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Inkjet solution for PCB manufacturing uses Agfa’s DiPaMat ink to win the 2019 IPC APEX Innovation Award

29 January 2019

Agfa’s DiPaMat SolderMask inkjet ink makes an essential contribution to Meyer Burger’s PiXDRO inkjet solution for the production of Printed Circuit Boards (PCB) to win the 2019 IPC APEX Innovation Award.

PCB manufacturing is rapidly transforming from analogue lithographic film and chemistry based processes to digital inkjet technologies to reduce waste and increase production flexibility and efficiency.

One of the new processes inkjets Agfa’s DiPaMat SolderMask in multiple layers exactly where needed in the necessary thickness on the board’s circuitry, to achieve the required physical and electrical properties. This replaces the traditional subtractive method whereby the full PCB surface is covered with photo-imageable ink and then selectively developed away.

Meyer Burger’s PiXDRO solution includes the use of DiPaMat SolderMask, which allows the company to present a fully optimised and market-ready soldermask solution, and wins this year’s IPC APEX Innovation Award.

More information on the 2019 IPC APEX Awards can be found at:
http://www.ipc.org/ContentPage.aspx?pageid=Five-IPC-APEX-EXPO-Exhibiting-Companies-Earn-2019-Innovation-Awards

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