MEMBER LOGIN

NEWS

Ventec’s Martin Cotton to unveil industry’s most advanced Ultra-Low Dk PCB Materials for High-Speed Low-Loss Applications at DesignCon 2017

10 January 2017

Ventec International, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, is participating at the 2017 DesignCon show in Santa Clara, CA, USA from 31st January to 2nd February as both an exhibitor on booth #118 and technical presenter. The presentation will unveil the industry’s most advanced ultra-low Dk PCB materials for high-speed low-loss applications.

Ventec will be participating at DesignCon 2017, the premier conference for chip, board, and systems design engineers, on booth #118 and has specifically chosen the event as the ideal platform to unveil the industry’s latest advances in PCB materials for high-speed low-loss applications. Ventec’s Martin Cotton (Director – OEM Technology Marketing) and Bill Wang (Technical Director) will be presenting their paper titled “Ultra-Low Dk PCB Materials for High-Speed Low-Loss Applications” in Ballroom F on Wednesday, 1st February at 8:00am.

The technical presentation will demonstrate how lower losses and lower system power requirements are realized by using an ultra-low Dk material with Dk values between 2.3 and 2.8.

“By lowering the material Dk to ultra-low levels using FR4 processes, the delicate balance of performance and cost is achieved”, said Martin Cotton. “Higher layer counts on backplanes, daughter cards and hand-held’s are achieved in a smaller footprint by having smaller layer to layer separation without sacrificing trace width. Having potentially wider traces produces lower resistance in the signal path” he continues. “Combining ultra-low Dk with a low Df of 0.002 to 0.004, produces an alternative to ever smaller traces and higher power requirements.”

For more information about Ventec’s solutions and the company’s wide variety of products, please visit www.venteclaminates.com and/or download the Ventec APP.

 

Related Stories

EIPC Events view all events

Publications view all publications

  • WECC Report 2016

    By KWestenberg@eipc.org

    WECC Global PCB Production Report For 2016 FREE of charge EIPC membership service A Product of the Partnership among the WECC Member Associations on Behalf of their Members in the Electronic Circuits Industry Worldwide

  • Proceedings EIPC Summer Conference Birmingham 2017

    By KWestenberg@eipc.org

    The Conference was held on June 1 & 2, 2017.

Industry Directory view directory

  • Cicor Group

    www.cicor.com

    Cicor is a globally active group of leading companies in the electronics industry. The group’s companies provide complete outsourcing services and a broad range of technologies for the manufacture of highly complex PCBs, 3D-MID solutions, hybrids circuits, electronic modules, plastic injection molding and box-building.

  • Isola Group

    www.isola-group.com

    Corporate Responsibility. The responsible stewardship of the environment and sustainable business practices is important to long-term success. Committed to operating our business in a manner that creates better social, economic and environmental outcomes for all those involved in the electronics industry.

SITEMAP FEEDBACK

Please provide some more details

FIND OUT MORE

Please login or register

Layer-70

EIPC membership has many advantages, both financially and in services. Such as:

REGISTER NOW

You must be a member to view this content

Layer-70

EIPC membership has many advantages, both financially and in services. Such as:

REGISTER NOW

Please Login / Register

IM NOT REGISTERD TO EIPC
IM REGISTERD TO EIPC

Please provide some more details

Please provide some more details

Thank you!

An EIPC staff member will contact you soon to arrange payment.

Please fill in the form

EIPC will send an invoice to you through email and discuss your yearly fees.