News from the USA

7 February 2017

Ventec International Expands USA Manufacturing Capacity with Investment in New Equipment

Ventec International Group has increased the manufacturing capacity at its Chicago facility (700 Lee Street, Elk Grove Village, IL) with major investment into new state-of-the-art equipment for laminate/prepregs as well as its newest ranges of PCB base-materials including complementary products such as flex- & rigid-flex circuit board materials, back-up, entry & routing materials, foils and coatings.

To capture growth opportunities in prepreg markets, which are driven by particular demand from high reliability, military and aerospace applications, a Pasquato TE 15 prepreg slitter/sheeter from Italy has been installed. At the same time, cooler storage capacity has been doubled and provides ‘storage 1’ conditions of below 5oC for prepreg materials. Prepreg vacuum sealing capacity has also been doubled with the addition of a dedicated vacuum packer.

For cut-to-size back-up and entry materials, further cutting capacity is provided through the addition of a Kitagawa Diamond Blade Saw alongside the existing Yow Shi Diamond Blade Saw for laminate. Two Excellon Mark V Driller/Router Machines – one for tooling prepreg and one for tooling back-up and entry – have been added alongside the existing Excellon IV Drill machine, adding drilling capacity to allow for materials to be supplied with tooling holes where required. Having two saws, additional drilling capability, a new shrink wrap packaging machine dedicated to packaging back-up and entry materials as well as a second delivery vehicle all in one location, offers customers a unique advantage through fast turn-around and quick-delivery material sourcing.

Jack Pattie, President of Ventec’s US operation commented: “Ventec is continuing its phased and strategic investment plan across our global network of service centres. This latest investment in our Chicago facility enables our US customers to enjoy one single quick-turn access point to an extraordinary portfolio of prepregs and complementary products & services today.”

For more information about Ventec’s solutions and the company’s wide variety of products, please visit and/or download the Ventec APP.


Affordable Bench-Top X-ray Inspection 

JewelBox Systems are available in a variety of configurations and cabinet sizes.

The Ultra Compact - a full feature microfocus x-ray machine small enough to fit on a desk or in a lab.

The JewelBox 70T and 90T Systems - Can accommodate up to an 18″ x 16″ panel and superb for use in production or process development.

The JewelBox Oversize - Includes a larger x-ray cabinet to accommodate a 24″ x 22″ panel while maintaining a compact footprint.

The JewelBox X-ray Systems offer up to 500x geometric and 2,000x electronic magnification and are available with 5, 10 or 30 micron focal spot x-ray tubes.

They provide x-y-z movement, 360 degree rotation and 45 degree tilt. A full line of image processing software is available including our GTI-5000 with BGA analysis, QFN and LED Void Measurement.

All Glenbrook systems employ our patented, award winning XRTV x-ray camera now enhanced with Crystal X for superior imaging and contrast. These systems offer unsurpassed reliability.

Click Here to see our JewelBox Product Video.

Glenbrook Technologies has over 2,500 installations in 54 countries throughout the world. We have offices in the US, Hong Kong, China and Germany.

Click here to contact Glenbrook or call 800-600-8866.



Atotech’s sub 20µm universal final finish solution PallaBondat the IPC APEX Expo 2017

At IPC APEX Expo 2017, booth #3651, Atotech is going to exhibit its revolutionary final finish PallaBond. This novel nickel free final finish is truly fine line capable and high frequency friendly. It is also bio-compatible due to the omission of phosphor. PallaBond represents the future in terms of technological capability.

Another highlight will be our paper presentation on “Soldering Immersion Tin” and its importance for the automotive industry. The paper will be presented by Rick Nichols, Global Product Manager Selective Finishing, and proofs that i-Sn can provide a reliable solderable finish with a long shelf-life and compatibility to realistically challenging production environments. Meet him in Session S31 on Thursday, February 16, from 9 to 10 am

PallaBond is a direct electroless palladium / autocatalytic gold surface finish and allows the direct deposition of palladium on copper. It has been designed to achieve maximum fine feature resolution and definition whilst enabling high frequency design. The phosphor and nickel free final finish is optimized to operate at an overall thickness of approximately 200 nm, ideal for very fine lines and spaces. The process enables wire bonding with Cu, Cu Pd, Au and Ag. It is compatible with many new base materials and soldermask types owing to its short deposit time and low temperature needs.

Atotech is one of the world’s leading manufacturers of specialty chemicals and equipment for the printed circuit board, IC-substrate and semiconductor industries. Visit Atotech at IPC APEX Expo 2017, booth #3651, to discuss the PallaBond or Stannatech processes, or just pass by to learn more about our grant portfolio for market leading products, technologies, and services. Product experts will be available to you in San Diego, USA, from February 14 to 16, 2017.
Atotech Deutschland GmbH

Erasmusstraße 20

10553 Berlin, Germany

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