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BPA Report

By eipc

Category: Reports

AND WHY IT IS ESSENTIAL READING IN 2014....

• The escalating demand for greater bandwidth continues to impact on the architecture and electronics requirements of all network infrastructure systems.

• To support 100G Ethernet, serial data transmission rates on system PCBs are more than doubling from 10Gbps to >20Gbps per lane.

• 25Gbps will require advanced routing, more buried and stacked vias, new lower loss (and halogen-free) laminates, low profile copper, advanced semiconductors and packaging, standardized serdes, equalisation, pre-emphasis and compensation technologies.

• On the horizon, systems supporting 400G Ethernet with 40-50Gbps per lane will need optical backplanes and silicon photonics as signal integrity, interconnect density and thermal management budgets cannot be realised with printed circuit boards.

• In wireless, 4G LTE technologies are driving advanced and more complex base station (eNodeB) and transceiver designs. eNodeB base stations will increase nearly five fold over the time frame of this report.

• BPA predicts the annual market for high performance laminates (Df<0.02) for high speed network infrastructure system PCBs will increase from 44 m sq m in 2012 up to 53 m sq m in 2018. During this time, the market will also experience a shift towards higher performance materials in Tiers 2 to 3 as the numbers of LTE eNodeB base stations increase, and towards Tier 6 for the very high end routers and switches with backplanes and lines requiring >20Gbps serial data channels.

These and other applications are considered in the new High Speed Report which includes technology roadmaps for high performance system architectures, a detailed looked at the high performance laminates which are available for the next generation of systems, and updated forecasts of PCB and laminate demand out to 2018

If you wish to order the report please contact EIPC at +31-43 3440872 or eipc@eipc.org

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NON MEMBERS€ 2,750.-

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