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EVENTS

2019 Summer Conference

Leoben, Austria

June 13 & 14

Advanced PCB Technology, materials and strategies for the global electronics market

 Over the past 35 years, the electronics industry has evolved from local national factories to European and global production supply chain markets. With the invention of the Internet and digital mobile phones, Europe has been an important technology driver. Component packaging on printed circuit boards was a key element in connecting electrical and mechanical components. However, PCB functionality, material and manufacturing technology must adapt to changing signal speeds and the reduced mechanical dimensions of component housings.

Digitisation and artificial intelligence (AI) require signal transmission speeds that today’s PCB specialists can hardly imagine. Choosing the right materials, processes, testing methods and partners in the manufacturing and supply chain is critical to a successful long-term business relationship.

During the EIPC Summer Conference 2019, participants will learn how to meet and adapt to the changing needs of Europe and the global electronics market. Industry experts will explain the changes in the world-wide PCB supply chain for technology, materials and surface coating of printed circuit boards.

During the visit to AT&S, participants will obtain a clear understanding of how a successful PCB company has evolved from a local manufacturing operation to a truly international technology leader.


Conference location:

Falkensteiner Hotel & Asia Spa Leoben
In der AU 1
A-8700 Leoben
www.leoben.falkensteiner.com
reservations.leoben@falkensteiner.com

For your hotel room reservation for the period: 12.06.2019-14.06.2019 please note the following conditions:
Double room for single use including breakfast for 100.00 EUR/per night
Double room including breakfast for 127.00/per night
Please contact the hotel to make your hotel reservation via reservations.leoben@falkensteiner.com or call  +43-3842-405-412

 

Conference Programme Day 1, Thursday June 13
Materials & Processes for the Global Electronics Market – Cost Optimization and Automation for PCB Fabrication
Conference Registration and Table Top & Poster Exhibition build up Table Top & Poster Display Area
Welcome by the EIPC President Alun Morgan, EIPC, UK
Welcome by the Vice Mayor of Leoben Mr. Daniel Geiger, Vice Mayor Leoben AT
Keynote Session 1: New Business & Market Outlook Moderator: Alun Morgan, EIPC, UK
Business Outlook: Global Electronics Industry Walt Custer, Custer Consulting, USA
Design for Excellence, Embedded components Gerald Weis, AT&S Technologie & Systemtechnik Aktiengesellschaft, AT
Panel discussion
Session 2: Supply Chain and reliability Moderator: Tarja Rapala-Virtanen, EIPC, FI
More effective supply chain enables to reduce the total PCB cost,  shorten delivery times, improve tracebility and the reliability Gardien Group, Roland Valentini, DE
Maximising repeatability of impedance measurement Polar Instruments, Paul Carre, UK
Higher Quality solutions for a wide range of Direct Imaging applications Ucamco NV, Frank van den Bossche, BE
30 minutes Coffee break Table Top & Poster Display Area
How a brokers communication can solve technical issues Elmatica, Jan Pedersen, NO
The changes to ionic contamination testing in one of the IPC standards Gen3 Systems, Emma Hudson, UK
From Pcb to Assembly – Performance of New Coatings Applied Along the Production Chain Lackwerke Peters, Sven Kramer, DE
Panel discussion
Network Lunch Hotel restaurant
Session 3: New technologies-Material technology-Coating technology Moderator: Martyn Gaudion, Polar Instruments, UK
Advanced LPISM for High Temperature and Direct Image applications SunChemical, Steve Woods, UK
Be Flexible. Go Digital. Deeper insights in the benefits of inkjet soldermask for PCB production Agfa-Gevaert NV, Frank Louwet, BE
Inkjet Printing Technology for Solder Mask on PCB Meyer Burger NV, Erik Corduwener, NL
White Soldermask for automotive applications Taiyo America, Don Monn, USA
Next Generation Additive Electronics – Precise Multi-Material Deposition for Circuits, Electro-Mechanical Parts and RF Antennas Nano Dimension, Robert Even, IL
Panel discussion
Departure & Visit Factory AT&S Leoben
Network Dinner Leoben Centre
Return Falkensteiner Hotel & Spa

Conference Programme Day 2, Friday June 14
Materials & Processes for the Global Electronics Market – Cost Optimization and Automation for PCB Fabrication
Session 4: Design-Process reliability Moderator: Christian Behrendt, Ilfa GmbH, DE
High Density RDL Technologies for Fan-Out Panel Level Packaging Fraunhofer IZM, Lars Böttcher, DE
PCB Trace Geometry & Effects, “it’s a mechanical thing” HDP User Group International, Martin Cotton, UK
Mitigation of Tin Whiskers with ALD (Atomic Lauer Deposition) and new solution for PCB processes Picosun OY, Marko Pudas, FI
Be prepared for higher data rates in mobile systems Ericsson, Stig Källman, SW
Critical Material Properties for Millimeter-Wave and High Speed Digital Applications Rogers Corporation, Stefano Dada, BE
Copper Surface Treatment Investigation on High Frequency PCB Electrical Characteristics Elite Material Co., Ltd, Shannon Juan, TW
Panel discussion
30 minutes Coffee break Table Top & Poster Display Area
Session 5: Automation of Fabrication Technology Moderator: Hubert Zimmermann, Dyconex, CH
Industry 4.0 in the PCB Industry – new standards in the automation of production lines ASS-SAA Automation GmbH, Frank Tinnefeld, DE
InduBond Press technology Chemplate, Victor Lazarro Gallego, ES
New AOI Dimension-6 from Orbotech in combination with the shaping solution Precise-600, demonstrate how these two systems interact with each other to increase the yield of even small series production Orbotech, Uwe Altmann, BE
TBC Tackotech, TBA
Panel discussion
President closing remarks – End of Conference Day 2
Network Lunch Hotel restaurant

Price

MEMBERS (early) 600

MEMBERS (regular) 725

NON-MEMBERS (early) 780

NON-MEMBERS (regular) 900

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