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7 March 2017

IPC Issues Call for Participation for IPC APEX EXPO 2018

BANNOCKBURN, Ill., USA, March 6, 2017 — IPC — Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO®2018 to be held at the San Diego Convention Center. Professional development courses will take place February 25, 26 and March 1, 2018 and the technical conference will take place February 27–March 1, 2018.

         The industry’s premier conference and exhibition for the electronics industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. Staff from companies such as Ericsson, Flex, IBM, Indium, Intel, MacDermid Enthone and Robert Bosch GmbH have presented papers at past technical conference sessions at IPC APEX EXPO. To recognize exceptional achievement, awards will be presented for “Best Paper.”

Expert papers and presentations are being sought on design, materials, assembly, processes, test, reliability and equipment in the following areas:

  • 3D Printing in Electronics Manufacturing
  • Automation in Electronics Manufacturing
  • Adhesives
  • Advanced Technology
  • Area Array/Flip Chip/0201 Metric
  • Assembly and Rework Processes
  • BGA/CSP Packaging
  • Black Pad and Other Board Related Defect Issues
  • BTC/QFN/LGA Components
  • Business & Supply Chain Issues
  • Cleaning
  • Conformal Coatings
  • Corrosion
  • Counterfeit Electronics
  • Design
  • Electromigration
  • Electronics Manufacturing Services
  • Embedded Passive & Active Devices
  • Environmental Compliance
  • Graphene in Electronics Manufacturing
  • Lean Six Sigma
  • LED Manufacturing
  • Failure Analysis
  • Flexible Circuitry
  • HDI Technologies
  • Head-on-Pillow
  • Board and Component Warpage
  • High Speed, High Frequency & Signal
  • Industry 4.0
  • Integrity
  • Lead-Free Fabrication, Assembly & Reliability
  • Miniaturization Nanotechnology Optoelectronics
  • Packaging & Components
  • PCB Fabrication
  • PCB and Component Storage & Handling Performance
  • Quality & Reliability
  • Photovoltaics
  • PoP (Package-on-Package)
  • Printed Electronics
  • Reshoring
  • RFID Circuitry
  • Robotics
  • Soldering
  • Surface Finishes
  • Test, Inspection & AOI
  • Tin Whiskers
  • 2.5-D/3-D Component Packaging
  • Underfills
  • Via Plugging & Other Protection
  • Wearables

 

         An approximate 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest and contain appropriate technical test results.

In addition, course proposals are solicited from individuals interested in presenting half-day (three-hour) professional development courses on design, manufacturing processes and materials.

Technical conference paper abstracts are due July 7, 2017 and course proposals are due August 18, 2017. To submit an abstract or course proposal, visit www.IPCAPEXEXPO.org/CFP.

 

Gary Ferrari, FTG Circuits, Earns Dieter Bergman IPC Fellowship Award

Award honours IPC members who have exhibited ongoing leadership

In recognition of his ongoing leadership in developing and promoting IPC standards on a global basis, IPC – Association Connecting Electronics Industries® bestowed the Dieter Bergman IPC Fellowship Award upon Gary Ferrari, FTG Circuits.

This recognition is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry and embody the work ethic and spirit of the late Dieter Bergman… a pioneer and industry icon. Award recipients are eligible to bestow the Dieter Bergman Memorial Scholarship upon the university or college of his/her choice and Ferrari’s selection was the University of Connecticut, Electrical and Computer Engineering program.       

For more than four decades, Ferrari has donated countless hours to IPC and his list of achievements is vast. He spearheaded IPC’s highly successful PWB Designer Certification program, which has trained and recognized more than 6,500 designers to date. In addition, he co-founded the IPC Designers Council, and served as its executive director for many years. Ferrari is currently a member of the IPC Designers Council Executive Board and is a member of the Designers Council Education Committee.

 His work on standards committees has been long-standing and impactful. He currently serves on four dozen technical committees with a leadership role in four.

He is a member of the Technical Activities Executive Committee (TAEC) and served as a TAEC chair.

“IPC and the entire electronics industry are fortunate to have Gary volunteer his time and expertise to IPC standards and program development,” said John Mitchell, IPC president and CEO. “His work has enriched both the industry and IPC and we are thankful for his dedication.”

For more information on the Dieter Bergman IPC Fellowship Award and this year’s award recipient, contact Sandy Gentry, IPC communications manager, at +1 847-597-2871.


North American PCB Sales Softened in January

IPC Releases PCB Industry Results for January 2017

 

IPC have announced the January 2017 findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Sales declined in January, while the PCB book-to-bill ratio strengthened slightly to 0.99.

Total North American PCB shipments in January 2017 were down 4.0 percent compared to the same month last year. Compared to the preceding month, January shipments decreased 15.6 percent.

PCB bookings in January declined by 5.6 percent year-on-year. Bookings were down 7.6 percent compared to the previous month.

“January is typically a slow month for PCB sales and orders,” said Sharon Starr, IPC’s director of market research. “The North American PCB book-to-bill ratio remained below parity in January for the third straight month, but it climbed back up a notch to 0.99, which is an encouraging sign,” she added.

Detailed Data Available

The next edition of IPC’s North American PCB Market Report, containing detailed January data from IPC’s PCB Statistical Program, will be available next week. The monthly report presents detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by company size tiers, military and medical market growth, demand for prototypes, and other timely data. This report is available free to current participants in IPC’s PCB Statistical Program and by subscription to others. More information about this report can be found at www.ipc.org/market-research-reports.

 

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to six months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio at the end of each month. Statistics for the current month are normally available in the last week of the following month.

 

Electronics Industry Experiences Technology’s Turning Point at

IPC APEX EXPO 2017

  From revolutionary advancements displayed on the show floor to expert insights conveyed in technical conference sessions and professional development courses, IPC APEX EXPO® 2017 provided the learning and connections that helped 4,169 attendees from 39 countries prepare for the future. The 449 exhibitors welcomed a busy three days of business development and qualified sales leads on 149,600 square feet of show floor space. IPC APEX EXPO attracted 8,446 total visitors including attendees and exhibitor personnel.

Many attendees indicate that IPC APEX EXPO influences their buying decisions throughout the year which is an important factor for the show exhibitors. “IPC APEX EXPO is a great industry event that creates opportunities for us to engage in deeper discussions about our Smart Factory Solutions regardless of a customer’s mix or volume. It’s more than a traditional trade show… Customers actually come to explore how automation can solve their production challenges so they can focus on running their business,” said M. Faisal Pandit, president, Panasonic Factory Solutions Company of America.

Show attendees also achieved what they sought from the event. “IPC APEX EXPO is great because it provided professional development and technical courses as well as networking opportunities and the ability to meet with vendors on the show floor,” said Amy Taylor, industrial engineer, Rockwell Collins.

Milea Kammer, Ph.D., senior product design engineer, Honeywell Aerospace, echoes the sentiment, “The experience to be able to meet experts and thought leaders under one roof here at IPC APEX EXPO, who have paved the way in this industry and talk with them about the decisions they’ve made and the lessons they’ve learned has really been a great experience for me this early in my career.”

In 2018, IPC APEX EXPO will return to the San Diego Convention Center, February 27-March 1. Industry researchers, engineers and academics are invited to submit an abstract for consideration in next year’s technical conference or professional development courses in the online Call for Participation at www.IPCAPEXEXPO.org/cfp.

 

IPC Volunteers honoured for their contributions to the Electronics Industry at IPC APEX EXPO

 IPC presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.

For their significant contributions to the 2016-2017 IPC APEX EXPO Technical Program Committee, David Hoover, TTM Technologies, and Jeff Schake, ASM Assembly Systems, earned a Special Recognition Award.

For their leadership of the 2-16 Subcommittee that developed Amendment 1 to IPC-2581B, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology, Gary Carter, Thing Weaver Solutions, LLC and Karen McConnell, Northrop Grumman, earned a Committee Leadership Award. For their contributions to IPC-2581B, Amendment 1, Edward Acheson, Cadence Design Systems; Tomas Bergsten, Ericsson AB; Joseph Clark, DownStream Technologies, LLC; Larry Frost, Sanmina Corporation; Terry Hoffman, Cisco Systems Inc.; Ronny Kovartovsky, Frontline PCB Solutions; Humair Mandavia, Zuken USA Inc.; William Newhard, DownStream Technologies, LLC; James       Pierce, Axiom Electronics; Hemant Shah, Cadence Design Systems; Chris Shaw, Fujitsu Network Communications; John Vaughn, Fujitsu Network Communications; Steve Watt, Zuken USA Inc.; and Jamie Wise, WISE Software Solutions Inc., earned a Distinguished Committee Service Award.

For their leadership of the 7-31FT Technical Training Task Group that developed the certification and training program for IPC/WHMA-A-620C, Requirements and Acceptance for Cable and Wire Harness Assemblies, Gregg Owens, Millennium Space Systems and Debbie Wade, Advanced Rework Technology-A.R.T., earned a Committee Leadership Award. For their significant contributions to the certification and training program for IPC/WHMA-A-620C, Floyd Bertagnolli, STM – Service To Mankind and Craig Parker, STM – Service To Mankind, earned a Special Recognition Award. For their contributions to the IPC/WHMA-A-620C certification and training program, Shelley Holt, L-3 Communications; Sean Keating, Amphenol Limited (UK); George Millman, Raytheon Missile Systems; Agnieszka Ozarowski, BAE Systems; Richard Rumas, Honeywell Canada; and Zenaida Valianu, Celestica, earned a Distinguished Committee Service Award.

For their leadership of the 7-34T Technical Training Task Group that developed the certification and training Program for the IPC-7711C/7721C, Rework, Modification, and Repair of Electronic Assemblies, Daniel Foster, Missile Defense Agency and Zenaida Valianu, Celestica, earned a Committee Leadership Award. For their significant contributions to the certification and training program for IPC-7711C/7721C, Dorothy Cornell, Blackfox Training Institute and Jamie Noland, Blackfox Training Institute, earned a Special Recognition Award. For their contributions to the IPC-7711C/7721C certification and training program, Stephen Fribbins, Fribbins Training Services; Garry McGuire, NASA Marshall Space Flight Center; Norman Mier, BEST Inc.; Leo Lambert, EPTAC Corporation; John Vickers, Advanced Rework Technology-A.R.T.; and Debbie Wade, Advanced Rework Technology-A.R.T., earned a Distinguished Committee Service Award.

For their leadership of the 2-18h task group that developed IPC-1755, Conflict Minerals Data Exchange Amendment 2, Eric Straw, Rockwell Collins and Aidan Turnbull, BomCheckNet, earned a Committee Leadership Award. For their contributions to IPC-1755, WAM2, Kazuko Andersen, JEITA; Brenda Baney, B Cubed Consulting, Inc.; David Carnevale, Dolby Laboratories; Forrest Christian, Innovation Machine Ltd.; Bryan Fiereck, Intel Corporation; David Fitton, Diodes Incorporated; Randy Flinders, GreenSoft Technology Inc.; Shiho Ichimura, Panasonic; JEITA, Nikki Johnson, Total Parts Plus; Hiroshi Kobayashi, TDK; Chuck LePard, Hewlett-Packard; N. Nagaraj, Papros, Inc.; Manish Patel, Axon Circuit Inc.; David Pinksy, Raytheon; John Plyler, Blackberry; Michael Wurzman, RSJ Technical Consulting; Akimasa Yamakawa, Murata Manufacturing Co., ltd.; and Tolga Yaprak, iPoint Inc., earned a Distinguished Committee Service Award.

For their leadership of the 7-31f Task Group that developed IPC/WHMA-A-620C, Requirements and Acceptance for Cable and Wire Harness Assemblies, Bud Bowen, Winchester Electronics Division; Brett Miller, USA Harness Inc.; George Millman, Raytheon Missile Systems; and Richard Rumas, Honeywell Canada, earned a Committee Leadership Award. For their significant contributions to IPC/WHMA-A-620C, James Blanche, NASA Marshall Space Flight Center; Robert Cooke, NASA Johnson Space Center; Rick Hawthorne, TE Connectivity; Joseph Kane, BAE Systems Platform Solutions; Garry McGuire, NASA Marshall Space Flight Center; Scott Meyer, UTC Aerospace Systems; Gregg Owens, Millennium Space Systems; Zenaida Valianu, Celestica; Jonathon Vermillion, Ball Aerospace & Technologies Corp.; and Debbie Wade, Advanced Rework Technology-A.R.T., earned a Special Recognition Award. For their contributions to IPC/WHMA-A-620C, Bee Kar Ang, Honeywell Aerospace; Gerald Leslie Bogert, Bechtel Plant Machinery, Inc.; Daniel Foster, Missile Defense Agency; Symon Franklin, Custom Interconnect Ltd; Ben Gross, PRAIRIElectric; Catherine Hanlin, Precision Manufacturing Company, Inc.; Dave Harrell, ViaSat Inc.; Sharissa Johns, Lockheed Martin Missiles & Fire Control; Kathy Johnston, Raytheon Missile Systems; Leo Lambert, EPTAC Corporation; T. John Laser, L-3 Communications; Gary Latta, SAIC; Randy McNutt, Northrop Grumman Aerospace Systems; David Mitchell, Lockheed Martin Mission Systems & Training; Mary Muller, Crane Aerospace & Electronics; Agnieszka Ozarowski, BAE Systems; Robert Potysman, AssembleTronics, LLC; Erik Quam, Schlumberger Well Services; John Tinker, Teledyne Reynolds; and Sharon Ventress, U.S. Army Aviation & Missile Command, earned a Distinguished Committee Service Award.

For her leadership of the IPC E-22 Subcommittee that developed IPC-1071B, Intellectual Property Protection in Printed Board Manufacturing, Pat Stroman, Sparton Corporation, earned a Committee Leadership Award. For their contributions to IPC-1071B, Don Dupriest, Lockheed Martin Missiles & Fire Control; Dennis Fritz, SAIC; Crystal Schneider, Lockheed Martin Missiles & Fire Control; and Richard Snogren, Bristelcone LLC, earned a Distinguished Committee Service Award.

For his leadership of the E-21 Subcommittee that developed IPC-1072, Amendment 1, Intellectual Property Protection in Electronic Assembly Manufacturing, Dennis Fritz, SAIC, earned a Committee Leadership Award. For their contributions to IPC-1072, Amendment 1, Robert Cooke, NASA Johnson Space Center; Mahendra Gandhi, Northrop Grumman Aerospace Systems; Jennie Hwang, H-Technologies Group; Richard Snogren, Bristelcone LLC; Pat Stroman, Sparton Corporation; and Steve Vetter, NSWC Crane, earned a Distinguished Committee Service Award.

For their leadership of the IPC 4-35CN Corporate Social Responsibility and Sustainability in the Supply Chain in China Subcommittee that developed IPC-1401CN, Supply Chain Social Responsibility Management System Guidance, Bruce Klafter, Flextronics International and Peter Zhou, Huawei technologies Co., Ltd, earned a Committee Leadership Award.

For their leadership of the IPC 2-19a Task Group that developed IPC-1782, Standard for Manufacturing and Supply Chain Traceability of Electronic Products, Michael Ford, Mentor Graphics Corporation and Cameron Shearon,     AT&T Services, Inc., earned a Committee Leadership Award. For their contributions to IPC-1782, Gerald Leslie Bogert, Bechtel Plant Machinery, Inc.; Gary Carter, ThingWeaver Solutions, LLC; Kevin Dudley, Sanmina Corporation; Manon Dutil, Cogiscan, Inc.; Zac Elliott, Mentor Graphics; Bradley Fern, Entrust Datacard Corporation; Dennis Fritz, SAIC; Dennis Gagne, Juniper Networks; Karen McConnell, Northrop Grumman Corporation; Francois            Monette, Cogiscan Inc.; Cengiz Oztunc, DNZ Ltd.; Jan Pedersen, Elmatica AS; Keith Peterson, Missile Defense Agency; Lance Rist, Ristex; Brian Rubow, Cimetrix Inc.; Aimee Siegler, Benchmark Electronics, Inc.; Marco          van Oosterhout, Kulicke and Soffa; and Scott Wischoffer, Fuji America Corporation, earned a Distinguished Committee Service Award.

For their leadership of the D-11 Subcommittee that developed IPC-2223D, Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards, Mark Finstad, Flexible Circuit Technologies, Inc. and William Ortloff, Raytheon Company, earned a Committee Leadership Award. For their contributions to IPC-2223D, Lance Auer, Raytheon Missile Systems; Michael Beauchesne, BAE Systems; Scott Bowles, L-3 Fuzing and Ordnance System; Rachel Grinvalds, Rockwell Collins; John Leschisin, Minco Products, Inc.; Glenn Oliver, Raytheon Missile Systems; and Robert Sheldon, Pioneer Circuits Inc., earned a Distinguished Committee Service Award.

For his leadership of the D-33aa Task Group that developed IPC-6012DA, Automotive Applications Addendum to IPC-6012D, Jan Pedersen, Elmatica AS, earned a Committee Leadership Award. For their contributions to IPC-6012DA, Nancy Deng, Ford Motor Researching & Engineering; Laurent Nardo, Continental Automotive France SAS; Ralf-Michael Sander, Papst-Motoren GmbH & Company; Michael Schoening, Q-Products Enterprise Limited; Marcel Smeets, Viasystems Mommers BV; and Udo Welzel, Robert Bosch GmbH, earned a Distinguished Committee Service Award.

For their leadership of the B-11 3-D Electronic Packages Subcommittee that developed IPC-7091,Design and Assembly Process Implementation for 3D Components, Dudi Amir, Intel Corporation and Vern Solberg, Solberg Technical Consulting, earned a Committee Leadership Award. For their contributions to IPC-7091, Michael Carano, RBP Chemical Technology, Inc.; Marie Cole, IBM Corporation; Gerd Fischer, NASA Goddard Space Flight Center; Dennis Fritz, MacDermid Enthone Electronics Solutions; Reza Ghaffarian, Jet Propulsion Laboratory; Ife Hsu, Intel Corporation; Bruce Hughes, AMRDEC MS&T EPPT; Rajesh Kumar, TTM Technologies; Maurice LeBlon, AI Technologies, Inc.; Steven Martell, Sonoscan Inc.; Craig Mitchell, Tessera Technologies, Inc.; Richard Otte, PROMEX Industries, Inc.; Keith Peterson, Missile Defense Agency; Ray Prasad, Ray Prasad Consultancy Group; Raj Pulugurtha, Georgia Institute of Technology; Jagadeesh Radhakrishnan, Intel Corporation; and Mamoru (Mark) Takahashi, Asahi Glass Co., Ltd., earned a Distinguished Committee Service Award.

For their leadership of the IPC 5-22h Task Group that developed IPC-7530A, Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave), Ray Prasad, Ray Prasad Consultancy Group and Robert Rowland, Axiom Electronics, LLC, earned a Committee Leadership Award. For their contributions to IPC-7530A, Dudi Amir, Intel Corporation; Raiyomand Aspandiar, Intel Corporation; Paul Austen, Electronic Controls Design Inc.; Gerald Leslie Bogert, Bechtel Plant Machinery, Inc.; Gerd Fischer, NASA Goddard Space Flight Center; Mitchell Holtzer, Alpha Assembly Solutions; Ife Hsu, Intel Corporation; Jennie Hwang, H-Technologies Group; Michael Johnson, M/A-COM Technology Solutions, Inc.; Milea Kammer, Honeywell Aerospace; Leo Lambert, EPTAC Corporation; Ursula Marquez de Tino, Plexus Corporation; Jagadeesh Radhakrishnan, Intel Corporation; Chris Smith, Plexus Corporation; Vern Solberg,     Solberg Technical Consulting; and Udo Welzel, Robert Bosch GmbH, earned a Distinguished Committee Service Award.

For their contributions to the IPC 5-22jCN Solder Dross Reduction Chemicals Task Group that developed IPC-7535CN, Requirements for Solder Dross Reduction Chemicals, Jay Hardin, P. Kay Metal, Inc.; Murad Kurwa, GE Healthcare; Ahmer Qasim, Flextronics International; Joshua Tam, Jabil Circuit (GuangZhou) Ltd; and Joe Zhong, Jabil Circuit (GuangZhou) Ltd, earned a Distinguished Committee Service Award.

For their leadership of the 7-34 Subcommittee that developed IPC-7711/7721C, Rework, Modification and Repair of Electronic Assemblies, Daniel Foster, Missile Defense Agency and Bruce Hughes, AMRDEC MS&T EPPT, earned a Committee Leadership Award. For their contributions to IPC-7711/7721C, James Daggett, Raytheon Company; Patrick Kane, Raytheon System Technology; Gary Latta, SAIC; John Mastorides, Honeywell Aerospace; Gregg Owens, Millennium Space Systems; Martin Scionti, Raytheon Missile Systems; Zenaida Valianu, Celestica; Sharon Ventress, U.S. Army Aviation & Missile Command; Debbie Wade, Advanced Rework Technology-A.R.T., earned a Distinguished Committee Award.

For their contributions to the D-65 Subcommittee that developed IPC-9204, Guideline on Flexibility and Stretchability Testing for Printed Electronics, Neil Bolding, MacDermid Enthone Electronics Solutions and Weifeng Liu, FLEX, earned a Committee Leadership Award. For their contributions to IPC-9204, Len Allison, Engineered Materials Systems, Inc.; Don Dupriest, Lockheed Martin Missiles & Fire Control; Ken Gann, Lab Tech; MaryAlice Gill, Jabil Circuit, Inc.; Karen McConnell, Northrop Grumman Corporation, Haridoss Sarma, GO 2 Scout 4 R&T; and Mobin Yahyazadehfar, DuPont Engineering Polymers, earned a Distinguished Committee Service Award.

For their leadership of the 7-12 subcommittee that developed IPC-9241, Guidelines for Microsection Preparation, Randy Reed, R. Reed Consultancy LLC and Russell Shepherd, National Technical Systems – Anaheim, earned a Committee Leadership Award. For their contributions to IPC-9241, Denise Chevalier, Amphenol Printed Circuits, Inc.; Stefan Gerhold, Atotech Deutschland GmbH; Vicka Hammill, Honeywell Inc. Air Transport Systems; Chris Mahanna, Robisan Laboratory Inc.; and Joey Rios, Massachusetts Institute of Technology, earned a Distinguished Committee Service Award.

For his leadership of the 7-31bc A-610 Task Group that developed
IPC-A-610, Telecom Addendum, Darrin Dodson, Nokia, earned a Committee Leadership Award.

For his leadership of the 7-31m Task Group that developed IPC-A-640, Acceptance Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies, Robert Cooke, NASA Johnson Space Center, earned a Committee Leadership Award. For their significant contributions to IPC-A-640, Gerald Leslie Bogert, Bechtel Plant Machinery, Inc.; Robert Cooke, NASA Johnson Space Center; and Larry Johnson, Light Brigade, earned a Special Recognition Award. For their contributions to IPC-A-640, Richard Agard, SEPTA; Caroline Ehlinger, Rockwell Collins; B.J. Franco, Honeywell Aerospace; Symon Franklin, Custom Interconnect Ltd.; Stephen Fribbins, Fribbins Training Services; Mahendra Gandhi, Northrop Grumman Aerospace Systems; Kathy Johnston, Raytheon Missile Systems; Sean Keating, Amphenol Limited (UK); Gregory Manning, Ares Corporation; James McGrath, Lockheed Martin Mission Systems & Training; Randy McNutt, Northrop Grumman Aerospace Systems; Gregg Owens, Millennium Space Systems; Agnieszka Ozarowski, BAE Systems; Mel Parrish, Soldering Technology International; Darrell Sensing, BAE Systems; Brian Smith, Rockwell Collins; John Tinker, Teledyne Reynolds; Hector Valladares, Honeywell Aerospace; Debie Vorwald, Rockwell Collins; and Schuyler Williams, Lockheed Martin Missile & Fire Control, earned a Distinguished Committee Service Award.

For their leadership of the 5-22f Task Group that developed IPC-HDBK-001F with Amendment 1,Handbook and Guide to Supplement J-STD-001, Daniel Foster, Missile Defense Agency and Kathy Johnston, Raytheon Missile Systems, earned a Committee Leadership Award. For their contributions to IPC-HDBK-001F with Amendment 1, David Adams, Rockwell Collins; James Daggett, Raytheon Company; Charles Gamble, NASA Marshall Space Flight Center; Joseph Kane, BAE Systems Platform Solutions; Patrick Kane, Raytheon System Technology; John Mastorides, Honeywell Aerospace; Garry McGuire, NASA Marshall Space Flight Center; Scott Meyer, UTC Aerospace Systems; Gregg Owens, Millennium Space Systems; Pamela Petcosky, Lockheed Martin Mission Systems & Training; Sue Powers-Hartman, Killdeer Mountain Manufacturing, Inc.; Zenaida Valianu, Celestica; and Sharon Ventress, U.S. Army Aviation & Missile Command, earned a Distinguished Committee Service Award.

For their leadership of the 5-22as task group that developed J-STD-001FS with Amendment 1,Space Applications Electronic Hardware Addendum to IPC J-STD-001F with Amendment 1 Requirements for Soldered Electrical and Electronic Assemblies, Kathy Johnston, Raytheon Missile Systems and Garry McGuire, NASA Marshall Space Flight Center, earned a Committee Leadership Award. For their contributions to J-STD-001FS with Amendment 1, James Blanche, NASA Marshall Space Flight Center; Robert Cooke, NASA Johnson Space Center; James Daggett, Raytheon Company; Stepfan Hanigk, Airbus Safran Launchers; Joseph Kane, BAE Systems Platform Solutions; Gregg Owens, Millennium Space Systems; Richard Rumas, Honeywell Canada; James Saunders, Raytheon Company; Bhanu Sood, NASA Goddard Space Flight Center; Jonathon Vermillion, Ball Aerospace & Technologies Corporation; and Ge Wang, Northrup Grumman Aerospace Systems, earned a Distinguished Committee Service Award.

Photos from the IPC APEX EXPO committee awards ceremonies are available athttps://flic.kr/s/aHskRK7mMp. For more information on these awards or the award recipients, contact Sandy Gentry, IPC communications manager, at +1 847-597-2871.       

 

 

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