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News from WECC Members

26 September 2017

News from HKPCA

Global Wisdom. Local Presence’ Theme of HKPCA & IPC Show 2017

The 2017 International Printed Circuit & APEX South China Fair (2017 HKPCA & IPC Show) will again be staged at the Shenzhen Convention & Exhibition Center, China. This year’s edition will run from 6 to 8 December 2017. With the theme of “Global Wisdom. Local Presence,” it is hoped that global collective intelligence can be drawn to the show for assisting industry insiders to apply those high-end technologies into local production and hence enhance their business development.

Overwhelming response brings a record turnout of exhibitors

Demand for booth space at this year’s show has been spectacular. As of July, 97% of booth space has already been allocated, with a long waiting list for the few remaining booths. 501 exhibitors are confirmed to attend, across a massive exhibition space of over 52,500 sq.m. covering Halls 1, 2 & 4 of the Shenzhen Convention & Exhibition Center. The final number of exhibitors is expected to be close to 550, taking up more than 2,600 booths – a new record for the show, making this the largest edition ever.

As in past years, most of the industry’s leading players will be present, with confirmed names including TTM, Elec and Eltek, Gainbase, Sunshine, World Mastery, WKK, Atotech, Harvar, Schmoll, Rohm & Haas, Jadason, Orbotech, Han’s CNC, C Sun, Protek, Hitachi Chemical, Isola, Schmid, Rogers, Universal P.C.B., Joint Stars, Topoint, Rockent, Farcien, Guangdong Guanghua, Carl Zeiss, Dupont, Bluiris and many more. These familiar names, complementing with many first-time exhibitors, will bring fresh ideas and exciting new offerings to the show.

“We are delighted with this enthusiastic response, which reconfirms the HKPCA & IPC Show’s respected status as the industry’s most influential platform for sourcing and information and technology exchange,” said Dr. John W. Mitchell, President & CEO, IPC—Association Connecting Electronics Industries. “The impressive line-up of exhibitors will showcase a comprehensive array of new and innovative technologies, products and services. At the same time, the Fair will offer knowledge exchange and learning opportunities through the International Technical Conference and PCB Design Conference where industry experts will share in-depth knowledge and insights on the latest industry innovations and trends.”

Hong Kong Pavilion introduces new insights to the show

A new highlight of the show this year is the Hong Kong Pavilion. Spreading over 100 sq.m. of a common area surrounded by PCB manufacturers’ booths, this will be partitioned into four regions showing PCB or semiconductor products and technology in four different product categories: communication, computers, consumer electronics and automobiles. The superb manufacturing technologies for high value-added features will be presented. Meanwhile, it is expected to show the HK PCB manufacturers’ international perspective and strong commitment to the social responsibility.

Mr. Canice Chung, Chairman of the Hong Kong Printed Circuit Association, remarked, “We are particularly pleased to see the appearance of the Hong Kong Pavilion this year which reflects Hong Kong’s pivotal role in setting new standards and directions for the industry. As the show brings together the elite of the global industry under one roof, the Pavilion adds a further dimension to the show’s important role in shaping the industry’s future.”

“Another important contribution to this mission is the numerous business and networking opportunities provided by the show. This year the PCB Design Competition plus the traditional Welcome Dinner and Golf Tournament will give participants plentiful chances to develop new business links and partnerships, as well as form new personal friendships, in a relaxed environment.”

About Hong Kong Printed Circuit Association (HKPCA)

HKPCA is a non-profit-making association which was founded in Hong Kong during 2000. Being one of the members of World Electronic Circuits Council (WECC), it helps us to get not only closer connections with overseas printed circuit associations but also better communications. Other WECC members include: CPCA, EIPC, IPC, IPCA, JPCA, KPCA and TPCA. As the unique representative of the Hong Kong PCB industry, we aim to promote and protect the rights and interests for the industry. Performing the communication liaison role within the industry, a diversified communication platform is provided by HKPCA so that our members can be closely linked. Also, HKPCA represents the industry expressing our ideas and opinions to the government and relevant organizations. HKPCA has more than 500 members. Total PCB production values reach around 9 billion dollars which occupy 34% of the PCB industry in China. Member categories differ from PCB manufacturers, PCB equipment, suppliers of chemicals and raw materials and other trade and software companies. HKPCA member base will be broadened by recruiting more and more qualified members. With all our efforts, the China PCB industry develops more prosperously. For more information, please visit www.hkpca.org.

NEWS FROM THE IPC

New IPC Studies Show World PCB Market Up in 2016 as North American Market Shrinkage Slows

World PCB Production and Annual North American PCB Industry Reports Released

 

 World printed circuit board (PCB) production reached an estimated $58.2 billion in 2016, up 2.2 percent in real terms, while North American PCB production decreased a mere 0.1 percent, according to IPC’s newly publishedWorld PCB Production Report for the Year 2016. The North American PCB market also continued its downward trend, but at a slowing rate of just -1.7 percent in 2016, based on data published this week in IPC’s 2017 Annual Report on the North American PCB Industry.

The World PCB Production Report shows that more than half the world’s PCBs based on value are now produced in China, but Taiwanese companies are the leading PCB producers, fabricating most of their PCBs off-shore. India emerged as having the fastest-growing PCB industry in Asia and has joined the top 10 PCB-producing countries in the world as of 2016.

The world report highlighted an abrupt change in the growth trends for rigid PCBs and flexible circuits. Rigid PCB production, which has slowed in recent years, was up slightly in 2016, while the previously growing flex segment decreased. The world PCB market overall is expected to continue experiencing modest growth in 2017.

Developed by a team of the world’s leading PCB industry analysts, the World PCB Production Report is the definitive source of PCB production data. It includes estimates of the value of PCB production in eight product categories in each of the world’s major PCB-producing countries and regions. The report also contains commentary on regional industry trends and historical data on PCB production worldwide, as well as a special report on high-speed data communications contributed by BPA Consulting, Ltd.

The 2017 Annual Report on the North American PCB Industry shows that the military and aerospace market continues to consume more than one-third of PCBs sold and this vertical market continues to grow as a percentage of total PCB sales in the region.

The North American report covers the size and growth of the region’s PCB market by product type, the use of special technologies such as RF and embedded components, and other business metrics including revenue per employee, capacity utilization, inventory turns and lead times for rigid PCB and flexible circuit businesses. It is based on data collected in IPC’s North American PCB Statistical Program, in which the sample of survey participants represent more than 50 percent of the region’s PCB market.

World PCB Production Report for the Year 2016, priced at $475 for IPC members and $950 for nonmembers, and the 2017 Annual Report on the North American PCB Industry, at $450 for IPC members and $900 for nonmembers, are available for immediate download in IPC’s online store. For information on IPC market research reports and services, visit www.ipc.org/market-research-reports and www.ipc.org/IndustryData, or contact IPC’s market research team atmarketresearch@ipc.org.

 

IPC Disappointed by Failure of Negotiated Rulemaking Aimed at Encouraging Recycling of Manufacturing Byproducts

IPC – Association Connecting Electronics Industries® is disappointed by the failure of a federal advisory committee to reach agreement on a plan to encourage recycling of manufacturing byproducts.

Under the Lautenberg Chemical Safety Act (LSCA), which was passed by Congress in 2016 with bipartisan support, the U.S. Environmental Protection Agency (EPA) was directed to establish a “negotiated rulemaking committee” aimed at reducing the reporting requirements for byproducts sent for recycling. Two of the panel members represented the electronics industry, including Fern Abrams, IPC’s director of regulatory affairs.

After three official meetings in recent months, the committee today decided to end its work after it became clear that no consensus would be reached.

“IPC appreciates the EPA’s thoughtful participation and contributions to the process, and we are disappointed that the committee was unable to reach a consensus that would have encouraged recycling,” said Abrams.

IPC strongly supported the goal of the negotiated rulemaking, having worked for years to reduce requirements that discourage the recycling of inorganic byproducts by requiring duplicative reporting under the Toxic Substances Control Act (TSCA).

IPC and other industry representatives participated in good faith, offering several meaningful proposals that would have allowed EPA to meet its obligations under TSCA.

“EPA continues to have an obligation under the LCSA to initiate a rulemaking to encourage recycling of byproducts,” Abrams added. “For our part, we will continue to work in good faith with the EPA, with members of Congress, and with all constructive stakeholders to address these issues.”


IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Diego

 IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 28, 2018, and will be displayed throughout the event, offering additional visibility.

Technical poster presentations are being sought on all relevant electronics topics, including design, materials, assembly, processes and equipment and test, especially:

• 3D Printing in Electronics Manufacturing

• Automation in Electronics Manufacturing

• Adhesives

• Advanced Technology

• Area Array/Flip Chip/0201 Metric

• Assembly and Rework Processes

• BGA/CSP Packaging

• Black Pad and Other Board Related Defect

Issues

• BTC/QFN/LGA/MLF Components

• Business & Supply Chain Issues

• Cleaning

• Conformal Coatings

• Corrosion

• Counterfeit Electronics

• Design

• Electromigration

• Electronics Manufacturing Services

• Embedded Passive & Active Devices

• Environmental Compliance

• Graphene in Electronics Manufacturing

• Lean Six Sigma

• LED Manufacturing

• Failure Analysis

• Flexible Circuitry

• HDI Technologies

• Head-on-Pillow

• Board and Component Warpage

• High Speed, High Frequency & Signal

Integrity

• Industry 4.0

• Lead-Free Fabrication, Assembly &

Reliability

• Miniaturization

• Nanotechnology

• Optoelectronics

• Packaging & Components

• PCB Fabrication

• PCB and Component Storage & Handling

Performance

• Quality & Reliability

• Photovoltaics

• PoP (Package-on-Package)

• Printed Electronics

• Reshoring

• RFID Circuitry

• Robotics

• Soldering

• Surface Finishes

• Test, Inspection & AOI

• Tin Whiskers

• 2.5-D/3-D Component Packaging

• Underfills

• Via Plugging & Other Protection

• Wearables

   

 

 

An abstract of up to 300 words summarizing technical and previously unpublished work covering case histories, research and discoveries should be submitted by October 27, 2017, to www.IPCAPEXEXPO.org/CFPosters.

For more information about poster participation or other opportunities to participate in IPC APEX EXPO, contact Jasbir Bath, IPC technical conference director, at JasbirBath@ipc.org or Toya Richardson, IPC technical programs coordinator, at ToyaRichardson@ipc.org.

 

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