News from the UK

17 November 2016

Ventec Secures Exclusive UK Distribution Rights for Advanced Copper Foil Inc. Range of Copper-Aluminium Foil Products

Ventec International has secured exclusive UK distribution rights for the ACF2™ and ACF3™ range of copper-aluminium foil products, produced in Canada under strict clean-room conditions by Advanced Copper Foil Inc.

Copper foil is supported on an aluminium carrier sheet to facilitate multilayer PCB layup and to guarantee a pristine copper surface, free of debris and other foreign materials, and protected from epoxy spots and fingerprints. A wide range of foil thicknesses and treatments is available. ACF2™ has copper on one side of the aluminium sheet; ACF3™ has copper on both sides. (link to data sheet)

Ventec Europe & USA COO Mark Goodwin was keen to reassure existing users of ACF materials that they would enjoy continuity of supply from the U.K. inventory held at Ventec Europe’s Leamington Spa service centre, and to invite users of copper-aluminium products from other sources to evaluate the ACF2™ and ACF3™ range as technically and commercially competitive alternatives.

For further information and to request a Technical Data Sheet, please contact  Information about Ventec’s solutions and the company’s wide variety of products, is available at and/or by downloading the Ventec APP.




 Our Winter Conference, kindly sponsored by GSPK, will take place at The Majestic Hotel in Harrogate, Yorkshire, on Thursday 1st December, commencing at 1730 hours. Registration opens at 1700 hours.

During the afternoon we will, if numbers allow, be organising a trip to the famous National Railway Museum in York, which is always worth a visit, a reminder of the days when to travel by train was for enjoyment, not confinement.

At the Conference, there will be four presentations, one from GSPK, two from our dissemination partners and a keynote.

 Martyn Gibson of GSPK will present on using lean manufacturing principles in a fast turn batch manufacturing environment

Dr Darren Cadman of Loughborough University will present on our newest project, SYMETA, 3D Metamaterials for RF, Microwave and THz applications

Our MACFEST project is nearing completion and we will have the latest update on the use of Ionic Liquids in the production of solderable PCB coatings from Professor Karl Ryder of Leicester University

Enquiries to: Bill Wilkie, Hon. Secretary, Institute of Circuit Technology.

Majestic Hotel, Ripon Road, Harrogate, North Yorkshire, HG1 2HU.
Tel.: 01423 229 017

(A small number of rooms are available at £79 B&B)




 One Week now to the pOp conference at HWU Edinburgh

Opens on Tuesday 22 November

There are only a few days left for you to register to attend

the IMAPS-UK, EPIC, JEMI and SEMIconference


Photonics & Opto-electronic Packaging

here are a few reasons why you need to attend …

  • Listen to and engage with leading industrial practitioners

•Meet and discuss:

• user and integrator trends with Tyndall Institute, Photon Delta, IBM,CIP Huawei, Kaiam, Technobis and Oxsensis

• design with Phoenix Software and Fraunhoher HHI

• packaging and test services with Linkra, Optocap, ficonTEC andMicrotest

  • Update yourself on latest market trends
  • Network with entire supply chain including end-users, integrators, materials and equipment suppliers
  • Gain insight into assembly process developments from range of industrial sectors
  • Visit state of the art research facilities at Heriot Watt University

Register NOW To Guarantee Your Place! 

To secure your place, Register NOW via the IMAPS-UK website  !
Full details can be found on our website:
Andy Longford, IMAPS-UK Secretariat
Telephone: + 44 (0)131 202 9004


ON 22 – 23 November 2016 at Heriot-Watt University, Edinburgh

Registration is now open ….

Click Here to Register for this Event

Photonics & Opto Packaging Conference (POP 2016)

 Next Generation of PCB Surface Finish – Webinar

Join us for a webinar on Dec 01, 2016 at 10:30 AM GMT.

Register now!
MACFEST is a collaborative research project involving partners A-Gas Electronic Materials, C-Tech Innovation, MTG Research, the Institute of Circuit Technology, the University of Leicester and Merlin Circuit Technology. Partly funded by Innovate UK (formerly the Technology Strategy Board), the aim of the project is the development of new “universal” PCB surface finishes which are suitable for both solder reflow and gold wire bonding. This will help PCB manufacturers meet the performance demands for high value electronic systems, ensuring long term reliability, even in harsh environmental conditions. In addition, the use of deep eutectic solvents (DESs), a patented technology of the University of Leicester, offers the ability to significantly reduce the environmental impact of a number of PCB plating technologies, reducing the requirements for use of cyanide and toxic/corrosive acids in plating baths

This webinar will provided detailed results from the project, performance testing and practical assembly trials

After each webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session. A copy of the slides is sent to each delegate after the webinar

After registering, you will receive a confirmation email containing information about joining the webinar.

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