desmear and Metallization at Atotech Group
  • “Investigation of a proactive glass filler removal in IC substrate build-up films and its effect on topography and copper adhesion” in poster session 146 by Stefan Kempa, R&D Scientist for Desmear and Metallization at Atotech Group

Atotech invites all iMAPS conference visitors to stop by and join their presentations on October 9 and 11. The Atotech team is also looking forward to discuss any other themes, trends and recent developments.


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