2019 Winter Conference

Milan, Italy

February 14 & 15

Call for Papers EIPC Winter Conference Milan
February 14 & 15, 2019

With their customary flair for finding a suitable venue for their conferences, EIPC have selected Milan, Italy and the NH Hotel Milano Fiera, for their Winter event in 2019. The conference will be held on 14 & 15th February 2019.
Ah yes, Valentine’s Day – Valentine’s Day is recognised as a significant cultural, religious, and commercial celebration of romance and romantic love in many regions around the world.  Given that all the EIPC members are passionate people, and love a commercial celebration when they see one, you can put good money on the fact that pretty well all of them will be in Milan for the EIPC Winter Conference.
Where better to bring your bow and quiver and shoot some technical and commercial arrows into the (not-so-hard) hearts of the assembled masses of people who know a lot about assembly.

Key reasons to participate at the EIPC Winter Conference is Learning:  
  • New ways to improve efficiency
  • Understand new potential cost reduction opportunities
  • What is needed to implement them in the daily activities for the benefit of companies that participate at the conference.
  • Build on strength of Europe for the Global Electronics Market

We are very pleased to announce that the Bonus programme will take us to Elga Europe in Milan, Italy.

Please click here for the conference registration form.

Conference Programme Day 1, Thursday February 14
08:00-08:30 Conference Registration and Table Top & Poster Exhibition build up Table Top & Poster Display Area
08:30-08:45 Welcome by the EIPC President Alun Morgan, EIPC, UK
Keynote Session 1: New Business & Technology Roadmap for different market segments Moderator: Alun Morgan, EIPC, UK
08:45-09:15 Business Outlook: Global Electronics Industry Walt Custer, Custer Consulting, US
09:15-09:45 PCB Trends for Manufacturing- from Smartphone to Automotive Erkko Helminen, TTM, FI
09:45-10:00 Panel discussion
Session 2: New trends for Imaging of PCB’s, Conductor & Solder Mask Moderator: Tarja Rapala-Virtanen, EIPC, FI
10:00-10:20 Dry film for Automotive and New Exposure units Technology Ilaria Pasquali, Elga Europe, IT
10:20-10:40 Orbotech Diamond TM10 – Solder Mask at its best Uwe Altmann, Orbotech, BE
10:40-11:00 The Importance of Reduction in Metal etching for Today’s and Future PCB Designs Hironori Takashima, MEC Europe, BE
11:00-11:30 30 minutes Coffee break Table Top & Poster Display Area
11:30-11:50 Comparative Analysis of Multiple Laser Sources for Cutting/Ablation Efficacy and Quality on HDI PCB and ICP Materials Nicolas Falletto, ESI, US
11:50-12:10 Recent developments with the Inkjet Soldermask Don Monn, Taiyo America, US
12:10-12:30 PCB Automation – Green Manufacturing Andreas Schatz, Atotech Electronics Equipment, DE
12:30-12:50 Panel discussion
12:50-14:00 Network Lunch Hotel restaurant
Session 3: New advanced Materials for future Electronics Moderator: Emma Hudson, Gen3 Systems, UK
14:00-14:20 Thermal Management Alun Morgan, Ventec Europe, UK
14:20-14:40 LCP for hermetically sealed sensing applications Sven Johannsen, Dyconex, CH
14:40-15:00 Radar High Frequency Roland Schönholz, Technolam, DE
15:00-15:20 Specifying PCB Materials for HSD and microwave/millimeter wave product performance Chudy Roosevelt Nwachukwu, ITEQ, USA
15:20-15:40 Panel discussion
16:00-19:00 Departure & Visit Factory Elga Europe
19:30 Network Dinner Milan Centre
22:30 Departure to NH Hotel Milano Fiera
Conference Programme Day 2, Friday February 15
Session 4: New developments in PCB Technology, DFM and Cost Effective Supply Chain management Moderator: Michele Stampanoni, Cicor Group, CH
09:00-09:20 PCB plating performance: know the layer thickness distribution before production starts Robrecht Belis, Elsyca, Belgium
09:20-09:40 Tested PCB Quality. The impact on Supply Chain management, Final PCBA yield and Profitability Roland Valentini, Gardien Group, DE
09:40-10:00 Thermal Management in PCBs, Benchmark of the Options and Future Possibilities for the Designers Markku Jämsä, Aspocomp, FI
10:00-10:10 Panel discussion
Session 5: New soldering Technology, Quality assurance and Durability testing Moderator: John Fix, Taiyo America, US
10:10-10:30 The current state of the Solder Limits Crystal VanderPan, UL, US
10:30-10:50 CT scanning and tomographic imaging technology for failure analysis Robert Boguski, Datest, US
10:50-11:10 Development of High Reliability No Clean Solder Paste Dr. Lei Wang, Heraeus Deutschland, DE
11:10-11:40 30 minutes Coffee break Table Top & Poster Display Area
11:40-12:00 Principles of Silver sintering and importance of PCB finish Michiel de Monchy, MacDermid-Alpha, DE
12:00-12:20 New automated controlled impedance tester Hermann Reischer, Polar Instruments, AT
12:20-12:40 Panel discussion
12:40-12:50 President closing remarks – End of Conference Day 2
12:50-14:00 Network Lunch Hotel restaurant
The EIPC is not responsible for the content and the presentation of the technical papers, which rests with the presenters. Changes in the programme may occur, due to circumstances, for which the EIPC may not be held responsible.


MEMBERS (early) 600

MEMBERS (regular) 725

NON-MEMBERS (early) 780

NON-MEMBERS (regular) 900



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