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31 May 2018

Atotech to present its new product series for flex/flex-rigid PCB manufacturing at JPCA 2018

 BERLIN, May 31, 2018: Atotech today announced that it will present its latest production solutions for the flex/ flex-rigid PCB market at the New Product Introduction (NPI) sessions at the JPCA 2018 show. The trade show will be held from June 6 to 8, 2018, at Tokyo Big Sight, East Exhibition Halls 4 to 8, in Tokyo, Japan. Next to its presentation, the company will also showcase new products from various other fields at booth 7A-16.

 

On Friday, June 8, from 2:50 to 3:20 pm, Jun Hotta, Manager Electronics Business Division at Atotech Japan K.K., will introduce Atotech’s new product series for flex/ flex-rigid PCB at 7H-NPI Presentation Site 2. Product highlights this year are Atotech’s new Securiganth® 800, a very reliable smear removal for through holes and surfaces, InPro® THF and InPro® MVF, two new acid copper baths ideal for superior copper filling at highest current densities, and Stanna-COF, an immersion tin bath for Chip On Film (COF). Jun will also talk about CovaBond®P 100, an adhesion enhancement process which enables unparalleled adhesion of electroless copper to the treated substrate with minimum surface roughness.

 

 

All about flex

Atotech’s new product series for flex/ rigid-flex applications is offering customers everything from desmear and metallization through to final finishing of PCBs. Recent product launches include InPro® Flex and Cupracid® Flex, economic conformal plating solutions for standard flex and rigid-flex applications, as well as Printoganth® RA, an electroless copper process for advanced FPCBs.

 

Cupracid® Flex and InPro® Flex

Specifically designed for standard conformal flex applications, the Cupracid® Flex process is for use in conveyorised systems with soluble anodes. For systems with insoluble anodes, InPro® Flex is the solution of choice. Both processes provide excellent pattern uniformity, as well as high throwing power and line shape, even at high current density and without any corner flattening. Both new processes consist of a simple two additive system and can be analysed using CVS in fully automatic analysis and control system for easy maintenance.

 

Printoganth® RA

Printoganth® RA has been specifically developed to provide next generation flex and flex-rigid PCBs with excellent adhesion on exposed polyimide areas as well as a shiny surface appearance after electrolytic copper plating. The new horizontal electroless copper process is fully compatible to ED, RA and super flexible RA (HA) copper foils. It features an exceptional throwing power into BMVs, enabling excellent coverage on all critical areas including adhesive layers. Moreover, Printoganth® RA has a fully analysable stabiliser system for best process control.

 

For more information on these or other products, visitors are invited to join Atotech’s NPI presentation or pass by the Atotech booth 7A-16 from June 6 to 8 at the JPCA.

 

 


SMT Hybrid Packaging 2018 – 15% discount for English tutorials

To all EIPC Members,

As you are a member of the EIPC, we are offering you a 15% discount off the cost of a practical training tutorial at the SMT Hybrid Packaging 2018.

 Short Tutorials á 1,5hrs:

  • Plasma Dicing 4 Thin Wafers

Panasonic Industry Europe GmbH

  • Comparative Assessment of Temperature Mission Profiles for Component Qualification

Infineon Technologies AG

  • Conformal coating technologies to protect electronics in high temperature environments

HumiSeal Europe Ltd.

Tutorials á 3hrs:

  • Printed Circuit Board Failures – Causes and Cures

Bobwillis.co.uk

  • Preventing SMT Assembly Defects and Product Failure

H-Technologies Group Inc.

  • Thermal management and reliability for electronic systems: Modern concepts of thermal characterization, failure analysis and technology

Technische Universität Chemnitz, Fraunhofer Institute

  • LGA (Land Grid Array) QFN (Quad Flat Nolead) Design, Assembly and Rework Guide

Bob Willis, Bobwillis.co.uk

Please take a look at the enclosed leaflet for more information.

To secure the discount, please contact EIPC to receive the exclusive link to register

If you have any questions, please do not hesitate to contact us by phone: +49 711 61946-252 or email: Nora.Paul@mesago.com.

 

 SMT Hybrid Packaging 2018 International Exhibition and Conference for System Integration in Micro Electronics Nuremberg, Germany, 5 – 7 June 2018

Outlook on the event highlights SMT Hybrid Packaging, the only event in Europe which is looking at microelectronics system integration with a holistic approach, will open its doors in only a few days.

The participants can look forward to a diverse program in Nuremberg from 5 – 7 June 2018. Live production – the production line “Future Packaging” The production line “Future Packaging” on the topic “Intelligent automation for e-mobility and robotics” will present the complete production process in Hall 5, booth 5-434. Visitors can experience all production steps “live” and discuss issues and challenges with experts.

The joint stand Future Packaging will not only be hosting the production line by the Fraunhofer IZM on 1,000 square meters, but also a large number of co-exhibitors, supporters and sponsors.

At the IPC – the International Association for Connecting Electronics Industries’ annual hand soldering competition, soldering professionals have the opportunity to demonstrate their skills on all three days of the exhibition. They compete against each other in hand soldering of complex printed circuit boards. The assemblies will be judged on soldering in accordance with speed and precision. I 2018, a hand soldering competition for young professionals will be held for the first time at SMT Hybrid Packaging.

This competition will follow the same guidelines as the competition for professionals, but will include a PCB assembly that matches the beginner level and their abilities. Winners will be invited to the World Championship at IPC APEX EXPO 2019 in San Diego, California.

 

 

 

Dissipating Thermal Energy in PCBs – Atotech to participate in the IPC Automotive Electronics Reliability Forum

 

Atotech will partake in the IPC Automotive Electronics Reliability Forum with a presentation on “Dissipating Thermal Energy in PCBs – Solid Copper Through Via Filling”. The forum will be held from June 4 to 5, 2018, in Nuremberg, Germany.

 

The presentation will be held on Monday, June 4, from 11:40 to 12:20 pm, by Sven Lamprecht, Director OEM/ EMS Technology Exchange at Atotech Deutschland GmbH. “With demands for 5G and advanced driver assistant system (ADAS) radar devices two advancements will force PCBs into higher frequencies and higher speeds.  We will enjoy 5G cellular networks from telecommunication companies with wider frequency bandwidths to give us lower latencies, and faster frequencies to give us better data rates,” states Sven and continues: “Furthermore, ADAS radar devices moved their standard up from below 30GHz to 77GHz.“ In his presentation, he will explore the processes required and discuss the challenges for solid copper through via filling for PCBs up to 1mm thickness in a high volume manufacturing (HVM) tool.

 

Fueled by strong growth in electric vehicles and autonomous cars, as well as a dramatic increase in electronics content in conventional automobiles and trucks, automotive electronics are crucial components of engine, ignition, and transmission management, entertainment, navigation, diagnostic tools and safety systems.

 

With the “IPC Automotive Electronics Reliability Forum,” the IPC – Association Connecting Electronics Industries – has gathered thought leaders and subject matter experts from leading electronics and automotive companies to discuss the future of automotive electronics design and manufacturing.  The forum delivers unique educational as well as networking opportunities and covers a wide breadth of relevant and timely topics. It is therefore the ideal place for Atotech to present its innovative systems and product solutions as well as its thought leadership when it comes to automotive electronics.

 

 

 
Job vacancy at Global operating company based in Germany

Contact EIPC for further details: kwestenberg@eipc.org

 

Function: Sales
Job Title: Senior Sales Director
Location: Germany (Home based)
Compensation: Base Salary:

€ circa  120,000 (DOE) – there is flexibility on this

commission €30 – 60,000

car allowance €5,000

holidays – 30 days annual leave

Travel: 25% – 30% as per business requirements
Reporting & Working Relationships: Reports to: Snr VP Sales

Direct Reports (Brussels):  team of 4 in place (3 in Germany, 1 in Netherlands), and holds responsibility for managing 1 manufacturer’s representative in Israel.

Succession Plan: This is a high level strategic position that can see the appropriate candidate grow into the company leadership structure.
Reason for Opening: Need an Innovative Leader who can improve and grow the PCB division sales.

The Role:

  • Develop and maintain relationships within target customers to penetrate the organization and open doors to new business opportunities.
  • Deploy an effective account strategy in conjunction with Management in order to achieve aims and objectives set for the business.
  • Aggressively attacking business to ensure competitive take-away, market share growth and prime strategic positioning for future business successes.
  • Accountable for meeting and exceeding sales revenue and margin targets set by Management
  • Communicating issues and problems back into the company in order to drive and assist with resolution.
  • Leadership competence. Ability to manage and motivate your team.
  • Identify, qualify and close new business in line with set quotas and engage appropriate resources from cross-functional teams to ensure successful business execution.

Additional Responsibilities:

  • Own and manage related RFQs and act as prime in ensuring timely response delivery and feed information back into Management in support of developing Business Plans.
  • Regularly update IT CRM system with customer data, opportunities and action plan to accomplish agreed upon goals by management.
  • Qualifications, Knowledge, Skills & Experience
  • 10 - 10+ years’ sales and commercial experience with revenue responsibilities to $30million
  • 10 – Strong hands on leader, creative, energetic, success orientated
  • 10 – Strong knowledge of PCB industry as well as IMS, particularly in industrial/automotive/defence/aerospace sectors
  • 10 – Demonstrable planning ability at strategic and operational levels
  • 10- Fluent English and German
  • 9 – Strong budget management experience
  • 9 – Experience of managing and coaching geographically diverse teams in matrix organisations
  • 9 – Demonstrable problem solving skills
  • 8 – Degree level qualification in a relevant Engineering discipline
  • Personal Circumstances Criteria
  • 10 – Resident in Germany
  • 10- Salary expectations within stated range (euro 100 – 120k)
  • Behavioural & Personality Criteria
  • 10 -High energy entrepreneurial individual, commercially focussed

 

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