MEMBER LOGIN

NEWS

News from the UK

15 May 2018

SCL PCB Solutions Group, a leading European manufacturer of PCB requirements, announced that Simon Rowe has joined Spirit Circuits as Business Development Manager VAR Sales. In a highly competitive and price sensitive market, customers of Spirit Circuits can rely on the company’s unique sales proposition for highly competitive terms and prices for the supply of their PCB requirements.

Through a combination of an established office in China and a £4.1m funding package which includes invoice finance, trade finance and foreign exchange facilities, Spirit Circuits is able to pass on preferential rates, purchasing & shipping terms to its UK and European customers.

To drive growth, support customers and increase sales of Spirit Circuits’ traded product portfolio, Simon Rowe now joins the company as Business Development Manager VAR Sales. Simon brings nearly 30 years of sales experience and an in-depth understanding of customer requirements gained during his successful career in the electronics manufacturing industry. He joins Spirit Circuits from WUS, where he was Business Development Manager with responsibility for sales and sales growth in Europe. Simon started his impressive career at Enthone Omi in 1990 after graduating from Coventry University with a Bachelor of Engineering (Hons) degree in Materials Technology.

Lee Lloyd, Sales Director, comments: ‘We are delighted that Simon has joined the Spirit Circuits team. He has a solid understanding of the PCB & electronics manufacturing industry, and his experience and talent allows us to expand our scale and scope in the market and strengthen our value-added resale solutions offering.’

For more information about Spirit Circuits and the SCL PCB Solutions Group of companies, please visit www.sclpcbgroup.com.

 

Institute of Circuit Technology

ICT ANNUAL SYMPOSIUM

THE 2018 ICT ANNUAL SYPOSIUM WILL BE HELD ON THE 5TH JUNE 2018 AT THE NATIONAL MOTOR MUSEUM IN BEAULIEU

Free to Members and Guests

THE THEME WILL BE CONTROLS FOR DIGITAL IMAGING.

1) Professor Andy Cobley, ICT Chairman will give the opening remarks and an update on the MATUREOLIFE project on wearable electronics
2) Andy West of Loughborough University will give the Keynote
3) Neil Chamberlain of Polar Instruments will speak on ‘Fast and Fine’ The signal

Integrity challenges of fine lines and high speed signalling
4) Mutracz will deliver a complimentary presentation from a joint project
5) Mr Michel van den Heuvel from Ucamco-Ledia will present on Digital Equipment
6) Orbotech will also present on Digital Equipment
7) Chris Wall of Electrapolymers will discuss ink jet as a form of direct imaging

SUPPORTED BY POLAR INSTRUMENTS

TABLETOPS AVAILABLE

Enquiries to :-  bill.wilkie@instct.org

UK starts £11m project to revolutionise electronics

 Three UK universities are to take part in a £11m programme for the development of nanotechnology for electronics. Imperial College London and the Universities of Southampton and Manchester, will work with industrial partners on the project to replace traditional transistors with memristors as the basis of electronic circuits.

Today all ICs are built from vast numbers of transistors (electronic switches). The size of transistors has continually shrunk but are now reaching their physical limit.

There is an expectation that memristors could hold the key by being both smaller and simpler in form than transistors, low-energy. They also have the ability to retain data due to the charge that has passed through them.

As a result the data processing and memory functions could be more efficiently integrated.

Prof Themis Prodromakis from the University of Southampton and principal investigator of the programme, writes:

“For decades we have followed the pattern that computers should have separate processor and memory units, but these are now struggling to cope with the masses of data in the public domain.”

Prof Themis Prodromakis

The University of Southampton has previously demonstrated a memristor technology that can store up to 128 discernible memory states per switch, almost four times more than previously reported.

Prof Themis Prodromakis, writes:

“Memristor technologies bring great prospects for next-generation chips, which need to be highly reconfigurable yet affordable, scalable and energy-efficient, not to mention secure.”

“To achieve this, we have assembled some of the UK’s best academics and industrialists for developing the core technology as well as the required tools for demonstrating the benefits of the technology in real-working services and products.”

The programme has significant funding from the government’s EPSRC.

 

By Richard Wilson Electronics Weekly, 4th May 2018

 

Ventec Launches Dk 3.48 Ceramic-Filled Hydrocarbon Thermoset Material

tec-speed 20.0: Designed for the world’s most demanding high frequency PCB applications 

15th May 2018 – Ventec International Group Co., Ltd. (6672 TT), a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, has added to its extensive signal integrity laminate and prepreg range with the launch of tec-speed 20.0, a ceramic-filled hydrocarbon thermoset material designed for high frequency applications. tec-speed 20.0 combines unrivalled high frequency performance (Dk 3.48 / Df 0.0037), superior loss characteristics and the highest reliability with fast availability and efficient delivery through Ventec’s fully controlled and managed global supply chain and technical support-network.

No More Compromises – Performance, Price & Availability

tec-speed 20.0 (VT-870) is designed for the world’s most demanding high frequency Printed Circuit Board applications such as cellular base station antennas, power amplifiers, LNB for broadcast satellites, automotive radar and RFID. With tec-speed 20.0, Ventec has responded to customer demands for a high-performance, reliable and cost-efficient high frequency material that also has a fast and efficient global delivery promise and dependable technical support.

tec-speed 20.0 is a high frequency laminate designed to preserve signal integrity up to high-GHz frequencies and has extremely low 3.48 dielectric constant (Dk) and 0.0037 dissipation factor (Df). By minimizing insertion losses, tec-speed 20.0 provides greater freedom to optimize copper trace widths, spacing, and PCB thickness.

Tested according to IPC-TM-650 specifications – the industry’s gold-standard – tec-speed 20.0 is UL approved, reliable and durable, offering outstanding thermal performance. High glass transition temperature (Tg), high peel strength, and low CTE ensure structural integrity and reliability, in process and hardworking applications.

tec-speed 20.0 is available as laminate or prepreg (VT-870PP), as standard with HTE copper foil or with HVLP (Hyper Very Low Profile) foil to attenuate passive intermodulation (PIM) effects.

tec-speed 20.0 ceramic-filled hydrocarbon thermoset material is manufactured by Ventec using strict quality-controlled processes that are certified to AS9100 Revision D, ISO/TS16949 and ISO 9001:2015, and, like all Ventec products, is backed by a fully controlled and managed global supply chain, sales- and support-network.

Further information about tec-speed 20.0 is available at www.ventecsolutions.com/tec-speed-20/.
About Ventec International
With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, visit www.venteclaminates.com.

Related Stories

EIPC Events view all events

Publications view all publications

  • WECC Report 2017

    By KWestenberg@eipc.org

    WECC Global PCB Production Report For 2017 FREE of charge EIPC membership service A Product of the Partnership among the WECC Member Associations on Behalf of their Members in the Electronic Circuits Industry Worldwide

  • Proceedings EIPC 50th Anniversary Conference Dusseldorf

    By KWestenberg@eipc.org

    Proceedings 50th Anniversary conference 2018

Industry Directory view directory

  • Cicor Group

    www.cicor.com

    Cicor is a globally active group of leading companies in the electronics industry. The group’s companies provide complete outsourcing services and a broad range of technologies for the manufacture of highly complex PCBs, 3D-MID solutions, hybrids circuits, electronic modules, plastic injection molding and box-building.

  • Isola Group

    www.isola-group.com

    Corporate Responsibility. The responsible stewardship of the environment and sustainable business practices is important to long-term success. Committed to operating our business in a manner that creates better social, economic and environmental outcomes for all those involved in the electronics industry.

SITEMAP FEEDBACK

Please provide some more details

FIND OUT MORE

Please login or register

Layer-70

EIPC membership has many advantages, both financially and in services. Such as:

REGISTER NOW

You must be a member to view this content

Layer-70

EIPC membership has many advantages, both financially and in services. Such as:

REGISTER NOW

Please Login / Register

IM NOT REGISTERD TO EIPC
IM REGISTERD TO EIPC

Please provide some more details

Please provide some more details

Thank you!

An EIPC staff member will contact you soon to arrange payment.

Please fill in the form

EIPC will send an invoice to you through email and discuss your yearly fees.