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News from the EIPC

15 May 2018

EIPC Programme 50th Anniversary Conference Düsseldorf, Germany

Day 1, Thursday June 21

08:00-08:30 Conference Registration and Table Top & Poster Exhibition build up

08:30-08:45 Welcome by the EIPC Chairman Alun Morgan, EIPC, UK

Keynote Session 1: Business, Technology & Trends (HMLV)
08:45-09:15 Business Outlook: Global Electronics Industry Walt Custer, Custer Consulting, USA
09:15-09:45 Advanced substrates and embedded die technology Emilie Jolivet, Yole Developpement, FR
09:45-10:15 The Changing Shape of the HDI Market Roger Massey, Atotech, UK
10:15-10:30 Panel discussion
10:30-11:00 Coffee break

Session 2: European PCB History and Future
11:00-11:20 A Retrospective of 50 Years of the PCB Industry in Europe Paul Waldner, Multiline International Europa GmbH, DE
11:20-11:50 The Look ahead | Technology drivers for printed circuit boards of tomorrow Hans Friedrichkeit, PCB-Network, DE
11:50-12:10 Achieving thermal management improvements with specialised coatings applied on printed circuit board level – possibilities and experiences
Pavel Gentschev, Lackwerke Peters GmbH, DE
12:10-12:20 Panel discussion
12:20-13:00 Networking Lunch

Session 3: Automotive PCB: Safety,  Process Reliability and Traceability
13:00-13:20 Fully integrated factory automation in PCB Technology – the latest PCB 4.0 production approach Frank Tinnefeld & Michael Luippold, ASS-SAA Luippold Automation System Service, DE
13:20-13:40 Automation and traceability Jochen Zeller, AWP Group, DE
13:40-14:00 Safety in battery cells connecting technology for EV cars Giacomo Angeloni, Mektec Europe Production GmbH, DE
14:00-14:20 Functional Safety Requirements for future Automotive electronics Emma Hudson, UL, UK
14:20-14:30 Panel discussion
14:30-14:45 Coffee Break

Session 4: New PCB Material / Processes for Advanced Application
14:45-15:05 Why going to Halogen free laminates Shannon Juan, Elite Material Corporation EMC, TW
15:05-15:25 Optimizing Laminate and Process Technology to Minimize the RF Impact at High Frequencies (55 to 95GHz)
Alexander Ippich, Isola, DE
15:25-15:45 The role of design in the IoT exemplar of the Connected Home. User Experiences happen whether you have designed them or not
Russell Morgan, Verisure, SE
15:45-16:00 Panel discussion

16:00-19:00 Departure & visit New Multilayer Factory Unimicron
19:30 Celebration & Network Dinner Schloss Walbeck
23:00 Return and arrival at Headquarter Hotel Courtyard Hotel Am Seestern

Conference Programme Day 2, Friday June 22
Session 5: Future PCB Design, Material / Processes for the PCB supply chain
09:00-09:20 Digital Solutions for Integrated Automotive PCB Production Micha Perlman, Orbotech, BE
09:20-09:40 You already recognize the winner at the start- a supply chain without wastage Gerd Appelt, Göttle GmbH & Co. KG, DE
09:40-10:00 Flex for 5G Jonathan Weldon, DuPont Electronic Materials, USA
10:00-10:20 Printed Electronics: a method to create curved, flexible and stretchable printed circuit boards Jaap Lombaers + Corne Rentrop, TNO, NL

10:20-10:50 30 minutes Coffee break
10:50-11:10 The New Proportional Land Dimensioning Concept, Rainer Taube, Fachverband für Design, Leiterplatten- & Elektronikfertigung (FED), DE 11:10-11:30 Recent developments in Lab-on-PCB technology Dr. Despina Moschou, University of Bath, UK
11:30-11:50 Circuit Data, an Open Source Language for communicating PCB Specification Jan Perdersen, Elmatica, NO
11:50-12:00 Panel discussion
12:00-13:00 Networking Lunch

Session 6:  New Material / Processes for PCB Manufacturing
13:00-13:20 Does the Pretreatment Influence the Layer Characteristics of Organic Surface Preservatives Rick Nichols, Atotech, DE
13:20-13:40 A Review of Metallization Interfaces on Microvia Reliability Richard Bellemare, MacDermid Enthone Electronics Solutions, DE
13:40-14:00 Traceability and Paramaterized Optical Inspection Andre Bodegom, Adeon, NL
14:00-14:20 Be Flexible. Go Digital. Inkjet: more than the traditional way to apply solder resist Rita Torfs, Agfa Materials, BE
14:20-14:40 New technologies for solder mask application Peter Strohm, Notion System GmbH, DE
14:40-15:00 Panel discussion
15:00-15:10 Chairman closing remarks – End of conference day 2

The EIPC is not responsible for the content and the presentation of the technical papers, which rests with the presenters.  Changes in the programme may occur, due to circumstances, for which the EIPC may not be held responsible.

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