MultiPlate® for Semiconductor Advanced Packaging
MultiPlate® is a versatile and innovative ECD packaging tool, designed to tackle current and future challenges for optimal performance in advanced packaging applications. Built for flexible R&D and high end application-specific production, MultiPlate®
can be customized for single and double side plating on pillar, redistribution layer, and termination structures.
Xenolyte® Zincate CFA2
Xenolyte® Zincate CFA2 is Atotechs universal pretreatment process for all types of Al and Al alloy wafers. The pretreatment removes the oxide layer of Al and replaces it with a zinc layer of several nanometers. Following pretreatment, the zinc layer may be plated with electroless nickel for further metallization.
Spherolyte® RDL/Pillar 3
Unlike standard conformal copper pillar plating processes, the Spherolyte® Cu RDL/Pillar 3 process enables flat and recess free pillar plating, even when plating on top of μ-vias. The process deposits pure copper, which leads to lower void formation at the intermetallic phase after high temperature storage. It also enables the elimination of the nickel plating step, which is typically used as diffusion barrier to prohibit migration and voiding.
Delegates and prospect customers can also learn more about Atotech’s plating solutions for fan-out packaging, as described in a recently published article “Fan-out packaging: a key enabler for optimal performance in mobile devices,” published in the January/ February edition of Chip Scale Review.
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