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23 May 2016

Electronic sensors for implants close to reality

Tiny electronic sensors and devices that can be implanted in the body and then dissolve almost without a trace are getting closer to reality. Scientists have tested several biodegradable materials, including DNA, proteins and metals, for making transient electronics. Now one team, reporting in the journal ACS Applied Materials & Interfaces, has taken another step toward this goal. They created a dissolvable device component out of egg proteins, magnesium and tungsten.

Transient electronics have many potential applications from localized drug delivery to pollution monitoring. To explore these possibilities, scientists have been working with an array of natural materials to test how well they perform in electronic devices and whether they might cause side effects or damage when implanted.

Unlike conventional electronics that contribute to a growing amount of harmful waste, dissolvable devices are designed to be compatible with the environment. Jikui Luo, Xiaozhi Wang and colleagues wanted to build on this work and develop a transient memory resistor with dissolvable components. This electronic component, also called a memristor, is a new type of resistor that regulates the flow of electric current and also can “remember” charges.

The researchers rapidly spun diluted egg albumin, the white part of an egg, on a silicon wafer to turn it into an ultra-thin film. Then they incorporated electrodes made out of magnesium and tungsten. Testing showed that the device’s performance matched that of non-degradable memristors. Under dry conditions in the lab, the components worked reliably for more than three months. In water, the electrodes and albumin dissolved in two to 10 hours in the lab. The rest of the chip took about three days to break down, leaving minimal residues behind.

The authors acknowledge funding from the National Natural Science Foundation of China and the Research Fund for the Doctoral Program of Higher Education of China.
Read more at: http://www.printedelectronicsworld.com/articles/9423/toward-dissolvable-electronics-for-implants-and-sensors

 

Underglass fingerprint sensor unveiled.

LG Innotek (CEO Jongseok Park) has announced an under glass fingerprint sensor module. It means you just place your finger on the cover glass of the phone and then it identifies your fingerprint.

This module gives the freedom of the smartphone design and even enhances the user-friendly function, for example, waterproof or protection from scratches.   Previous ‘button type’ modules required you to press a finger on a raised square or circular button for your fingerprint to be read exactly, so the sensor was usually mounted on the front, rear or side buttons of a smartphone.

LG Innotek cut a shallow furrow of 0.01inches (0.3mm) thick on the lower backside of the cover glass and installed the fingerprint sensor inside of it with using their supreme precision and combination technology.   With this module, the sensor is not exposed to the outside of the device, so manufacturer can produce a sleek designed smartphone.

Fingerprint recognition area also can be indicated by various patterns up to design of complete product.   High-strength cover glass protects the sensor and prevents it from coming in direct contact with water or damage from scratches.   At the same time, the new module secured the fingerprint recognition accuracy compared to the button type. The new module has a false acceptance rate (FAR) of 0.002%. The FAR is the probability that the system falsely recognizes someone else’s biometric information as that of the user.

LG Innotek developed a proprietary adhesive to be used to attach the sensor to the glass, securing the commercialization scale of the durability including high impact absorption.   The adherent side of the sensor and glass is only 0.0098inches (0.25mm) thick, but it endures impact of 4.6 oz (130grams) of the steel ball dropped from 7.9inch (20cm).

LG Innotek expects that demand for fingerprint recognition technology will dramatically increase due to the expansion of the mobile payment market, and has a plan to secure the new customer.   Source and top image: LG Innotek Learn more at the next leading event on the topic: Printed Electronics USA 2016 on 16 – 17 Nov 2016 in Santa Clara, CA, USA hosted by IDTechEx.

Read more at: http://www.printedelectronicsworld.com/articles/9421/innovative-fingerprint-sensor-module

 

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