News from the UK

7 March 2017

MicroTech Annual Conference:

It’s only two weeks now till MicroTech 2017; there are limited places remaining, have you booked your ticket yet?

Here are FIVE reasons why you should attend:

1. UK’s only dedicated microelectronics event
2. Stay up-to-date with the latest packaging technologies
3. Excellent networking opportunities
4. Learn about related research & developments
5. Find new suppliers at the table top exhibition

The event is open to all, including non-members.

Book your place at MicroTech here NOW.

Join IMAPS-UK Today!

IMAPS-UK is the United Kingdom Chapter of the International Microelectronics Assembly & Packaging Society – IMAPS.

Annual membership of IMAPS-UK allows you or your Company keep up-to-date with the latest technologies & developments, by providing reduced or free entry into many events, downloads of technical papers and publications, as well as access to a major global network of microelectronics research institutions, businesses & individuals.

A full list of benefits can be found on our website:


Cleaning Printed Circuit Assemblies, Design & Process Control Workshop

Monday, May 22, 2017 | 1:00pm – 4:30pm


Bob Willis –
Mike Bixenman, DBA – KYZEN Corporation
Helmut Schweigart, Ph.D. – ZESTRON Europe

Workshop Introduction:

The majority of the industry worldwide have been running no clean processes for many years and have often, understandably, neglected important issues like design for cleaning, selecting compatible components and compatibility between cleaning materials and flux residues. With increased miniaturisation and the demands of modern circuits cleaning has come back into fashion. Conformal coating is another process which has demanded special levels of surface cleanliness to guarantee coating adhesion and long term reliability. Although there are high reliability produces that use coating with no clean others want that extra confidence.

Each delegate will receive a FREE set of cleaning inspection and quality control wall charts which also cover defects seen during assembly.


Get Details

Technical Sessions and Keynotes

May 23-24, 2017

Keynote Address

Prabjit Singh, Ph.D. IBM Corporation,
Occurrence and Prevention of Electronic Hardware Failures due to Gaseous and Particulate Contamination in Data Centers


Session 1: Residues Trapped Under Component Terminations

Session 2: How Problematic are Contaminants Left on Printed Circuit Assemblies?

Session 3: Process Control and Cleaning Material Innovations



Keynote Address

Rudiger Knofe, Siemens AG,
Cleaning of Electronics: Analysing Cleaning Results and Potential Damage Risks when Cleaning Process is not Optimal


Session 4: Conformal Coating Materials and Processes


For more information on the technical program click here:

Get Details

Office: +44 (0)208 4322741
Mobile: +44 (0)7946 133531

Email sent by SMART Group
Web: Email: Tel: +44 (0)208 4322741


Silicon Chip Industry Awareness Workshop Seminar

When: Mon 13 March
Where: Holiday Inn Kensington Forum, London, England
What: Explained in clear language how the IC industry works
- from the science that enables silicon chips to be made
- to the market fundamentals that drive applications and economics
Why: Gain increased confidence, enhanced job satisfaction and improved operational efficiency

This workshop is suitable for anyone working in or with the semiconductor industry, whether a non-technologist struggling with the jargon or a specialist looking to understand the overall picture

Past Attendee Comments
* As a non-technologist, it was very beneficial to have these issues so clearly explained
* The seminar provided a good basis to understanding the industry
* It was GREAT! I can’t remember a day of a similar density
* I finally understand how to recognize products & their use in technology
* This has helped me structure my thoughts & plans for the company
* It gave me deeper insight into the industry in a way difficult to obtain anywhere else
* This will be very useful when involved in our core business development discussions

Registration & Workshop Fee 
* Register on-line at:
* Price is £595 plus 20 percent UK VAT per delegate
* Fee includes copies of presentation materials, coffee breaks and 3-course buffet lunch
* 30% discount offered for bookings of three delegates or more from the same company

Workshops can also be held in-house for your added convenience and flexibility
Malcolm Penn, Chairman & CEO
44 Bethel Road, Sevenoaks, Kent TN13 3UE, England
Tel: +44 (0)1732 740440

MicroTech 2017 IMAPS-UK Annual Conference
“Advanced Packaging & Technology Trends”

16 March 2017 at Rutherford Appleton Laboratory (RAL), Didcot, OX11 0QX

MicroTech 2017 programme is now complete and features invited Keynote talks from “iNEMI” and  “Fraunhofer IZM”, plus technical presentations & table top exhibits on the latest developments, technologies and capabilities on this year’s theme: “Advanced Packaging & Technology Trends”.

In addition there is also a high-impact research session proceeded by a Keynote talk from Prof. Mischa Dohler of Kings College London and accompanying poster displays from UK academia.

With three of the last four consecutive MicroTech conferences having sold-out, we recommend delegates and exhibitors reserve their place without delay.

MicroTech 2017 provides opportunity for:

  • updates on the latest developments, materials, devices & technologies in microelectronic & related packaging
  • networking with end-users, researchers, supply chains and technology providers
  • review of related research from leading Academic institutions
  • business development for your Company and products

MicroTech 2017 brings together experts from across the microelectronics sector to discuss the latest technologies and developments, as well as providing a platform to highlight current commercial opportunities.  See the full programme on the IMAPS-UK website.

Reception Networking Dinner:

A three course Networking Dinner with drinks reception will be held at the “Rasoi” Indian Restaurant in the Steventon House Hotel on the evening of Wednesday 15th March.

Guests will have the opportunity to interact over welcome drinks and starters before the sit-down meal.

All delegates can register for the dinner option with their ticket (£39.50), when registering for the event.

Exhibitor Opportunities – Only three small tabletops NOW remaining:

Interested in attending MicroTech 2017 as an exhibitor? A limited number of table-tops (3) are still available on a first-come, first-served basis; book early to avoid disappointment (previous events at RAL were all sold-out)!

Registration Fees:

Student Delegate: £30
IMAPS Member Delegate: £75
Non Member Delegate: £125
Event Partner Delegate: £100
Member Exhibitor: £300
Non Member Exhibitor: £500
Reception Dinner; £39.50
Prices exclude VAT, but are inclusive of parking, lunch & refreshments.


ICT Evening Seminar at the Best Western Plus Manor Hotel, Meriden, West Midlands on Tuesday 14th March 2017


Tom Jones will present a paper entitled 'Megasound acoustic agitation for enhanced copper electrodeposition in via interconnects'.
Peter Dobromylski, Technical Sales Manager of LUX-TSI will give a paper on "CE marking compliance of LED lighting products"
The Annual General Meeting will be held at 16.30, Registration starts at 17.00 and the Seminar begins at 17.30.
Do register at the hotel before 31st January to take advantage of the special ICT room rate
Enquiries to:-
 Solder Ball Elimination – In Wave, Selective & Reflow Soldering
Solder Ball Elimination – In Wave, Selective & Reflow Online Webinar

Solder balls & solder beading have been a process issue for many years, they may not cause product failure or quality problems but they are not desirable. Solder balls are caused by a variety of factors in different processes and should be resolved to eliminate poorly defined materials/process or an assembly operation which are out of control. Selecting materials or processes without understanding process interaction may lead to solder balling

For further information or to join the online webinar Click Here

With over 40 years in industry and 30 solving process problems for the electronics industry Bob Willis explains the causes and curses for solder balls. Bob’s webinar features many unique process video clips on testing and failures and make his sessions come alive providing a much better understanding of the root cause of failure and corrective action

Each webinar last approximately 60-90 mins with the opportunity for questions. Delegates can send their own solder balling problems for discussion during the webinar

Topics covered include:
What are solder beads & balls?
What causes these defects?
Why does PCB design & specification matter?
Solder process & material & their impact
Tin/lead v Lead-Free
Solder ball & bead formation in reflow, wave & selective
Test board for solder mask evaluation
Causes/cures for random & designer balls
Inspection criteria
A copy of the slides presented during the webinar are provided at the end of the event

You can also arrange your own company custom webinar designed to order when you need it Click Here
Take a look at our list for the next few months:
Hand Soldering & De-Soldering with Lead-Free Solder – Online Webinar
February 20 @ 2:30 pm – 4:00 pm UK Time

Void Formation in Solder Joints – Causes & Cures – Online Webinar
March 13 @ 2:30 pm – 4:00 pm UK Time

Guide to Printed Circuit Board Manufacturing Process
April 3 @ 2:30 pm – 4:00 pm UK Time

Wave Soldering Lead-Free – Setting up Your Process Parameters
May 8 @ 2:30 pm – 4:00 pm UK Time

Passive 01005 & Beyond – Design, Assembly & Inspection Solutions

June 5 @ 2:30 pm – 4:00 pm UK Time


Look forward to working with you and your team to improve process yields, solve failures and reduce manufacturing costs in 2017. Alternatively, why not arrange an in-house workshop for your team, we offer the widest range of training courses in the industry Click Here
Many thanks

Bob Willis
2 Fourth Avenue, Chelmsford, Essex CM1 4HA England

Tel: 00 (44) 1245 351502 Fax: 00 (44) 1245 496123 


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