News from Germany

10 April 2018

Schweizer Electronic AG: 0.30 euro dividend for the year 2017

In the light of the comprehensive investments into the new high technology plant in China, SCHWEIZER decided,in the framework of a Finance Committee’s Meeting, to propose a dividend of 0.30 euro (previous year: 0.65 euro) per share to the Annual Shareholders’ Meeting on June 29, 2018, subject to the Supervisory Board’s approval.

With this dividend proposal, the company intends to let its shareholders participate in last year’s business success in spite of the forthcoming investments for further growth. In future, SCHWEIZER will increasingly develop towards a growth stock in order to consistently explore the excellent business potential deriving from the growth markets e-mobility and autonomous driving. With this strategic realignment, SCHWEIZER’s management expects a disproportionate increase of its company value in the medium term.


Smart Systems Integration 2018: Event only a few days away –

The Smart Systems Integration, the international communication platform for innovative smart systems and production techniques, will open its doors in a few days time. Participants can look forward to a diverse conference program in Dresden from 11 – 12 April 2018.

Conference: Knowledge in a nutshell

The two-day conference will host top speakers from science and industry, who will be presenting innovations, applications and trends in the field of smart systems.

An extensive conference programme comprising five keynote lectures, 54 presentations, 13 sessions, two special sessions from the European Technology Platform on Smart Systems Integration (EPoSS) and over 35 poster presentations will be offered.  The Main topics in 2018 will include:

• Applications

• Hardware/Technologies

• Software for smart integrated systems

• Business creation of smart systems

Professor Thomas Otto from the Fraunhofer Institute for Electronic Nano Systems ENAS and Conference Chair of Smart Systems Integration 2018 summarizes the event: “The Smart Systems Integration Conference and Exhibition serves as a communication platform for academia, research and industry enabling the exchange of know-how in the field of smart systems integration.”

IoSense Spring School

For the first time, the IoSense Spring School on “Building Apps for the Internet of Sensors”, hosted by the TU Dresden, will take place as a co-located event parallel to the Smart Systems Integration on 11 April 2018. The goal of IoSense Spring School is to show how to engineer innovative products. The IoSense project focuses on the availability of top innovative, competitive sensors and sensor systems ”Made in Europe” for ”Internet of Sensor” applications in smart mobility, society, energy, healthcare and production. Interested parties can register online at for the IoSense Spring School.

Exhibition: presentation platform of the industry

More than 20 international exhibitors from industry and science will be presenting their products and services at the parallel exhibition. In addition to well-known research institutions, such as various institutes of the Fraunhofer Institute and the Swedish research institution Swera, renowned companies such as Polytec and TDK Micronas as well as start-ups such as Optim Wafer Services from France will present their innovative products. “We are pleased to offer a highly current and diverse program as well as various possibilities for further education to all participants of the Smart Systems Integration. The event also provides a great number of networking opportunities with experts from Europe and Asia through its interesting supporting program,” says Anthula Parashoudi, Head of Smart Systems Integration.

Registration Conference tickets without the on-site can be ordered in advance at

The complete conference programme, as well as further information about the event, are available at

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