The flex/ flex-rigid PCB market continues to grow as more and more designs call for flexible inner layers with ever finer lines and spaces. At the same time, the need for high volume reel to reel formats as well as pattern plating with lower base copper thickness drives the FPCB market.
As one of the market leaders for BMV filling and through hole filling in the IC-Substrate market, Atotech has developed two new acid copper processes – InPro® Flex and Cupracid® Flex – to serve the flexible printed circuit board market and support its customers to overcome the current technical barriers in FPCB manufacturing.
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