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23 September 2016

IPC Releases New Topic Brief on International Trade Agreements

Trade Agreements’ Impact on the Electronics Industry, released last week by IPC – Association Connecting Electronics Industries®, is a topic brief that explores the details of the Transatlantic Trade and Investment Partnership (T-TIP) and the TransPacific Partnership (TPP). In particular, the brief addresses the potential impacts of these trade agreements on the various segments and regions of the global electronics industry.

Trade Agreements’ Impact on the Electronics Industry is designed to help the reader best comprehend the information included in the trade agreements. The topic brief provides a historical perspective of U.S. trade agreements while summarizing complex issues and topics. In addition, actionable content is included in a way to improve organizations within the electronics industry, as well as increase the efficiency of their employees.

“We are very excited to assist the electronics industry with this complex and multifaceted issue,” said John Mitchell, IPC president and CEO and primary author of the topic brief. “Good or bad, these international trade agreements will have an impact on many of our members’ businesses. As an association, it is our job to help the electronics industry understand how international trade and in this instance TPP and T-TIP could potentially affect their organizations.”

The topic brief is currently available for purchase from the IPC Online Store.

 

 

IPC Invites Industry Leaders to Submit Poster Abstracts for

IPC APEX EXPO 2017 in San Diego

 IPC nvites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 15, 2017, and will be displayed throughout the event, offering additional visibility.

Technical poster presentations are being sought on all relevant electronics topics, including design, materials, assembly, processes and equipment, especially:

• 3D Printing in Electronics Manufacturing• Automation in Electronics Manufacturing

• Adhesives

• Advanced Technology

• Area Array/Flip Chip/0201 Metric

• Assembly and Rework Processes

• BGA/CSP Packaging

• Black Pad and Other Board Related Defect

Issues

• BTC/QFN/LGA/MLF Components

• Business & Supply Chain Issues

• Cleaning

• Conformal Coatings

• Corrosion

• Counterfeit Electronics

• Design

• Electromigration

• Electronics Manufacturing Services

• Embedded Passive & Active Devices

• Environmental Compliance

• Graphene in Electronics Manufacturing

• Lean Six Sigma

• LED Manufacturing

• Failure Analysis

• Flexible Circuitry

• HDI Technologies

• Head-on-Pillow

• Board and Component Warpage• High Speed, High Frequency & Signal

Integrity

• Industry 4.0

• Lead-Free Fabrication, Assembly &

Reliability

• Miniaturization

• Nanotechnology

• Optoelectronics

• Packaging & Components

• PCB Fabrication

• PCB and Component Storage & Handling

Performance

• Quality & Reliability

• Photovoltaics

• PoP (Package-on-Package)

• Printed Electronics

• Reshoring

• RFID Circuitry

• Robotics

• Soldering

• Surface Finishes

• Test, Inspection & AOI

• Tin Whiskers

• 2.5-D/3-D Component Packaging

• Underfills

• Via Plugging & Other Protection

• Wearables

An abstract of up to 300 words summarizing technical and previously unpublished work covering case histories, research and discoveries should be submitted by October 22, 2016, to www.IPCAPEXEXPO.org/CFPosters.

For more information about poster participation or other opportunities to participate in IPC APEX EXPO, contact Jasbir Bath, IPC technical conference director, at JasbirBath@ipc.org or Toya Richardson, IPC technical programs coordinator, at ToyaRichardson@ipc.org.

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