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13 June 2018

26. FED-Konferenz in Bamberg: Design- und Fertigungsprozesse für smarte Elektronik

Design & Entwicklung, Fertigung & Test sowie über Managementtrends informieren und diese mit Experten diskutieren. Inhaltlich im Fokus stehen in diesem Jahr multifunktionale Leiterplatten und dreidimensionale Aufbau- und Verbindungstechnik.

Hinzu kommen zwei hochkarätige Keynote-Speaker: Der Experte für künstliche Intelligenz Prof. Dr.-Ing. Sami Haddadin ist davon überzeugt, dass Roboter schon bald in der Fertigung selbstständig handeln werden. Für das von ihm entwickelte intelligente Roboterassistenzsystem erhielt er den Deutschen Zukunftspreis 2017. Der Berufspilot und Managementexperte Peter Brandl wird in seinem Vortrag erstaunliche Parallelen zwischen professioneller Luftfahrt und Unternehmensalltag aufzeigen.

Wir laden Sie herzlich ein zur 26. FED-Konferenz am 27. und 28. September 2018 im Welcome Kongresshotel Bamberg.

26. FED-Konferenz – Highlights

27./28.09.2018 — Bamberg

Design- und Fertigungsprozesse für smarte Elektronik

Wie können wir HDI kostengünstig einsetzen und wie schaut das Design eines Multiboards in der Elektromobilität aus? Diese und weitere Fragen zu den Themen Leiterplattenzuverlässigkeit und -analysen beantworten Ihnen die spannenden Vorträge der Kenner aus der Elektronik- und Designwelt.
Wie ist die EDA-Welt für das Design von modernen 3D-Technologien gerüstet? Die vom FED-Arbeitskreis 3D moderierte große Diskussionsrunde gibt Antwort darauf und verschafft Ihnen den Einblick in die spannenden Bereiche der Multiboard- und Embedded-Systeme.
Weiterhin dürfen Sie beim bisher noch nicht dagewesenen Blick in die Zukunft der Leiterplatte und in die Welt dreidimensional geformter Kunststoffbauteile mit integrierter Elektronik mit dabei sein.

27.09.2018 — Bamberg

Kultur und Unterhaltung  am Abend des 1. Konferenztages

Nach dem ersten Kongresstag geht es auf Entdeckungstour durch die Altstadt Bambergs mit dem größten unversehrt erhaltenen historischen Stadtkern in Deutschland. Danach laden wir Sie ein zur Abendveranstaltung: In entspannter Atmosphäre

FED e.V.
Frankfurter Allee 73c
10247 Berlin
Tel. +49 30 340 603050
Fax. +49 30 340 603061
info@fed.de

SMT Hybrid Packaging 2018 – solution-oriented initiator

After an intensive three days, the SMT Hybrid Packaging event can look back at a successful exhibition and conference on system integration in microelectronics. 434 exhibitors presented their solutions on 26,400 m²; these reflected all the technical processes involved in the production of electronic assemblies.

“The SMT Hybrid Packaging event is extremely important for us at Fuji Europe Corporation: Here we can maintain and develop contacts in central Europe, which is our main sales region. I would actually claim that if you aren’t here, you aren’t very successful on the market,” confirmed Stefan Janssen, Assistant General Manager, FUJI EUROPE CORPORATION GmbH, exhibitor at the SMT Hybrid Packaging 2018.

Around 12,000 visitors from around the world were able to gain an excellent overview of the entire value chain and network within the industry. Visitor highlights included the “Future Packaging” production line for “Smart Motion – Intelligent Automation for E-Mobility and Robotics” as well as the IPC Hand Soldering Competition, in which not only professionals but also young professionals were able to participate for the first time. The conference and tutorials once again provided the 203 participants with numerous solution-oriented training opportunities and enabled direct dialogue with experts.

Established event with new name in 2019

From 2019, the event will undergo a name change. SMT Hybrid Packaging will become SMTconnect: solutions for electronic assemblies and systems. The new event name describes the core of the event in thereby reflecting its clear focus. SMTconnect will bring together people and technologies from the areas of development, production, services and application of microelectronic assemblies and systems, creating important and valuable connections.

“The solution-oriented event provides the community with optimal conditions to exchange knowledge and ideas as well as jointly master the current challenges in microelectronics,” explains Anthula Parashoudi, responsible division manager at Mesago Messe Frankfurt GmbH. In addition, SMTconnect aims to bring more developable subjects into focus. In 2019, the topic of “Electronic Manufacturing Services” will be added to the portfolio. The SMTconnect will be taking place in Nuremberg from 7 – 9 May 2019. Up-to-date event information is available at smtconnect.com

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