Atotech to sponsor ISS Europe 2017
Atotech is a proud sponsor of the SEMI Industry Strategy Symposium (ISS) Europe, which takes place from March 5 to 7 in Munich, Germany. As official sponsor of the “Lucky Draw,” an Atotech representative will have the pleasure of presenting one lucky visitor with an iPad Air. Participants are encouraged to submit their business cards on-site at ISS Europe for a chance to win. The winners’ business card will be drawn on the second morning (Tuesday) of the Symposium at 11am.
Atotech invites ISS members to stop by our table to learn about our market leading products and innovative solutions for next generation packaging challenges. Product experts will be available to provide key information regarding our products and discuss the latest packaging trends.
Prior to the Symposium, read about our plating solutions for fan-out packaging in our article “Fan-out packaging: a key enabler for optimal performance in mobile devices,” published in the January/ February edition of Chip Scale Review. You can find the full article here.
The article details why fan-out is the ideal packaging technology for future generation mobile devices and presents a turnkey electroplating solution for manufacture within both wafer and panel formats.
Atotech representatives look forward to meeting you in Munich.
WECC Report 2016
WECC Global PCB Production Report For 2016 FREE of charge EIPC membership service A Product of the Partnership among the WECC Member Associations on Behalf of their Members in the Electronic Circuits Industry Worldwide
Proceedings EIPC Summer Conference Birmingham 2017
The Conference was held on June 1 & 2, 2017.
Cicor is a globally active group of leading companies in the electronics industry. The group’s companies provide complete outsourcing services and a broad range of technologies for the manufacture of highly complex PCBs, 3D-MID solutions, hybrids circuits, electronic modules, plastic injection molding and box-building.
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