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News from the USA

15 February 2018

Ventec to showcase Thermal Management Solutions and latest Laminate Technology at APEX 2018 
Thermal Management and Signal Integrity will be the focus for Ventec International Group, a world leader in the production of insulated metal substrates, thermally conductive polyimide & high reliability laminates and prepregs, at this year’s APEX show in San Diego (27th February – 1st March). On booth #818 the Ventec team will be on hand to demonstrate unique laminate & prepreg capability across a very wide range of applications and budgets. Show-highlights will feature the latest products from Ventec’s tec-thermal© and tec-speed© ranges as well as the launch of the much-anticipated micro eBook “The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates”.

Ventec is further strengthening its position as a global leader in technology for high performance thermal management and signal integrity materials at the San Diego Convention Center on booth #818. Show-highlights include:

APEX-debut: VT-5A2 highest performance thermally conductive laminate material
Ventec’s highest performance thermally conductive laminate material so far will make its APEX-debut: VT-5A2 offers a polymer matrix that is fully compatible with Ventec laminates, epoxy or polyimide-based materials including tec-speed, making it the ideal choice for the manufacture of hybrid multilayer low-loss constructions. VT-5A2 sets itself apart by offering highest performance thermal conductivity 8 times that of FR4 at 2.2 W/m.K, a high Tg of 190°C, best in class thermal performance (T260 >60 Minutes, T288 >30 Minutes and T300 >15 Minutes) and MOT of 150°C. VT-5A2 is lead-free assembly compatible, fulfils RoHS and WEEE requirements and complies with UL94 V0.

tec-speed© high-speed/low-loss materials
The tec speed brand unites one of the most comprehensive range of products in high speed/low loss PCB material technology. By using an ultra-low Dk material with Dk values between 2.3 and 2.8 lower losses, lower system power requirements and with it, the delicate balance of performance and cost can be achieved. Higher layer counts on backplanes, daughter cards and hand-held’s are made possible in a smaller footprint by having smaller layer-to-layer separation without sacrificing trace width. Every tec speed product provides technological innovation, high performance and quality to customers to perfectly meet their needs.

Presenting space and aerospace PCB material capability
Ventec manufactures its polyimide and thin-core laminates using specially designed treaters with multiple stage filtration systems and 100% Automated Optical Inspection (AOI) for prepreg FOD-control. Most recently Ventec was the first and only laminator to receive IPC-4101 Qualified Products Listing. The IPC’s Validation Services Program qualified VT-90H and VT-901 to specification sheet 41 of IPC-4101E (Specification for Base Materials for Rigid and Multilayer Printed Boards), putting Ventec in a market-leading position within the military, space and aerospace electronics supply chain.

VT-90H (UL-94 HB) and VT-901 (UL-94 V0) are exceptional material solutions for high reliability ML rigid and flex rigid PCBs for use in thermally challenging environments, with high Td (VT-901=395, VT-90H=408), a Tg of 250oC and Low-Axis CTE (50). Both polyimide materials provide the extremely high reliability performance particularly demanded by military and aerospace as well as downhole drilling and similarly challenging applications.

Micro e-book promotion: “The Printed Circuit Designer’s Guide to…™ Thermal Management with Insulated Metal Substrates”
Launched in time for APEX, “The Printed Circuit Designer’s Guide to…™ Thermal Management with Insulated Metal Substrates” by Ventec’s Didier Mauve and Ian Mayoh in collaboration with I Connect007 provides the PCB designer with the essential information required to understand the thermal, electrical, and mechanical characteristics of insulated metal substrate (IMS) laminates, in order to select and specify the most appropriate material for a particular thermal management application, and to achieve a reliable and cost-effective design. A download link will be provided to booth-visitors for a free e-copy of the guide.

All these and more can be seen at the Ventec APEX booth #818.

Further information about Ventec’s solutions and the company’s wide variety of products, is available at www.venteclaminates.com and/or by downloading the Ventec APP.

 

 

Atotech to present and exhibit at the IPC APEX Expo 2018

 The company will exhibit at the IPC APEX Expo, which will be held from February 27 to March 1, 2018, at the San Diego Convention Center in San Diego, USA.

Sandra Heinemann, Product Manager for Surface Finishing at Atotech Deutschland GmbH, will discuss how detrimental production concerns related to soldermask residues can be solved by simple operational adaptations. The presentation will be held as part of the IPC Technical Conference Session on PCB Fabrication and Materials on February 27 from 3:30 pm to 5:00 pm.

In her presentation, Sandra will focus on the chemical characteristics of soldermasks and how they can help to predict or identify potential issues before they occur in the selective finishing step of the PCB manufacturing process. She will also discuss the potential of a soldermask to react to common yield hiking practices like UV bumping and oven curing. The results found will help fabricators to ensure maximum yields.

The Atotech Team of experts at booth #433 in hall E is looking forward to discuss this or any other current or upcoming production challenge or trend. This year’s Atotech product features include: 

  • PallaBond®, a direct pure EPAG for soldering, gold and copper wire bonding
  • Inpulse® 2 THF, for superior copper deposition in through vias
  • NovaBond® IT, a non-etching adhesion promoter for advanced packaging substrates and
  • Printoganth® TP1, a high throw electroless copper process

For more information about Atotech or its product offering, please visit www.atotech.com

or contact the North American sales team at: usainfo@atotech.com

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