News from Germany

19 January 2017

SMT Hybrid Packaging – New Tutorial concept and conference focus released

At SMT Hybrid Packaging 2017 a new Tutorial concept with short Tutorials of one and a half hours duration will be offered as well as the established half-day Tutorials. The English Tutorials deal with relevant topics of the whole value chain of electronic assembly production. As a central topic Jennie S. Hwang, H-Technologies Group Inc., picks out “Assembly Integrity and Solder Joint Reliability”. She provides a holistic overview of product reliability and of critical “players” of the assembly integrity and solder joint reliability, including the roles of materials, processes and testing/service conditions, as well as the crucial principles behind the product reliability. Dr. Ning-Cheng Lee, Indium Corporation, looks into the choice of solders: “What I Have to Know about the Choice of Solders to prevail in the new Era?” This course will bring the answer, with the most updated information on the new solder materials developed, and will also help to justify the selection of solder types which fit best for the applications. The course is divided into two parts, with part one addressing the cost and reliability, and part two addressing the low temperature soldering.

Focus of the conference: Panel Level Packaging and Consumer Electronics

The conference of SMT Hybrid Packaging 2017 takes place in the morning on the second and third exhibition day. Practical oriented and fascinating topics await the participants.

“On the first half-day, we take a look at the Panel-Level Technology for which the demand is constantly increasing and the capabilities of Consumer-Packages especially in the automotive- and aircraft industry. With assembly- and product examples as well as several tutorials, SMT Hybrid Packaging will deal intensively with the Panel-Level Technology. The second half-day is dedicated to the question, how Consumer Electronics could also be used in the automotive and aircraft industry. The focus is on reliability methodology as well as on test equipment,” explains the committee chairman Prof. Dr. Klaus-Dieter Lang, Fraunhofer IZM, Berlin, Germany, the main topics of the event.

Securing early booking discount
Early bird rates are available until 3 April 2017. Beside the conference, participants can learn the latest technologies and meet new contacts in the exhibition halls.

SMT Hybrid Packaging takes place from 16 – 18 May 2017 in Nuremberg, Germany. The international exhibition and conference is the only event in Europe which takes a comprehensive view of system integration in micro-electronics, from the initial idea and its development right through to the production of all technical processes during the manufacture of electronic assemblies.

The complete conference program and further information about the tutorials can be found online on

About Mesago

Mesago, founded in 1982 and located in Stuttgart, specializes in exhibitions and conferences on various topics of technology. The company belongs to the Messe Frankfurt Group. Mesago operates internationally and is not tied to a specific venue. With 130 members of staff Mesago organizes events for the benefit of more than 3,300 exhibitors and over 110,000 trade visitors, conference delegates and speakers from all over the world. Numerous trade associations, publishing houses, scientific institutes and universities work with Mesago closely as advisers, co-organizers and partners. Mesago comprises three companies: Mesago Messe Frankfurt GmbH, Mesago Messemanagement GmbH and Mesago PCIM GmbH.



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