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News from the UK

1 September 2016

Ventec International to Introduce Latest Flex Material Solutions at PCB West 2016

Ventec International will be introducing its newest ranges of PCB base-materials including consumables and flex- & rigid-flex circuit board materials at PCB West, scheduled to take place September 13-15, 2016 at the Santa Clara Convention Center in California. The latest advances in polyimide technology including Ventec’s advanced high speed/low loss product line ‘tec-speed’ will also be a highlight on the Ventec booth number 411.

The introduction of Ventec’s wider product offering that includes complementary products such as flex- & rigid-flex circuit board materials, back-up, entry & routing materials, foils, clean room products and coatings, follows the recent acquisition of TMT Trading, which was completed on July 1, 2016. Chris Alessio, Vice President Sales & Operations for the company’s North American operation will be joined by Ken Stem (Technical Account Representative) at Booth #411 to introduce these latest offerings to the North American market.

Chris Alessio commented: “The integration of TMT Trading into Ventec offers our customers a one-stop-shop for their laminates and PCB base material needs. PCB West provides us with the ideal opportunity to introduce our extended PCB materials product offering to the North American market.”

For more information about Ventec’s solutions and the company’s wide variety of products, please visit www.venteclaminates.com and/or download the Ventec APP.

 

 

  ICT Evening Seminar

   at the

  Newtown House Hotel, Hayling Island
20th September

 

 

Presentations from :                        Registration 17:00                    START – 17:30

MEETING INDUSTRY NEEDS
PAPERS FROM

Andrew Barlow of MacDermid Enthone will give a presentation on the Systek System of Through Hole Viafill

Daniel Knowlton – using Social Media in Business

https://www.youtube.com/watch?v=tMq7KtunOLw&feature=youtu.be

Dr Despina Moschou, University of Southampton – Lab-on-PCB Technology

Steve Driver, SCL

Enquiries to :-
bill.wilkie@instct.org

 

 

Supported jointly by SPIRIT CIRCUITS and MACDERMID ENTHONE

 

 

ICT 2016 Hayling Island Autumn Seminar

DATES FOR YOUR DIARIES
Darlington Evening Seminar
TBA

 

 

 

Newtown House Hotel,
The Newtown House Hotel :
Manor Road,
Hayling Island,
Hampshire,
PO11 0QR.
Tel.: 023 9246 6131
http://www.newtownhouse.co.uk/

 

 

 

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BPA Consulting have recently released their latest High Speed Report 2016-2021 highlighting a number of important opportunities for the electronics industry.  

One such opportunity pertains to high-performance Datacenter or Hyper Datacenter networks which require high-performance switches. Increasingly this means interface speeds of at least 40GbE and in 2016 we are seeing more 100GbE datalinks at the spine or core layer where traffic and application demands are highest. By 2019, we are going to see the demand growing by an order of magnitude compared to 2014.

What about the technologies? Using custom-built silicon with 40GbE or even 100GbE capacity as a multi-layer spine switch for a large network can be a good investment. On the other hand, at the access layer, where performance demands are less, having traditional switches based on merchant silicon or white boxes makes sense both commercially and operationally. Custom-built silicon switches can deliver significant value with improved performance, reliability, durability and capacity.

Potentially such a technology choice will facilitate a longer life-cycle over many years. In scenarios where high latency will have a significant detrimental impact such as financial services transactions, custom built silicon has a significant advantage by eliminating the compromises between logic scale and physical scale.

More details on this crucial Report are available on our website including:

-         High Speed Report Overview

-         What’s Changing

-         New Entrants

-         Datacenters

-         Significant Changes

-         Summary of Key Trends from the Report

-         Report Deliverables

-         Downloadable High Speed Report Brochure (attached)

 

Please contact Mark Hutton (m.hutton@bpaconsulting.com) or Christine Smith (c.smith@bpaconsulting.com) for any further information.

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