EIPC Summer Conference Berlin 2015

24 April 2015

Maastricht, The Netherlands – 24th July 2015 – The European Institute of Printed Circuits (EIPC) is pleased to announce the programme for their Summer Conference, which will be held in Berlin on June 18th & 19th. The venue will be the Hotel Wyndham Garden, and the conference will include a visit to the premises of Fraunhofer IZM.


On June 17th there will be a full one-day workshop entitled “Manufacturing the Internet of Things” which will be run  by Dr Markus Riester of maristechcon, Germany.  The Internet of Things is becoming a reality, being implemented in various industry sectors at considerable speed. This new market will enable internet capable devices to enter into all aspects of modern life, and the workshop is designed to bring a comprehensive insight into how IoT operates, its applications, and how to become involved.


On June 18th the Conference will commence with a Market Overview from Alun Morgan, EIPC’s Chairman, and be followed by three new technology sessions covering embedded components, inkjet for 3D application, and power electronics before a visit to Fraunhofer IZM to see embedded technologies in application and many aspects of wafer level packaging and board integration using panel level processing.


On June 19th there will be a range of invaluable presentations from leading companies involved with materials and processes for high performance PCBs, followed by a session from the High Density Packaging User Group (HDPUG) covering process development, material development and material testing.


With contributions from companies of the calibre of AT&S, Du Pont, Camtek, Fraunhofer IZM, Atotech, Polar Instruments, Cambridge Nanotherm, and First EIE, this is destined to be a positive mecca for those involved in the world of circuitry, along with an opportunity to become familiar with and involved with the Internet of Things.


For more information, please contact EIPC

Bourgognestraat 16,

NL-6221 BX Maastricht

Phone: +31 43 34408-72

Email :


Conference location:

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