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4 October 2016

Cicor presents: DenciTec® – a PCB technology that takes miniaturization to the next level

DenciTec enables a uniquely high density of integrated functions for printed circuit boards, with high throughput and attractive costs. With DenciTec, Cicor complements its spectrum of services with a solution that delivers highly miniaturized circuits of the highest reliability.

In microelectronics the boundaries between thin film and printed circuit technology is become increasingly blurred. Thin film technology works with materials, processes and machines from both fields and thereby aims to make great progress with regard to miniaturization. Cicor is a technological leader in these fields, not least due to the unique combination of printed circuit boards and thin film technology under one roof. To fulfil all customer requirements, Cicor already offers several combined technologies and is continuously working on its further development.

The new DenciTec platform from Cicor enables the production of circuits with extremely high density without the disadvantages of today’s established manufacturing processes. Making optimal use of a unique combination of devices at the cutting edge of technology allows highly reliable manufacture of circuits without constraining design freedom.

DenciTec creates the opportunity for further miniaturization. The possibilities include conductor widths and spacings down to 25 µm with copper thicknesses of 20 +/- 5 µm on all conductive layers, laser-via diameters of 35 µm, annular rings with a diameter of 30 µm for the inner layers and 20 µm for the outer layers, copper-filled blind vias with the option of via stacking, and vias-in-pads.

Furthermore, the use of advanced materials allows the production of ultra-thin circuits, including, for example, the manufacture of 4-layer flex circuits with a total thickness of less than 120 µm.
Naturally this can be done whilst meeting the highest standards of product reliability.

Contacts:  info@cicor.com

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