MEMBER LOGIN

NEWS

News from WECC Members

1 April 2016

IPC Elects New Officers and Members to IPC Board

March 16, 2016 — The Nominating and Governance Committee of the IPC Board of Directors presented nine candidates for election at the IPC Annual Meeting on March 15, held in conjunction with IPC APEX EXPO 2016 at the Las Vegas Convention Center. Three candidates were elected as Board officers and will serve two-year terms. Three were elected as new Board members and three were selected for term renewal. All six Board members will serve a four-year term.

The newly elected Board officers are:

  • Chairman of the Board – Joe O’Neil, Owner, OAA Ventures
  • Vice Chairman – Mikel Williams, President and CEO, Targus
  • Secretary/Treasurer – Shane Whiteside, Executive Director, AvaSure

The newly elected Board members are:

  • First-term director – Tom Edman, President and CEO, TTM Technologies
  • First-term director – Robert Feuerstein, Director, Head of CEP MT, Continental Automotive, GmbH
  • First-term director – Steve Pudles, Origo  Acquisition Company
  • Term renewal – Tony Zhou, President, RayVal (Suzhou) Technologies Co. Ltd.
  • Term renewal – Mike Carano, Vice President, Technology and Business Development, RBP Chemical Technology
  • Term renewal – Bob Neves, Chairman and Chief Technology Officer, Microtek (China) Laboratories

“IPC is privileged to have these directors and officers added to our current slate of Board members. All are active contributors to IPC initiatives and we look forward to their continued contributions to advancing IPC and industry,” said John Mitchell, IPC president and CEO.

In addition to holding Board elections, IPC honored outgoing Board chairman, Marc Peo, president, Heller Industries.  Peo will serve as the Immediate Past Chair on the IPC Board of Directors Executive Committee for a two-year term.

For additional information on IPC’s Board of Directors including bios on newly elected Board members, contact Sandy Gentry, IPC communications manager, at SandyGentry@ipc.org.

 


North American PCB Sales Rebound

IPC Releases PCB Industry Results for February 2016

IPC — Association Connecting Electronics Industries® announced today the February 2016 findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Sales rebounded in February, outpacing orders and reducing the book-to-bill ratio to 1.02.

Total North American PCB shipments in February 2016 came in 8.9 percent above the same month last year, bringing the year-to-date growth rate up to 3.6 percent. Compared to the preceding month, February shipments were up 10.1 percent.

PCB bookings increased 2.7 percent year-on-year. This growth rate was not quite high enough to cancel out the preceding month’s negative year-on-year order growth, but it brought year-to-date order growth up to -0.5 percent. Orders in February 2016 were down 2.3 percent from the previous month.

“The February rebound in sales was the best news this month, following flat growth in 2015 and a slump in January,” said Sharon Starr, IPC’s director of market research. “Also, the decrease in the book-to-bill ratio is not bad news, because it was driven by strong sales growth, and it remained in positive territory, which is an indicator for continued sales growth in 2016,” she added.

Detailed Data Available

The next edition of IPC’s North American PCB Market Report, containing detailed February data from IPC’s PCB Statistical Program, will be available by the end of next week. The monthly report presents detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, military and medical market growth, demand for prototypes, and other timely data. This report is available free to current participants in IPC’s PCB Statistical Program and by subscription to others. More information about this report can be found atwww.ipc.org/market-research-reports.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to six months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio at the end of each month. Statistics for the current month are normally available in the last week of the following month.

 

Long-time IPC Volunteer, Patricia Goldman Inducted Into

IPC Hall of Fame

In recognition of her extraordinary contributions to IPC and the electronics industry, Patricia (Patty) Goldman, managing editor, I-Connect007, was honoured with the IPC Raymond E. Pritchard Hall of Fame Award. Presented at IPC APEX EXPO® at the Las Vegas Convention Center, the IPC Hall of Fame Award represents IPC’s highest level of volunteer recognition.

For more than three decades, Goldman has donated countless hours to IPC and her list of IPC achievements is vast. She has served as chairman of IPC’s Process Effects Subcommittee, chair of the Process Control Committee, chair of the Woven Glass Reinforcement Task Group and has been an active participant on numerous other committees including the Video Steering Committee and the Technical Program Committee.

Goldman is a current and active member on the following standards committees: 3-11, 3-12E, 4-10, 5-32E and 8-41.

She received the IPC President’s Award in 1984 and served as chair of the TAEC from 1998–2000. Goldman is author of a number of technical papers on subjects such as bondable gold, pink ring, direct metallization, electrophoretic photoresist, and flat glass for improved signal integrity.

“IPC is privileged to have Patty as such an active member of so many committees and deeply experienced with technical issues that impact our industry,” said John Mitchell, IPC president and CEO. “This Hall of Fame tribute is in recognition of all her years of diligent volunteer work, helping to advance the electronics industry and IPC.”

For more information on the IPC Hall of Fame and other awards presented at IPC APEX EXPO, contact Sandy Gentry, IPC communications manager, at +1 847-597-2871.

 

IPC Honours BAE Systems and Shengyi Technology Co., Ltd. with Corporate Recognition Awards

IPC – Association Connecting Electronics Industries® bestowed its highest corporate honours to two member companies, BAE Systems and Shengyi Technology Co., Ltd. During a luncheon at IPC APEX EXPO®, the IPC Stan Plzak Corporate Recognition Award was presented to BAE Systems and the IPC Peter Sarmanian Corporate Recognition Award to Shengyi Technology Co. Ltd.

Named after a former IPC Board Chairman who was a founding member of the Electronics Manufacturing Services Industry Management Council, the Stan Plzak Award recognizes an IPC member company in the electronics assembly industry that has taken the initiative to actively contribute to enhancing the industry while demonstrating support of IPC though participation in technical and/or management programs.

BAE Systems has been a member since 1996 and has made a big impact on IPC. More than two dozen of its staff members are active on 40 technical committees ranging from assembly and cleaning and coating to product assurance and printed electronics. In addition to standards committee participation, BAE Systems takes IPC training and certification very seriously. The company has more than 3,000 CIT, CIS, CID, CID+, and EMS certifications across all BAE locations.

The IPC Peter Sarmanian Corporate Recognition Award was named for former IPC Board Chairman Peter Sarmanian. This corporate award recognizes an IPC member corporation in the printed board industry that has taken a leadership role and made contributions to the industry while demonstrating support of IPC through participation in technical and/or management programs.

Shengyi Technology Co. Ltd. has been an IPC member since 1995, and since that time, the company has devoted many staff members to IPC standards development. Currently, more than a dozen Shengyi Technology employees provide leadership and technical expertise on 14 standards development committees dedicated to topics ranging from materials and performance to supplier declaration and technology roadmaps. The company has several Certified Instructor Specialists on staff at its facilities in Suzhou and Dongguan, China.

“For many years, both BAE Systems and Shengyi Technology Co., Ltd. have consistently provided staff resources to standards development and other committee initiatives. IPC as an association is privileged to have them in our membership,” said John Mitchell, IPC president and CEO.

For more information on IPC’s Corporate Recognition Awards and other honours presented at IPC APEX EXPO, contact Sandy Gentry, IPC communications, manager, at SandyGentry@ipc.org or +1-847-597-2871.

 

IPC Committee Works to Develop Shop Floor Communication Standard

On Wednesday, March 16, at IPC APEX EXPO, IPC’s 2-13 Shop Floor Communications Subcommittee brought together leading software developers, machine vendors, assembly equipment manufacturers and their customers to work on development of a new IPC standard to meet the current and future needs of industry that will fill a gap identified by the group. This new standard will provide uniformity of data protocols that will allow ease of machine to machine communication.

“The subcommittee is firmly committed to developing the standard and is also working to provide an easy-to-understand definition of Industry 4.0 and its significance,” said Subcommittee Chairman Jason Spera, CEO of Aegis Software. “The group is working to identify additional committee leaders from the customer and machine side.”

“Machine vendors want to engage quickly and all parties agree that a replacement for the current IPC-2541, Generic Requirements for Electronics Manufacturing Shop-Floor Equipment Communication Messages (CAMX) is needed and demanded by industry and speed of execution is critical,” said David Bergman, IPC vice president of standards and training. “During the meeting two commercial initiatives were presented, and based on those two presentations, the subcommittee realized that several licensing and intellectual property issues need to be resolved before the new standard can progress. The subcommittee also determined that the IP cannot be controlled by any entity other than IPC, nor a revenue generator for any company contributing to the standard.”

For more information on this evolving standard and 2-13 subcommittee activities, contact Bergman, at DavidBergman@ipc.org or +1 847-597-2840.

 

 

NEWS FROM THE JPCA

Mr Kunio Takahara, a member of the staff of JPCA, has written to EIPC and has offered the facility of running news from EIPC members in the JPCA publications and on their website.

If this is of interest to you, please contact me – johnh@grantlings.com – and I will forward material and files.

The news items will appear as half-page A5 in JPCA NEWS.

Titles shall be no more than 12 words, and text no more than 200 words. Pictures as JPGs, please.

 

Many thanks

Kind regards

John Ling

Editor – EIPC Speednews

Related Stories

EIPC Events view all events

Publications view all publications

  • WECC Report 2017

    By KWestenberg@eipc.org

    WECC Global PCB Production Report For 2017 FREE of charge EIPC membership service A Product of the Partnership among the WECC Member Associations on Behalf of their Members in the Electronic Circuits Industry Worldwide

  • Proceedings EIPC 50th Anniversary Conference Dusseldorf

    By KWestenberg@eipc.org

    Proceedings 50th Anniversary conference 2018

Industry Directory view directory

  • Cicor Group

    www.cicor.com

    Cicor is a globally active group of leading companies in the electronics industry. The group’s companies provide complete outsourcing services and a broad range of technologies for the manufacture of highly complex PCBs, 3D-MID solutions, hybrids circuits, electronic modules, plastic injection molding and box-building.

  • Isola Group

    www.isola-group.com

    Corporate Responsibility. The responsible stewardship of the environment and sustainable business practices is important to long-term success. Committed to operating our business in a manner that creates better social, economic and environmental outcomes for all those involved in the electronics industry.

SITEMAP FEEDBACK

Please provide some more details

FIND OUT MORE

Please login or register

Layer-70

EIPC membership has many advantages, both financially and in services. Such as:

REGISTER NOW

You must be a member to view this content

Layer-70

EIPC membership has many advantages, both financially and in services. Such as:

REGISTER NOW

Please Login / Register

IM NOT REGISTERD TO EIPC
IM REGISTERD TO EIPC

Please provide some more details

Please provide some more details

Thank you!

An EIPC staff member will contact you soon to arrange payment.

Please fill in the form

EIPC will send an invoice to you through email and discuss your yearly fees.