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31 May 2018

Ventec Showcase Latest PCB Material Technology Innovations at JPCA, Japan
May 31, 2018 – Ventec International Group Co., Ltd. (6672 TT), a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, will showcase its latest PCB material technology innovations at the JPCA show, which is taking place at the Tokyo Big Sight East Hall from June 6-8 in Japan. The Ventec technology team will be on hand on booth #7B-32 showcasing unique laminate & prepreg capability solutions including the latest tec-speed 20.0 material – a Dk 3.48 ceramic-filled hydrocarbon thermoset material designed for high frequency applications.

Didier Mauve (Global Account Manager OEM Technology), Bill Wang (Technical & Quality Director) and Will Zhang (Staff Engineer) will be at JPCA to demonstrate the company’s firm commitment to the Japanese market and further strengthen its position as a global leader in technology for high performance thermal management and signal integrity materials.

Show-highlights include:

tec-speed 20.0 – No more compromises – performance, price & availability
tec-speed 20.0 (VT-870) combines unrivaled high frequency performance (Dk 3.48 / Df 0.0037), superior loss characteristics and the highest reliability with fast availability and efficient delivery through Ventec’s fully controlled and managed global supply chain and technical support-network. tec-speed 20.0 is designed for the world’s most demanding high frequency Printed Circuit Board applications such as cellular base station antennas, power amplifiers, LNB for broadcast satellites, automotive radar and RFID.

VT-5A2 – highest performance thermally conductive laminate material
VT-5A2 offers a polymer matrix that is fully compatible with Ventec laminates, epoxy or polyimide-based materials including tec-speed, making it the ideal choice for the manufacture of hybrid multilayer low-loss constructions. VT-5A2 sets itself apart by offering highest performance thermal conductivity 8 times that of FR4 at 2.2 W/m.K, a high Tg of 190°C, best in class thermal performance (T260 >60 Minutes, T288 >30 Minutes and T300 >15 Minutes) and MOT of 150°C. VT-5A2 is lead-free assembly compatible, fulfils RoHS and WEEE requirements and complies with UL94 V0.

VT-4B Series IMS – Versatile choice of formable substrates, selective dielectric, conductivity from 1.0 to 10.0 W/m.K
For superior thermal dissipation of an insulated metal substrate (IMS), VT-4B series materials offer the perfect performance and properties. VT-4B1 is designed for bending and forming. The tiny minimum radius eases fitting in tight spaces, for an elegantly engineered assembly. The extremely flexible dielectric will not crack or peel. Thermal conductivity 1.0 W/m.K, for minimum Zth 0.078°C*in2/W. From VT-4B3 to VT-4B9, the family provides a broad choice of thermal performance. 3 W/m.K to 10.0 W/m.K, and minimum Zth from 0.026°C*in2/W to 0.0078°C*in2/W satisfy demanding applications: LED lighting, high power-density converters, power supplies, automotive lighting and controls. For direct-to-metal connection of electrically isolated heat sources, VT-4B5SP selective preference substrates ensure maximum thermal efficiency and place dielectric insulation only where needed.

VT-901 (IPC QPL Listed) – Substrate for superb stability and performance under extreme loads
Where mechanical strength and high-temperature stability are critical, VT-901 polyimide substrate has high flex strength, high glass temperature (Tg), low z-axis CTE, and long T260 and T288 times – to maintain dimensional stability and integrity even under harsh loads. VT-901 is a safe non-MDA formula, with low outgassing tested and approved by NASA, available as laminate or prepreg. Ventec’s proprietary resin system is produced entirely in-house, giving ultimate supply-chain security and quality assurance. Outstanding electrical performance offers high resistivity for electrical isolation, and resistance to arcing, tracking, and dielectric breakdown. Low dielectric constant (Dk) and dissipation factor (Df) ensure excellent signal integrity for computing and communications.

All these and more can be seen at the Ventec JPCA booth #7B-32.

For more information about Ventec’s solutions and the company’s wide variety of products, please visit www.venteclaminates.com.

 

 

IPC adds /40 to Ventec International Group

IPC-4101 Qualified Products Listing

Ventec International Group Co., Ltd. (6672 TT), a world leader in the production of insulated metal substrates, thermally conductive polyimide & high reliability laminates and prepregs, is delighted to announce that its IPC-4101 Qualified Products Listing (QPL) has been extended to now include /40.

The IPC’s Validation Services Program therefore qualifies VT-90H and VT-901 to specification sheets 40 and 41 of IPC-4101E, Specification for Base Materials for Rigid and Multilayer Printed Boards. An intensive two-day audit was completed where the manufacturing practices, test methods and conformance requirements of IPC-4101 were reviewed.

Ventec met or exceeded the IPCs Validation Services QPL requirements for producing base materials used by printed circuit board manufacturers in the electronics industry. Ventec is proud to add further specifications to its listing as an IPC-4101 trusted source capable of manufacturing in accordance with industry best practices.

VT-90H (UL-94 HB) and VT-901 (UL-94 V0) are exceptional material solutions for high reliability ML rigid and flex rigid PCBs for use in thermally challenging environments, with high Td (VT-901=395, VT-90H=408), a Tg of 250oC and Low-Axis CTE (50). Both polyimide materials provide the extremely high

Mark Goodwin, COO USA & EMEA of Ventec International Group commented: “The IPC Qualified Product Listing (QPL) of our polyimide laminate and prepreg provides an independent endorsement of the quality of our production controls and materials for use in high reliability mil/aero applications. The IPC QPL is a trusted reference list for the entire electronics supply chain and we are delighted to be the first copper clad laminate manufacturer to have a polyimide material added to the validation services listing by meeting the requirements of both the rigorous facility audit and the qualification testing program at an independent test laboratory. We are fully committed to consistently meet and exceed the strict requirements of industry standards such as IPC-4101E.”

IPC’s Validations Services QPL/QML Program was developed to promote supply chain verification. It also provides auditing and certification of electronics companies’ products and identifies processes which conform to IPC standards.

” Ventec has differentiated itself from the competition in the polyimide market by becoming part of IPC’s global network of trusted industry sources,” said Randy Cherry, IPC director of Validation Services. “We are pleased to recognise Ventec for becoming a trusted supplier conforming to IPC-4101E.”

For more information about IPC’s Validation Services QPL/QML Program, visit www.ipcvalidation.org or contact Randy Cherry at RandyCherry@ipc.org or +1 847-597-2806.

For more information about Ventec’s solutions and the company’s wide variety of products, please visit www.venteclaminates.com.

About Ventec International Group

With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry.

 

For more information, visit www.venteclaminates.com

 

Institute of Circuit Technology

ICT ANNUAL SYMPOSIUM

THE 2018 ICT ANNUAL SYPOSIUM WILL BE HELD ON THE 5TH JUNE 2018 AT THE NATIONAL MOTOR MUSEUM IN BEAULIEU

Free to Members and Guests

THE THEME WILL BE CONTROLS FOR DIGITAL IMAGING.

1) Professor Andy Cobley, ICT Chairman will give the opening remarks and an update on the MATUREOLIFE project on wearable electronics
2) Andy West of Loughborough University will give the Keynote
3) Neil Chamberlain of Polar Instruments will speak on ‘Fast and Fine’ The signal

Integrity challenges of fine lines and high speed signalling
4) Mutracz will deliver a complimentary presentation from a joint project
5) Mr Michel van den Heuvel from Ucamco-Ledia will present on Digital Equipment
6) Orbotech will also present on Digital Equipment
7) Chris Wall of Electrapolymers will discuss ink jet as a form of direct imaging

SUPPORTED BY POLAR INSTRUMENTS

TABLETOPS AVAILABLE

Enquiries to :-  bill.wilkie@instct.org

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