2018 EIPC 50th Anniversary Conference

Dusseldorf, Germany

21 & 22 June

The EIPC’s 50 Years Anniversary Conference held in Germany, June 21 & 22, 2018

Conference location:
Courtyard by Marriott Am Seestern Düsseldorf, Germany

Review I-Connect007 Conference Day 1- part 1

Review I-Connect007 Conference Day 1- part 2

Review I-Connect007 Conference Day 2- part 1

Review I-Connect007 Conference Day 2- part 2

Conference Programme Day 1, Thursday June 21

08:00-08:30 Conference Registration and Table Top & Poster
08:30-08:45 Welcome by the EIPC Chairman Alun Morgan, EIPC, UK
Keynote Session 1: Business, Technology & Trends (HMLV)
08:45-09:15 Business Outlook: Global Electronics Industry Walt Custer,
Custer Consulting, USA
09:15-09:45 Advanced substrates and embedded die technology Emilie Jolivet,
Yole Developpement, FR
09:45-10:15 The Changing Shape of the HDI Market Roger Massey, Atotech, DE
10:15-10:30 Panel discussion
10:30-11:00 Coffee break

Session 2: European PCB History and Future
11:00-11:20 A Retrospective of 50 Years of the PCB Industry in
Europe, Paul Waldner, Multiline International
Europa GmbH, DE
11:20-11:50 The Look ahead | Technology drivers for printed circuit
boards of tomorrow, Hans Friedrichkeit, PCB-Network, DE
11:50-12:10 Title to be confirmed Pavel Gentschev, Lackwerke Peters
12:10-12:20 Panel discussion

12:20-13:00 Networking Lunch Hotel Restaurant

Session 3: Automotive PCB: Safety, Process Reliability and Traceability
13:00-13:20 Fully integrated factory automation in PCB Technology –
the latest PCB 4.0 production approach (name machines
Schmidt/Schmoll + prcocesses connected)
Frank Tinnefeld & Michael Luippold,
ASS-SAA Luippold Automation System
Service, DE
13:20-13:40 Automation and traceability Jochen Zeller, AWP Group, DE
13:40-14:00 European PCB Technology for the global Electronics
Market, Angeloni, Mektec Europe Production GmbH, DE
14:00-14:20 Functional Safety Requirements for future Automotive
electronics, Emma Hudson, UL, UK
14:20-14:30 Panel discussion
14:30-14:45 Coffee Break

Session 4: New PCB Material / Processes for Advanced Application
14:45-15:05 Why going to Halogen free laminates Shannon Juan, Elite Material
Corporation EMC, TW
15:05-15:20 Optimizing Laminate and Process Technology to
Minimize the RF Impact at High Frequencies (55 to
95GHz), Alexander Ippich, Isola, DE
15:25-15:45 The role of design in the IoT exemplar of the Connected
Home. User Experiences happen whether you have
designed them or not, Russell Morgan, Verisure, SE
15:45-16:05 Introduction to New Unimicron Factory Rico Schlüter, Unimicron GmbH, DE
16:05-16:15 Panel discussion
16:15-19:00 Departure & visit New Multilayer Factory Unimicron
19:30 Celebration & Network Dinner Schloss Walbeck
23:00 Departure to Hotel Courtyard Am Seestern

Conference Programme Day 2, Friday June 22
Session 5: Future PCB Design, Material / Processes for the PCB supply chain
09:00-09:20 Electronics & PCB Markets Multi Year View Uwe Altmann, Orbotech, BE
09:20-09:40 You already recognize the winner at the start- a supplychain
without wastage, Gerd Appelt, Göttle GmbH & Co. KG, DE
09:40-10:00 Flex for 5G Jonathan Weldon, DuPont Electronic Materials, USA
10:00-10:20 Printed Electronics: a method to create curved, flexible and
stretchable printed circuit boards, Jaap Lombaers + Corne Rentrop, TNO, NL
10:20-10:50 30 minutes Coffee break Table Top & Poster Display Area
10:50-11:10 The New Proportional Land Dimensioning Concept
Rainer Taube, Fachverband für Design, Leiterplatten- & Elektronikfertigung (FED), DE
11:10-11:30 Recent developments in Lab-on-PCB technology Dr. Despina Moschou, University of
Bath, UK
11:30-11:50 Circuit Data, an Open Source Language for communicating
PCB Specification Jan Pedersen, Elmatica, NO
11:50-12:00 Panel discussion
12:00-13:00 Networking Lunch Hotel Restaurant

Session 6: New Material / Processes for PCB Manufacturing
13:00-13:20 Does the Pretreatment Influence the Layer Characteristics of
Organic Surface Preservatives Rick Nichols, Atotech, DE
13:20-13:40 A Review of Metallization Interfaces on Microvia Reliability Richard Bellemare, MacDermid
Enthone Electronics Solutions, DE
13:40-14:00 Traceability and Paramaterized Optical Inspection Andre Bodegom, Adeon, NL
14:00-14:20 Be Flexible. Go Digital. Inkjet: more than the traditional way to
apply solder resist Rita Torfs, Agfa Materials, BE
14:20-14:40 New technologies for solder mask application Carsten Schimansky, Notion System GmbH, DE
14:40-15:00 Panel discussion
15:00-15:10 Chairman closing remarks – End of conference day 2

The EIPC is not responsible for the content and the presentation of the technical papers, which rests with the presenter


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