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28 February 2018

IPC Releases New IPC/PERM-2901, Pb-free Design and Assembly Implementation Guide

IPC-PERM-2901 addresses the impact of Pb-free on reliability and service life for aerospace, defense and high-performance products

 

IPC — Association Connecting Electronics Industries® Pb-free Electronics Risk Management (PERM) Council has developed the first single document dedicated solely to assisting design engineering in the development of electronics that are completely lead-free (Pb-free) and meet the demanding requirements of aerospace, defense and high performance (ADHP) products and systems.

IPC/PERM-2901, Pb-free Design and Implementation Guide, provides an in-depth review of printed board defects, manufacturing and soldering processes, supply chain control, selection, use and assembly with commercial off-the-shelf (COTS) products and obsolescence management.

While the commercial electronics industry has almost eliminated the need for tin-lead (SnPb) based electronics systems and products, the ADHP industry, due to a lack of industry-accepted reliability models for Pb-free interconnections, has continued to rely on SnPb for their products. As it becomes more cost-prohibitive for the ADHP industry to continue to use SnPb products, and with failure mechanisms for Pb-free materials being significantly different than SnPb materials, gaining knowledge and understanding of how Pb-free materials affect the ADHP industry has become critical.

Although many technical papers and industry studies have been published addressing the Pb-free soldering process over the past 20 years, the IPC/PERM-2901, Pb-free Design and Implementation Guide is the first to assist design engineering, quality assurance and manufacturing engineering in understanding and appreciating the differences in mechanical and physical behaviors of Pb-free soldering and providing avenues for risk mitigation.

This guideline specifically addresses the “delta” differences between SnPb and Pb-free solder technologies relative to manufacturing the same products. The differences in these solder technologies are generally categorized (with respect to Pb-free solder alloys) as:

  • Typically poorer wetting ability
  • Differences in appearance and inspection criteria
  • Typically higher melting temperature
  • Potential tighter process window for repair/rework
  • Increased potential of tin whiskers

The PERM Council, comprised of global participants from government, military, medical, academia and other not-for-profit organizations, along with private companies, was created to address the need for how Pb-free materials directly affect product performance, reliability and service life.

The European Union’s Restriction of Hazardous Substances (RoHS) profoundly affected the electronics industry when lead was listed as a restricted substance. According to Linda L. Woody, formerly of Lockheed Martin and former PERM Council Chair, “ADHP systems and products have a broad range of performance requirements, and have relied on SnPb products for decades. We created the guideline to ease the transition from SnPb to Pb-free, and to help the industry meet the demanding requirements of the ADHP systems and products.”

For more information or to purchase IPC/PERM-2901, Pb-free Design and Implementation Guide, visit the IPC Online Bookstore.

IPC Issues Position Paper on Priorities for an Ambitious EU Industrial Policy Strategy

Supports skills gap closure, R&D incentives and strong IP protection

 

IPC – Association Connecting Electronics Industries® has issued a position paper, “IPC Priorities for an Ambitious EU Industrial Policy Strategy” in support of EU Industry Day, taking place February 22-23, 2018.

Last September, the European Commission published a Communication on a renewed EU industrial policy strategy that emphasizes crucial aspects for the electronics industry, such as the need for substantial investment in advanced manufacturing, skilled and talented workforce as well as research and innovation.

EU Industry Day will update stakeholders on the Commission’s strategic approach to industrial policy and actions to further develop industrial competitiveness in Europe.  During this forum, stakeholders contributing to European industrial competitiveness can showcase their activities, learn from each other, discuss cross-cutting issues and develop joint visions for the future.

“IPC welcomes the EU Industrial Policy and related efforts to address these issues that are critical for our members,” said IPC President and CEO John Mitchell. “With more than 650 members in Europe, the majority of which are small- and medium-sized enterprises (SMEs), IPC has long advocated for an ambitious industrial agenda for Europe.

“I also encourage our member companies to participate in IMPACT Brussels 2018 this fall, when we will meet with EU officials to address the EU Industrial Policy and other issues, such as environmental regulations. A save-the-date for IMPACT Brussels 2018 will be sent to our members soon.”

 

For more information on IPC’s position paper, “IPC Priorities for an Ambitious EU Industrial Policy Strategy,” visit IPC’s website.

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