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4 April 2017

Two Webinars Will Preview the 2017 iNEMI Roadmap

Asia Webinar is April 6;

North America & Europe is April 7

The International Electronics Manufacturing Initiative (iNEMI) have announced that two webinars are scheduled to review highlights of the 2017 iNEMI Roadmap.

The first webinar, scheduled for April 6, will review the new Internet of Things (IoT) product sector chapter and the Packaging & Component Substrates chapter. The second webinar (April 7) will also review the IoT chapter plus the Sustainable Electronics chapter.

Both webinars will provide an overview of this latest roadmap and discuss general trends. iNEMI’s latest roadmap contains 28 chapters (the largest to date) and includes — for the first time — a chapter on IoT.

“This roadmap is a result of the contributions of approximately 500 individuals from at least 22 countries who represent more than 350 corporations, consortia and government agencies,” said Chuck Richardson, director of roadmapping for iNEMI. “The first seven chapters of the roadmap identify the technology needs of seven key product sectors. The remaining 21 chapters identify technology trends, focusing on the key technology capabilities and developments anticipated and required within the electronics manufacturing supply chain to meet those product needs over the next 10 years.”

The 2017 Roadmap is expected to go on sale in April, and is currently available online to iNEMI members.

 Registration

Both webinars are open to industry and registration is free. For additional information and registration: http://community.inemi.org/content.asp?contentid=539

About iNEMI

The International Electronics Manufacturing Initiative’s mission is to forecast and accelerate improvements in the electronics manufacturing industry for a sustainable future.  This industry-led consortium is made up of approximately 90 manufacturers, suppliers, industry associations and consortia, government agencies and universities.  iNEMI roadmaps the needs of the electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps (both business and technical), and stimulates standards activities to speed the introduction of new technologies.

The consortium also works with government agencies, universities and other funding agencies to set priorities for future industry needs and R&D initiatives.  iNEMI is based in Herndon, Virginia (near Washington, D.C.), with regional offices in Shanghai, China; Limerick, Ireland; and Tokyo, Japan.  For additional information about iNEMI, go to http://www.inemi.org

 

 

HDP User Group New Project Starts

HDP User Group announces the start of the Better CAF Acceleration Equation project and the High Frequency Loss from Copper Topology projects.  Following are descriptions of the new projects and how to join.

 Better CAF Acceleration Equation

Classic CAF (Conductive Anodic Filamentation) is a two-step process, firstly the creation of a pathway by hydrolysis followed by electrochemical filament growth. Where there is no pathway there can be no CAF, hence existing acceleration factor equations which model the process as a single step are clearly incorrect. The project will determine a better acceleration factor equation for CAF and quantify the effects of Voltage, Temperature and Humidity hopefully enabling shorter testing time for CAF material qualification.

You can join the project by going to the project page on the HDP website: http://hdpug.org/better-caf-acceleration-equation, or contacting the project facilitator Alun Morgan, alunm@hdpug.org

High Frequency Loss from Copper Topology

The recently completed Smooth Cu Si project suggested a difference in the X versus Y axis topography of the drum side of the copper foil after some treatments could affect insertion loss. This project will delve into the question of how this copper directionality or topography can affect insertion loss and evaluate the level of this loss.

You can join the project by going to the project page on the HDP website: http://hdpug.org/high-frequency-loss-copper-topology, or contacting the project facilitator John Davignon, johnd@hdpug.org

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