IPC-2581 Consortium Member Fujitsu Successfully Fabricates Multi-Layer PCB from IPC-2581B Design File
IPC-2581 User’s Group with board fabricated to IPC-2581B requirements
The electronics industry has never settled on a single approach for moving printed board design data to manufacturing. With the release of IPC-2581B, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology, design engineers now have a way to organize and convey printed circuit board designs from CAD tools in a single intelligent file to manufacturing for fabrication, assembly and test.
At Design Forum at IPC APEX EXPO, this newest release was applied to a real-world scenario, when founding IPC-2581 Consortium member company, Fujitsu Network Communications, Inc., unveiled a 20-layer complex board manufactured only using an IPC-2581B design file.
“IPC-2581B uses an intelligent XML schema format that accelerates printed circuit board fabrication, assembly and testing, and enables design data to be transferred between engineering and manufacturing without the need for human interpretation,” said Tsuyoshi Ueshima, Senior Vice President of Development at Fujitsu Network Communications, Inc. “This eliminates redundant labor and reduces the opportunity for error, resulting in high quality products that customers expect.”
For more information on IPC-2581B or the IPC-2581B Consortium, visit www.ipc-2581.com.
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Electronics Industry Thinks Forward at IPC APEX EXPO 2016 to Create Tomorrow’s Technology
Experiencing IPC APEX EXPO’s legendary combination of education, technology, networking and the largest collection of industry suppliers, 4,048 attendees from 56 countries capitalized on all the forward thinking the show had to offer. Four-hundred and thirty four exhibitors displaying hundreds of products on 139,300 net square feet of show floor space saw three days of qualified leads and sales. IPC APEX EXPO 2016 attracted 8,772 total visitors including attendees and exhibitor personnel.
Preliminary post-show survey feedback from attendees is positive. More than 90 percent of respondents said the show met or exceeded their top objectives. In addition, nearly 70 percent of respondents have indicated that attending the show influences their buying decisions throughout the year.
Many attendees achieved what they sought at the event. “Every time I attend IPC APEX EXPO, I walk away more enlightened and more excited than before about how our industry is evolving. This in turn pays off for my employer greatly. In my case, it’s a ‘win – win’ for both me and my employer. From the Design Forum to the Buzz Sessions to the Technical Conference and Committee meetings, there is so much knowledge passed along there that I strongly feel this is a ‘must attend’ event to come to, get involved in, and be active within IPC,” said Stephen V. Chavez, lead electrical designer, UTC Aerospace Systems.
Lyndon Liepert, EOL tester developer, Pacific Insight Electronics Corp. concurs, “We came to IPC APEX EXPO to look for a flying probe tester, but we found a plethora of additional resources. From actuators, to marking solutions to 3D AOI to robots, we found more resources that we could use to support our business than we expected.”
And the positive news continues. IPC APEX EXPO 2015 has been recognized by the Trade Show News Network (TSNN) as one of the top 250 trade shows in the United States. Coming in at number 141 for 2015 marks a jump from 2014′s ranking of 149.
According to the Center for Exhibition Industry Research (CEIR), there are approximately 13,000 tradeshows held annually in the United States each year. “For the fifteenth consecutive year, IPC APEX EXPO has been recognized by TSNN as a top U.S. tradeshow. In the last several years, IPC’s APEX EXPO ranking has steadily climbed,” said Alicia Balonek, IPC senior director of trade shows and events. “Being ranked a top 250 trade show out of 13,000 is a tremendous accomplishment for the show and for IPC,” she added.
In 2017, IPC APEX EXPO will return to the San Diego Convention Center, February 14–16. Industry researchers, engineers and academics are invited to submit an abstract for consideration in next year’s technical conference or professional development courses in the online call for participation at www.IPCAPEXEXPO.org/cfp.
NEWS FROM THE JPCA
Mr Kunio Takahara, a member of the staff of JPCA, has written to EIPC and has offered the facility of running news from EIPC members in the JPCA publications and on their website.
If this is of interest to you, please contact me – johnh@grantlings.com – and I will forward material and files.
The news items will appear as half-page A5 in JPCA NEWS, a copy of which is shown below.
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