FED Call for papers 15-16 September 2016

11 February 2016

FED Call for papers

Save the Date
15./16. September 2016
Maritim Hotel Bonn
Godesberger Allee
53175 Bonn

Take an active part in our conference programme.

We look forward to receiving your proposals for papers, which we kindly ask you to submit to the
FED’s office. Presentation slots amount to 30 to 40 minutes each. Please enclose the following

* title of the paper
* length of presentation (30 to 40 minutes max.)
* brief description of contents (abstract), approx. 1/2 A4 page of running text
* short biography (approx. 500 characters of running text) and photo (jpg, min. 1500x1200px) of the presenter
* address of the company/institution
* contact details of the presenter, contact person

Combine your presentation with taking part in the accompanying exhibition and use the opportunity to present your company to a broad professional audience. Exhibitors represent a cross-section of the field of electronics.
Session breaks will be filled with short presentations at our Speakers’ Corner as well as hard- and software demos.

Entry closing date: 15 March 2016

Contact partner
FED e. V.
Michael Ihnenfeld
Tel. +49 (0)30 8447 1445

For up-to-date information regarding the 24th FED Conference, please refer to our website at

Design, manufacturing and management processes for electronic assemblies

For 24 years, the FED Conference has been the professional meeting point for the electronics industry. It represents a fixed date in the annual schedule of the printed circuit board and electronic assembly industry and is known as
the most important platform in the field of development and manufacturing of electronic assemblies in Germany. This two-day event with its variety of presentations and its exhibition offers a unique combination of interdisciplinary information acquisition and knowledge transfer as well as an intensive experience exchange
and networking among experts.

In addition to the members of our association, we would like to welcome interested professionals from electronics and related industries, as well as young talents.

The venue for the 24th FED Conference to be held on 15 and 16 September 2016 will be the Hotel Maritim in Bonn.

*Two days of presentations in three parallel thematic blocks
*Papers delivered in German and English language
*Exhibition and live demos during presentation breaks
*Speakers’ Corner at the exhibition area
*Evening event with awarding of PCB-Design Award 2016

The presentations on both conference days will deal with real-life topics from the field and show future opportunities for printed circuit board and assembly manufacturing in new markets. Furthermore, the presentations will deliver valuable
impulses for your own company and personal further training.

The programme has been structured into three thematic blocks:

By Professionals for Professionals
Trends and Future Opportunities
Technical Management

-Experience with embedded                                           -Intelligent clothing

technologies                                                                         (wearable electronics)

- New-generation Bottom                                                -3D-technologies and 3D

Termination Components                                               printing (prototyping)

(BTC) – impact on design                                                -Intelligent sensors for

and manufacturing                                                           electronic components and

processes                                                                              systems

-Influence of development                                           -Components and

and design on quality and                                              technologies for biometrics,

reliability                                                                               photonics and

-High-reliability printed                                                  optoelectronics

circuit boards and                                                            -Energy storage, energy

assemblies in aviation and                                            efficiency and energy

space, medical and                                                           harvesting

automotive electronics, and

exploration of energy                                                      -Supplier contracts, contract

sources                                                                                  law and product liability

-Printed and organic                                                      -Normative requirements,

electronics                                                                          UL-approval, audits and

releases, integrated QM


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