2015 Summer Conference Berlin

Berlin, DE

June 18 & 19

EIPC is happy to announce their Summer Conference 2015!
The EIPC Summer Conference is to be held in Berlin on June 18 & 19, 2015.

The Conference Programme is available now! Please click here to download the detailed programme.

Programme Conference Day 1

08:15-08:45 Conference Registration and Table Top & Poster Exhibition build up
08:45-09:15 Welcome and Market Overview by the EIPC Chairman, Alun Morgan, EIPC, UK

Session 1: New Technology
09:15-09:40 Smart Manufacturing Systems Pave the Way for Embedded Technologies,
Sven Lamprecht, Atotech Deutschland, DE
09:40-10:05 Embedded Power Electronics on the way to be launched
Mike Morianz, AT&S, AT
10:05-10:30 Development of PCBs with embedded passive components for low volume high-end applications François Lechleiter, Cimulec, FR
10:30-10:55 International standards affecting embedding technology
Walter Huck, IEC, DE

10:55-11:05 Panel discussion
11:05-11:35 30 minutes Coffee break


Session 2: Status of Inkjet in PCB fabrication
11:35-12:00 Cost-effectiveness with First EIE Direct Imaging Technology
Gregory Stoeckli, First EIE, CH
12:00-12:25 Gryphon, Functional Inkjet Printer for Direct Solder Mask & Legend deposition on 3D surfaces – Technology, System & Process
Dr. Boaz Nitzan, Camtek, IL
12:25-12:50 Inkjet Soldermask. Is it right for you?
Don Monn, Taiyo America, USA

12:50-13:00 Panel discussion
13:00-14:00 Networking Lunch

Session 3: Evaluation of new materials, processes, packaging and PCBs for the next generation of electronics “Made in Europe”
14:00-14:25 Demands on the PCB for future RF applications
Dr. Ivan Ndip, Fraunhofer IZM, DE
14:25-14:50 Next generation PCB and panel-based packages using embedding technologies
Lars Böttcher, Fraunhofer IZM, DE
14:50-15:15 Reliability and environmental aspects for future PCB
Dr. Olaf Wittler, Fraunhofer IZM, DE
15:15-15:25 Panel Discussion

15:30 Departure visit Fraunhofer IZM
16:00 Tour Fraunhofer IZM
18:15 Networking Dinner
21:30 Return to hotel

Programme Conference Day 2

Session 4: Materials and processes for high performance PCBs
09:00-09:10 Welcome day 2 and Introduction
Prof. Martin Goosey, EIPC, UK
09:10-09:35 “Fast & Fine”- interpreting impedance on sub 75 micron lines with LPE
Martyn Gaudion, Polar Instruments, UK
09:35-10:00 Flexible Circuit Material System For Use in High Temperature Industrial Applications
Dominique Garmy, DuPont Circuit and Packaging Materials, CH
10:00-10:25 Nanoceramic dielectric to expand the performance of metal-inboard PCBs
Eric McLean, Cambridge Nanotherm, UK
10:25-10:50 Anisotropic etching EXE for the creation of fine line in advanced PCB technology
Masashi Deguchi, MEC Company International, JP
10:50-11:15 A Novel Approach for Applying Metallization to Ultra Thin Substrates
Written by Alex Richardson, eSurface, US – Presented by Paul Waldner, mie, DE

11:15-11:25 Panel Discussion

11:25-11:55 30 minutes Coffee break

Session 5: Advanced material testing strategies to meet OEM/ODM needs
11:55-12:20 High Density Packaging User Group Overview – A member driven cooperative R&D consortium running projects focused on the characterization and reliability of electronic assemblies and sub-assemblies
Alun Morgan, High Density Packaging User Group (HDPUG), UK
12:20-12:45 Optoelectronic Interconnect – preferred solution for short-range interconnect?
Marika Immonen, TTM Technologies, HK
12:45-13:10 Quantifying and benchmarking new PWB materials reliability, electrical performance and thermal properties following exposure to today’s lead free assembly environment
Bill Birch, PWB Interconnect Solutions, CA

The session will show:
Who are the key participants and financial sponsors
What projects have been conducted
Results and achievements in:
- process development
- material development
- material testing
The benefits for the sponsors
The benefits for the electronics industry, in general, and the PCB industry, specifically.

13:10-13:20 Panel discussion
13:20-13:30 Chairman closing remarks – End of conference day 2
13:30-14:30 Networking lunch

Registration for the EIPC Summer Conference Berlin 2015 is open.
The Early Bird deadline is May 8! Click here for the registration form.

Conference location
Hotel Wyndham Garden Berlin Mitte
Osloer Str. 116 a – 13359 Berlin, Germany
T +49 (0)30 495000-3223

EIPC has negotiated a special rate for a single room of EURO 79 per night including breakfast. For reservations please use the reservation form. Please use the code “EIPC Summer Conference”. The reservation deadline is May 26, 2015. After this release date availability is on request.

Bonus Programme
As part of the Summer Conference, we will be visiting Fraunhofer IZM in Berlin, in the afternoon of June 18.
Please note: numbers of visitors at Fraunhofer are limited to 80, on a first-come, first-served basis, so make sure you are one of the first.

Fraunhofer IZM is a center for highly robust technologies used for system integration. A main part of the past work has been focused on advanced Wafer Level Packaging and Board Integration Technologies. This combination of wafer processing and PCB manufacturing is unique and will generate many synergies for the hetero system integration using panel level processing. Visitors will have the opportunity to visit both lines: A guided tour with experts from Fraunhofer IZM alongside the windows of the cleanroom and through the panel line. A short introduction of the possibilities at the institute will be given.

The EIPC offers several possibilities for sponsoring the Winter Conference 2015.
Please click here for the various opportunities that could be a great asset to your company’s exposure.



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