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Ventec International Group to focus on ‘tec-speed’ brand for high speed/low loss materials at APEX 2016

1 March 2016

29th February, 2016 – Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, unveiled their high speed/low loss product portfolio, tec-speed, in January 2016 and will be showcasing the range globally at a number of shows this year. Starting with APEX in Las Vegas (15th to 17th March, 2016), tec-speed will be a highlight on Ventec’s booth number 827 with an emphasis on the mil/aero applications.

Tec-speed unites Ventec’s high speed/low loss product portfolio and better positions the range under a single identity, connecting the products through a clear and cohesive visual presentation. The tec-speed laminates & prepregs range from Mid Loss (Df 0.012) to Ultra Low Loss (Df 0.003) specifications with Dk levels ranging between 3.9 and 3.2, offering the ultimate in laminate technology and quality assurance through Ventec’s proprietary manufacturing and distribution network.

Jack Pattie, President, Ventec USA commented: “Thermal performance and signal integrity demands are increasing, particularly for mil/aero applications where miniaturization and density of components are pushing the boundaries of PCB design. Tec-speed materials and our strategic roadmap of new innovative additions to the range, provide the technological innovation, high performance and quality demanded by our customers.”

A selection of products will be highlighted at the show, including:

tec-speed 6.1 (Dk 3.2, Df 0.004 RC 50%) – Ultra-Low Loss High Tg material available with all copper styles, including HVLP. Uses Low Dk spread glass to improve Skew and Jitter. Applications include Telecom, Router, Servers etc. Specifically, backplane and daughter card designs where good Signal Integrity is essential. This material has excellent Thermal properties.

tec-speed 4.0 (Dk 3.8, Df 0.007) – Low-Loss High Tg material available with all copper styles, including HVLP. Applications focus on High Frequency & High Speed designs, Automotive and Satellite communication, Navigation, GPS, etc. are typical applications. This material has excellent thermal properties.

tec-speed 1.0 (Dk 3.9, Df 0.012 @ 10GHz RC75%) – Mid-Loss Mid Tg Halogen Free material available with all copper styles. Applications include hand-held products, specifically those that require high frequency high speed materials. This material has excellent thermal properties.

For more information about Ventec’s solutions and the company’s wide variety of products, please visit www.venteclaminates.com or download to the Ventec APP.

 

About Ventec International

With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and quick-turn CCL manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, visit www.venteclaminates.com, www.ventec-usa.com or www.ventec-europe.com.

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