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22 May 2017

SMT Hybrid Packaging 2017 remains leading platform of electronic manufacturing

After three intensive days, the organisers of SMT Hybrid Packaging – Mesago Messe Frankfurt GmbH – look back on a successful exhibition with conference: “The SMT Hybrid Packaging presented itself as a forward-looking fair with solution character. It is the only event in Europe that takes a comprehensive view of system integration in microelectronics, from the initial idea and its development right through to the production of all technical processes during the manufacture of electronic assemblies. Visitors were able to get an excellent overview of the complete value added chain and conference attendees enlarged their knowledge,” explains Anthula Parashoudi, Vice President of Mesago Messe Frankfurt GmbH.

Positive response from exhibitors Several exhibitors summarized their participation directly after the exhibition. Among other things, the SMT Hybrid Packaging scored with its competent visitors, including decision makers from all over the world:

“Yamaha is very pleased of its participation at SMT Hybrid Packaging 2017 as we gained new leads and had several indeep conversations with new potential,” says Oumayma Grad, Marketing Communications Manger of Yamaha Motor Europe N.V.

Information and knowledge transfer on a high level About 15,000 visitors were informed about latest trends and innovations and seized the chance to network within the industry. Moreover, the SMT Hybrid Packaging offered many practice-related and user-friendly possibilities of extended studies.

Diverse forum presentations and tutorials as well as the conference running parallel to the exhibition were used to refresh know-how and get into conversation with experts.

The SMT Hybrid Packaging 2017 at a glance

Exhibition area: 26,200 sqm

Exhibitors: 420 plus 32 represented companies

Visitors: about 15,000

Conference attendees: 259

A detailed analysis with further results of SMT Hybrid Packaging will be available by the end of June 2017. High-resolution photos of the show are available in printable quality in the press-section of smthybridpackaging.com. SMT Hybrid Packaging 2018 will take place from 5 to 7 June 2018 in Nuremberg, Germany.

Additional information is available at smthybridpackaging.com or directly from the organizer Mesago Messe Frankfurt GmbH at smt@mesago.com.

 

 

SCHWEIZER presents innovation at PCIM 2017        

 Shunts for current measurement can now be embedded into the printed circuit board in combination with the p² Pack® ensuring further system advantages.

 The SCHWEIZER p² Pack® allows the embedding of power electronics semiconductors into the printed circuit board (PCB) and is a preferred solution for future high current motor drives. This embedding technology does not only save valuable installation space but offers further system advantages such as: improved conduction losses (RDSon) of the power electronics, improved thermal resistance and thermal impedance (RTH und ZTH) of the system, a low-inductive design, improved switching characteristics, improved electromagnetic compatibility (EMC) as well as higher reliability.

Schweizer Electronic AG now takes the next integration step by embedding shunts in combination with a half bridge for the first time. Thus the components‘ thermal dissipation is optimised and further installation space can be saved, which is a considerable technical advantage in today’s trend towards miniaturisation. First demonstrators of this innovation will be shown at the SCHWEIZER booth (hall 7, booth 240) on occasion of PCIM, taking place in Nuremberg from May 16 to 18, 2017.

Many power electronics applications, e.g. motors, use shunts for current measurement. A shunt is a low-resistance precision resistor, applied for measuring electric currents. The current passing the shunt triggers a proportional voltage drop, which is measured. Shunts so far have usually been mounted on the PCB. As a consequence, the resulting heat has to be conducted through the substrate PCB first before reaching the cooling system.

 

Technical details for embedded shunts

Resistance values 0.05 up to 0.1 mΩ

Currents: 0 – 300 A

Voltage drop: 0.5 – 30 mV

Dissipation: 4.5 – 9 W

Temperature rise: 3 – 5 K

Contact resistance: < 1% of precision resistor.

www.morethanPCBs.com

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