News from Germany

30 June 2016

Schoeller-Electronics will become Schoeller Electronics Systems GmbH as of July 1st, 2016

American Industrial Acquisition Corporation AIAC is new Investor, Site in Wetter will be continued, Staff and Management will stay on Board

In a successful conclusion to the insolvency proceedings, the business of Schoeller-Electronics was successfully sold to the new SCHOELLER ELECTRONICS SYSTEMS GmbH.  The American investor AIAC  was granted the right to buy all business activities of the company and to proceed its activities under a new firm.

This agreement was mutually signed and approved by notary on Friday June 17th, 2016 which allows he company to pursue business as usual from July 1st, 2016 under the new company name Schoeller Electronics Systems GmbH.

AIAC is an American industrial holding with more than 9000 employees worldwide, more than 60 production facilities and a revenues of about 1.2 billion US$. AIAC is investing strategically in various industrial segments and is focussed on technology.

The investor AIAC and the management are absolutely convinced that Schoeller Electronics Systems shall act as a nucleus for the acquisition and build-up of a larger group of European PCB manufacturers in the near future.


Ventec International Group announces ISO 9001:2015 certification for its German Facility

28th June, 2016 – Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, is proud to announce that its Central European facility located in Kirchheimbolanden, Germany has received certification under the ISO 9001:2015 quality management standard.

The nearly 3000sqm manufacturing, distribution and sales facility in Germany is the company’s latest location within its global network of manufacturing and service centres in Asia, Europe and the USA to receive the ISO 9001:2015 quality standard. ISO 9001:2015 is an internationally recognized standard that specifies requirements for a quality management system (QMS). The standard helps organizations consistently meet the needs of customers and other key stakeholders in both the delivery and continuous improvement of products and services.

PCB fabrication customers can continue to rely on Ventec’s fully accredited supply chain for high reliability laminates and pre-pregs. From manufacture through fabrication and delivery, Ventec’s high quality product portfolio of polyimides, high reliability FR4 and its latest ‘tec-speed’ range of high speed/low loss materials are all covered by the accreditation.

“Receiving the ISO 9001:2015 certification at our German facility is another key milestone in our roadmap to offer a full complement of PCB base-products and service options for our customers,” said Thomas Michels, Managing Director Europe. “In addition to providing products and solutions that adhere to the stringent quality requirements expected from our customers, Ventec takes great pride in helping our customers around the world to optimize their operational efficiency to better serve their customers.”

“Today, our customers are faced with a significantly more competitive environment with tighter regulatory demands across industries,” said Mark Goodwin, COO Ventec International Group.

“They are looking to strategically partner with companies like Ventec for the supply of reliable materials and services to increase quality and lower their operating costs as a differentiated business model to maximize their own resources. By earning ISO 9001:2015 and other certifications such as AS9100 Rev C for aerospace and ISO/TS16949 for automotive, Ventec can offer our customers the highest possible quality standards and cost structure transformation through an improved and fully controlled supply chain, innovation and long term strategic partnerships.”

For more information about Ventec’s solutions and the company’s wide variety of products, please visit

SMT Hybrid Packaging 2017: „Call for Tutorials” is launched

With the “Call for Tutorials”, SMT Hybrid Packaging, International Exhibition and Conference for System Integration in Micro Electronics, gives the starting signal for the event year: as of now, users and experts from industry and academia are invited to submit their own personal contributions and innovative solutions for electronic assembly production.

Diverse content overview – fundamental topics in focus

A time slot of three hours is available for each tutorial speaker and can be organized independently or in cooperation with other speakers and companies. Tutorials convey sound and application oriented knowledge of one specific topic. Speakers benefit from a highly skilled expert audience and the direct exchange about new technologies, current research findings and future developments. Furthermore, they are offered an ideal platform to extend their network of international experts.

Next year, tutorials will have a special focus on fundamental topics. The committee under chairman Prof. Dr. Klaus-Dieter Lang, Fraunhofer IZM, specified the following topic areas:

  1. Interconnection technology
  2. Reliability and quality of assemblies
  3. New materials, material development, material efficiency
  4. Packaging and system integration, 3-D integration technologies
  5. Power electronics and high temperature assemblies
  6. Printed electronics, flex and rigid-flex assemblies
  7. Power LED systems and photonic boards
  8. Environment, energy efficiency, disposal
  9. Panel Level Packaging
  10. Automation, organization, optimization (Industry 4.0, IoT)

The deadline for the submission of tutorial abstracts is 4 October 2016. Further information regarding the terms and conditions, the selection procedure and the submission form is available online at


Application oriented and industry-related


Besides the tutorials, the workshops and the conference of SMT Hybrid Packaging are application oriented, industry-related and consider themselves as an information and discussion platform for relevant challenges and solutions concerning the entire value chain of electronic assembly production.

System integration in micro electronics with a holistic approach

SMT Hybrid Packaging takes place from 16 – 18 May 2017 in Nuremberg, Germany, and is the only event in Europe which takes a comprehensive view of system integration in microelectronics, from the initial idea and its development right through to the production of all technical processes during the manufacture of electronic assemblies.

Further information is available at or via the organizer Mesago Messe Frankfurt at


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