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Atotech to exhibit and present at TPCA Show and IMPACT Conference 2018 in Taipei, Taiwan held from October 24 to 26

22 October 2018

Atotech, a leading provider of chemicals and equipment for PCB, package substrate, functional electronics and semiconductor technologies announced its participation at this year’s TPCA Show and IMPACT Conference 2018 at the Taipei Nangang Exhibition Center in Taipei, Taiwan from October 24 to 26. The company’s booth will be prominently located at the TPCA Show floor (booth number K818) and will highlight latest solutions for (a)mSAP, mobile and 5G PCB manufacturing, among several others. Representatives from Atotech Taiwan and Atotech Group will be on-site to meet clients, prospects and partners.

Besides the TPCA Show, Atotech is also well represented at this year’s IMPACT Program with the following presentations: 

  • On Wednesday, October 24, from 4:00 to 4:15 pm in Room 503, Bert Reents, Global Product Director for Electrolytic Copper Plating at Atotech Group, will present “Filling of Microvias and Through Holes by Electrolytic Copper Plating – Current Status and Future Outlook”. Bert will discuss the dimensions of microvias and through holes which can be filled with electrolytic copper processes today. “Copper filling technologies display clear benefits over paste plugging technologies,” states Bert. “Besides today’s more common applications, I will also highlight Atotech’s status on Panel Level Packaging (PLP).”
  • On Thursday, October 25, from 4:00 to 4:15 pm in Room 503, Sandra Nelle, Global Product Manager for Surface Finishing at Atotech Group, will elaborate on whether or not a cyanide-free gold bath can perform adequately in a high volume manufacturing environment. “I will present a cyanide-free gold plating solution which was tested on a mid-phosphorous flex nickel bath,” states Sandra. She will establish that this eco-conscious cyanide-free gold bath is a feasible option for flexible printed circuit board manufacturing.

Figure 1: Showing Atotech’s Inpulse® 2THF process performing “X-plating and BMV filling” to realize a uniform bridge plating and through hole filling – a patented plating technology by Atotech

Visitors to the show are invited to attend both presentations at IMPACT Conference and stop by at booth K818 at TPCA Show, any time from October 24 to 26. Other show highlights include, Cupracid® AC and PallaBond®. Cupracid® AC is one of Atotech’s high productivity processes specifically qualified for automotive production and a wide range of vertical conveyorized systems (VCP) as well as hoist type equipment. PallaBond® is a universal final finish for maximum fine feature resolution and definition. It enhances high-frequency design and is universally applicable for high-end circuitry.

Contact
Yvonne Fuetterer
Erasmusstr. 20
10553 Berlin, Germany
+49 30-349 85-220
yvonne.fuetterer@atotech.com
www.atotech.com                       

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