Aerospace Supplier Quality System Certification (AS9100 Rev C) Audit Success at Ventec’s UK Facility
Ventec International is proud to announce that its European Headquarters in the United Kingdom continues to be fully accredited to AS9100 Revision C, in accordance with the Aerospace Supplier Quality System Certification Scheme. Re-certification was granted after successfully passing the comprehensive audit of the facility’s quality management system with zero non-conformances.
Board designers, specifiers of board materials, fabricators and OEM customers servicing the aviation, space and defense industries can continue to rely on Ventec’s fully accredited supply chain for high reliability laminates and prepregs, particularly Ventec’s IPC4101D/40/41-standard VT-901 laminate. From manufacture through fabrication and delivery, Ventec’s high quality product portfolio of polyimides, high reliability FR4 and ‘tec-speed’ range of high speed/low loss materials are all covered by the accreditation.
“In a significantly more competitive environment with tighter regulatory demands across industries, customers are looking to strategically partner with Ventec not only for the supply of PCB materials with consistent quality for high-reliability performance, but also based on our commitment to delivering managed quality to the highest standards”, said Mark Goodwin, COO Europe & USA Ventec International Group. “By ensuring AS9100 Rev C certification at our Leamington Spa, UK facility, we reconfirm our committed approach to structuring our quality management systems to meet the strictest requirements of the international aerospace and defense industries.”
For more information about Ventec’s solutions and the company’s wide variety of products, please visitwww.venteclaminates.com and/or download the Ventec APP.
About Ventec International
With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, visit www.venteclaminates.com.
MicroTech 2017 IMAPS-UK Annual Conference
“Advanced Packaging & Technology Trends”
16 March 2017 at Rutherford Appleton Laboratory (RAL), Didcot, OX11 0QX
MicroTech 2017 programme is now complete and features invited Keynote talks from “iNEMI” and “Fraunhofer IZM”, plus technical presentations & table top exhibits on the latest developments, technologies and capabilities on this year’s theme: “Advanced Packaging & Technology Trends”.
In addition there is also a high-impact research session proceeded by a Keynote talk from Prof. Mischa Dohler of Kings College London and accompanying poster displays from UK academia.
With three of the last four consecutive MicroTech conferences having sold-out, we recommend delegates and exhibitors reserve their place without delay.
MicroTech 2017 provides opportunity for:
MicroTech 2017 brings together experts from across the microelectronics sector to discuss the latest technologies and developments, as well as providing a platform to highlight current commercial opportunities. See the full programme on the IMAPS-UK website.
Reception Networking Dinner:
A three course Networking Dinner with drinks reception will be held at the “Rasoi” Indian Restaurant in the Steventon House Hotel on the evening of Wednesday 15th March.
Guests will have the opportunity to interact over welcome drinks and starters before the sit-down meal.
All delegates can register for the dinner option with their ticket (£39.50), when registering for the event.
Exhibitor Opportunities – Only three small tabletops NOW remaining:
Interested in attending MicroTech 2017 as an exhibitor? A limited number of table-tops (3) are still available on a first-come, first-served basis; book early to avoid disappointment (previous events at RAL were all sold-out)!
Student Delegate: £30
IMAPS Member Delegate: £75
Non Member Delegate: £125
Event Partner Delegate: £100
Member Exhibitor: £300
Non Member Exhibitor: £500
Reception Dinner; £39.50
Prices exclude VAT, but are inclusive of parking, lunch & refreshments.
IFS2016 – Semiconductor Market Outlook & Forecast
Proceedings Now Available
Price UK £195.00, order here, pay by PO/Invoice or PayPal, immediate delivery by e-mail
This year’s event took place on Tue 17 Jan and looked at the key factors currently driving the global chip market.
Presented in over 120 slides, the material presented covers:
* Industry Update – Economy – Unit Demand – Wafer Fab Capacity – IC ASPs
* Market Forecast – What We Said Last Year – What Happened – Outlook For 2017
* Technology Trends (Moore’s Law , 450mm & EUV)
* Application Highlights (Key Market Drivers & New Industry Structure)
- IoT (From Wearables to Driverless Cars)
* Industry Outlook (M&A Reality & Systemic Repercussions
Presenting the facts and the proven analyst view, the material provides the information needed to confidently plan for the future. Now in its 28th year, Future Horizons’ twice-yearly forecast events are a vital link to provide industry with high-quality, cost-effective, market research and the reasons why. Whether a seasoned veteran or newcomer, this material is invaluable to executives from the semiconductor, electronics, government, finance and related industries
Seminar can also be held in-house for your convenience, please call for further details Malcolm Penn, Chairman & CEO
44 Bethel Road, Sevenoaks, Kent TN13 3UE, England
ICT Evening Seminar at the Best Western Plus Manor Hotel, Meriden, West Midlands on Tuesday 14th March 2017
Tom Jones will present a paper entitled 'Megasound acoustic agitation for enhanced copper electrodeposition in via interconnects'.
Peter Dobromylski, Technical Sales Manager of LUX-TSI will give a paper on "CE marking compliance of LED lighting products"
The Annual General Meeting will be held at 16.30, Registration starts at 17.00 and the Seminar begins at 17.30.
Do register at the hotel before 31st January to take advantage of the special ICT room rate
Solder Ball Elimination – In Wave, Selective & Reflow Soldering
Solder Ball Elimination – In Wave, Selective & Reflow Online Webinar Solder balls & solder beading have been a process issue for many years, they may not cause product failure or quality problems but they are not desirable. Solder balls are caused by a variety of factors in different processes and should be resolved to eliminate poorly defined materials/process or an assembly operation which are out of control. Selecting materials or processes without understanding process interaction may lead to solder balling For further information or to join the online webinar Click Here With over 40 years in industry and 30 solving process problems for the electronics industry Bob Willis explains the causes and curses for solder balls. Bob’s webinar features many unique process video clips on testing and failures and make his sessions come alive providing a much better understanding of the root cause of failure and corrective action Each webinar last approximately 60-90 mins with the opportunity for questions. Delegates can send their own solder balling problems for discussion during the webinar Topics covered include: What are solder beads & balls? What causes these defects? Why does PCB design & specification matter? Solder process & material & their impact Tin/lead v Lead-Free Solder ball & bead formation in reflow, wave & selective Test board for solder mask evaluation Causes/cures for random & designer balls Inspection criteria A copy of the slides presented during the webinar are provided at the end of the event
You can also arrange your own company custom webinar designed to order when you need it Click Here
Take a look at our list for the next few months:
Hand Soldering & De-Soldering with Lead-Free Solder – Online Webinar
February 20 @ 2:30 pm – 4:00 pm UK Time
Void Formation in Solder Joints – Causes & Cures – Online Webinar
March 13 @ 2:30 pm – 4:00 pm UK Time
Guide to Printed Circuit Board Manufacturing Process
April 3 @ 2:30 pm – 4:00 pm UK Time
Wave Soldering Lead-Free – Setting up Your Process Parameters
May 8 @ 2:30 pm – 4:00 pm UK Time
Passive 01005 & Beyond – Design, Assembly & Inspection Solutions
June 5 @ 2:30 pm – 4:00 pm UK Time
Look forward to working with you and your team to improve process yields, solve failures and reduce manufacturing costs in 2017. Alternatively, why not arrange an in-house workshop for your team, we offer the widest range of training courses in the industry Click Here
Bob Willis Bobwillis.co.uk
2 Fourth Avenue, Chelmsford, Essex CM1 4HA England
Tel: 00 (44) 1245 351502 Fax: 00 (44) 1245 496123 Email:email@example.com
EIPC membership has many advantages, both financially and in services. Such as:
EIPC membership has many advantages, both financially and in services. Such as:
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