News from EIPC

28 April 2016

EIPC Workhop ‘Metallization & Surfaces Finishes @ MacDermid Enthone

Date: May 11 2016
Place: MacDermid Enthone, 98 Golden Hillock Road, B11 2PN Birmingham, UK
Language: English
Programme: you can download the detailed programme on the EIPC website

The world of Printed Circuit Boards is populated by all types of people from all kinds of backgrounds. We come from disciplines as diverse as mechanical, chemical, electrical or process engineering. Perhaps we studied design, business, physics, philosophy or history. Whether by choice or by chance we, as members of the EIPC are involved in a world of lines and spaces, pads and holes, annular rings, solder mask alignment, multilayer registration, surface finish solderability, z-axis CTE etc, etc, etc.

In each area of producing PCBs we can design better circuits by understanding the basic principles that underlie the technology. In this Workshop we will explore the art, science and industrial processes of applying insulation coatings or metal to the surfaces of panels, pads and holes. In addition we will explore the possibilities for miniaturization that some of these technologies enable. The technology involves many disciplines (just as the industry is populated with so many people from diverse backgrounds) from proper surface preparation methods, novel methods of handling panels, chemistry, physics, process repeatability and security and quality monitoring (to name a few).

Originally, the Workshop was organized together with Hofstetter because we know of no other company so capable in so many processes of applying diverse metals to panels, pads and holes. The original Workshop was held in Switzerland and was repeated in Berlin at the Fraunhofer Institute (both in the German language). We wish to repeat the content for and in the UK in English. For this workshop MacDermid Enthone will be the host. A tour at their facilities will also be part of the programme. We have assembled a group of experts from the PCB industry and the supplier community who can greatly increase your understanding of the possibilities of designing and producing better circuits. We hope you will find the program enlightening and useful for your understanding of the technology and what the technology can do for you.

Registration fees:

EIPC / ICT members: € 100.-
Non members: € 125.-

You can download the registration form on the EIPC website

In case you need a hotel recommendation please let us know.
For more information please contact the EIPC office at or +31-43-3440872. We look forward to welcoming you in Birmingham!

Kind regards,
The EIPC Team


EIPC Summer Conference Edinburgh
Global PCB market and local manufacturing: “Strategies to maintain profitability in the European PCB Industry”

Register now – Early bird registration deadline: May 6, 2016

Date June 9 & 10
Location: Macdonald Holyrood Hotel, Edinburgh, Scotland
Bonus programme: a boat trip on The Scottish Canals and Falkirk Wheel, a unique piece of modern engineering
Programme: you can download the detailed programme on the EIPC website

Programme overview 

Management Session
The global trend in electronics, and its impact to the European electronics and PCB industry, will be illustrated. In addition, a new initiative will be introduced, one that will show European market developments and trends based on industry data.

Session 1: Safety, Quality & Reliability of ML-PCBs
New developments in components, materials and PCB fabrication technology require very advanced test methods depending on market segments. The European Space Agency (ESA) will share their experiences with the control of the supply chain. UL will provide the latest changes in material safety standards as well as their PCB validation service and some new test methods and technologies that have been introduced.

Session 2: Future technology in components, materials and processes
Electronic components are defining the design and fabrication of electronic devices. The PCB fabrication processes have to meet these changes and the needs of the components that are used to fulfil the end user requirements. The session will show some examples of this from the automotive industry.

Session 3: Latest developments in Final Solderable Finishes for PCBs
The changes in soldering of components to the printed circuit board have been manifold. On the one hand, the highest First Pass Yield are needed to maintain profitable, whilst on the other the move to lead-free soldering has increased the soldering temperature. Also, the market now demands multiple soldering processes. In this complex field, this session will provide details and trends in solderable finishes and will indicate the limitation of existing technologies and will show opportunities to improve first pass yield.

Session 4: Fabrication experience with advanced technologies
Continuous improvement is part of the PCB fabrication processes, and here Design for Manufacturing (DfM) is very much a part of the on-going process improvement programs. Existing technologies are re-evaluated to improve equipment and fabrication technology for the benefits of the end-user. This session will show some of the trends and improvements opportunities for PCB fabricators, designers and equipment / material suppliers.

You can download the conference registration form on the EIPC website

The 3rd and further registration from the same company will get 50% dicount on the registration fee!
Special Student fee: € 150.- FC including Bonus Programme.

In case of any questions please feel free to contact us at or +31-43-3440872. We look forward to welcoming you in Edinburgh!

Kind regards,
The EIPC Team



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