Successful First Quarter 2017 for SCHWEIZER
Schramberg, May 5, 2017 – SCHWEIZER Group managed a very good start into the new Fiscal Year. In the first quarter 2017 the company reported a year-on-year turnover increase of 14.9 percent to 32.4 million euro (2016: 28.2 million euro). The group’s EBITDA (earnings before interest, taxes, depreciation and amortisation) jumped by 59 percent to 3.5 million euro compared to 2.2 million euro in Q1 2016.
An improved gross margin of last year’s complex product startups and the high turnover contributed substantially to the EBITDA margin of 10.7 percent (2016: 7.8 percent).
The EBIT (earnings before interest and taxes) increased to 1.5 million euro (2016: 0.5 million euro), corresponding to an EBIT margin of 4.5 percent (2016: 1.8 percent).
Turnover increases could be realised with all customer groups, but the automotive customers continue to represent the biggest part. Sales with these customers increased by 11 percent to 23.1 million euro (2016: 20.8 million euro). Turnover development with customers from the field of industrial electronics was also gratifying, with sales increasing by 26.9 percent to 6.7 million euro (2016:
5.3 million euro). With a view to the regional allocation, Germany showed a slightly disproportionate turnover increase of 12.5 percent to 19.0 million euro.
Consequently, the export ratio increased to 41.4 percent. Exports went in particular to the European countries, but America and Asia Pacific also came up with above-average growth rates.
The turnover share of SCHWEIZER’s high technology products increased again in the first quarter, accounting for 57 percent of total turnover (2016: 54 percent). Incoming orders rose by 8.2 percent to 31.7 million euro (2016: 29.3 million euro), the order book amounted to 157.5 million euro at the end of the first quarter 2017
(2016: 150.0 million euro).
SCHWEIZER’s equity capital increased to 65.9 million euro (Dec 31, 2016: 64.8 million euro), which corresponds to an equity ratio of 53.8 percent (Dec 31, 2016: 55.1 percent), net gearing was 0.9 percent compared to -1.5 percent at the end of the year 2016.
“The first quarter exceeded our expectations concerning turnover and operative results. Based on our order book we continue to strive for a 2 to 4 percent turnover growth this year compared to 2016, which corresponds to a turnover of about 120 million euro. Considering the successful first quarter we currently expect our EBITDA to be on the upper end of the forecasted 8 to 9 percent EBITDA range”, says Marc Bunz, Chief Financial Officer of Schweizer Electronic AG. “However,one cannot rule out the possibility that the current development of copper prices and the international shortages and price increases for copper foils and laminates might burden the turnover and the results. We are pleased to say that we do not face any shortages at the moment”.
SMT Hybrid Packaging 2017: Trend-setting exhibition with great experiences is opening soon
The countdown for this year´s SMT Hybrid Packaging is running: From 16 – 18 May 2017 the organizer Mesago Messe Frankfurt GmbH expects over 410 exhibitors and many qualified visitors in the new halls 4, 4A and 5 of the Nuremberg exhibition center. Attendees can look for informative expert talks with exhibitors, gain more knowledge and intensify their network within the industry. Besides an extensive service and product variety many highlights are available.
Production line “Future Packaging”: “… And Hardware for all”
The exhibition experience for visitors starts in hall 5, booth 434, on the worldwide unique production line “Future Packaging” organized by Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin, Germany. On over 1,000 squaremeters the complete productions process is comprehensible with each single machine. There are several guided tours in German and English each day including a live production. The production line’s main theme is 2017 “… And Hardware for all”.
Forums give a noticeable lead in knowledge
In hall 5, visitors gain even more knowledge for their daily business. Two forums offer extensive possibilities for further education:
The EMS/PCB forum, booth 5-221A, concentrates on specialized lessons and presentations around the topics Electonics Manufacturing Services and the production of High Tech PCBs.
The exhibition forum on booth 5-306 is used by exhibitors as a presentation platform for their products, services and innovation potential. Moreover there are several papers and a panel discussion on the second day.
High Tech PCB Area and EMS-Intersection – concentrated PCB competence
Also located in hall 5 is the High Tech PCB Area. Companies who are dealing with high-technologized PCBs show their know-how. Due to the local concentration of the companies, visitors can get an overview of innovations and special solutions within a minimum of time.
The thematically related joint stand EMS-Intersection is quite next to the High Tech PCB Area. Here providers of Electronics Manufacturing services present their portflio. The concept of the joint stand enables a qiuck and direct comparison of several EMS-companies.
Optical technologies in microelectronics – focus topic with own joint stand
What does the emerge of optical technologies in microelectronics mean and what solutions are offered? During their tour through the exhibition, visitors can get informed about these questions at the joint stand Optics meets Electronics in hall 4, stand 239. The exhibitors are dealing with the following key topics: electro-optical packages, modules and assemblies, optical interfaces and materials as well as production technologies and equipment. The joint stand is conceptually cared by Fraunhofer IZM.
Observe Europe´s best hand solderers during their work
A great highlight in hall 4 is the hand soldering competition of IPC: On booth 400 the best skills in hand soldering complex printed board assemblies are recognized. The high density printed boards demand highly skilled operators to ensure a zero-defect soldering process.
Hall 4A in focus: Reliability and Test as well as Software and Production control
The exhibition tour along the value added chain ends in hall 4A. Here, visitors can find numerous exhibitors who are offering their services in the subject area testing and reliability as well as the more general topics software and production control.
New: Event app for more orientation onsite
Besides the new reworked exhibition guide, an event app is available for the first time in 2017. This includes the hall plans, the exhibitor list, the forum and conference program and further useful information. Moreover there will be a free WiFi in the halls.
Interested visitors can register for a free day ticket at smthybridpackaging.com/tickets.
Atotech presents advanced wet chemical and system solutions for next generation HDI at C-Tex Show 2017
BERLIN, 8. May, 2017: As a global leader in specialty plating chemicals, equipment and services, Atotech frequently exhibits and joins global discussions on market and technology trends with industry partners at tradeshows and conferences worldwide.
On May 18 from 10:50am to 11:30am, at the Suzhou Jinji Lake International Convention Centre 2F in room A209, Paul Yang, Assistant Business Manager East China at Atotech China Chemical Ltd, will present Atotech’s horizontal solutions for “Next generation HDI – mSAP and amSAP technology”, with special focus on developments in the automotive and smartphone industries. Besides discussing key market trends and technology roadmaps, Paul will provide an overview of Atotech’s innovative solutions that meet and exceed current industry requirements.
To learn more about these and other market leading product innovations, visitors are encouraged to attend Atotech’s presentation and stop by the Atotech booth # AX 12 at C-Tex Show, Expo Plaza in Suzhou, China, from May 17 to 19, 2017. The Atotech team is looking forward to welcoming visitors and to discuss manufacturing challenges for PCBs, package substrates, semiconductors and how Atotech can support.
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