MEMBER LOGIN

NEWS

News from Germany

19 January 2017

SMT Hybrid Packaging – New Tutorial concept and conference focus released

At SMT Hybrid Packaging 2017 a new Tutorial concept with short Tutorials of one and a half hours duration will be offered as well as the established half-day Tutorials. The English Tutorials deal with relevant topics of the whole value chain of electronic assembly production. As a central topic Jennie S. Hwang, H-Technologies Group Inc., picks out “Assembly Integrity and Solder Joint Reliability”. She provides a holistic overview of product reliability and of critical “players” of the assembly integrity and solder joint reliability, including the roles of materials, processes and testing/service conditions, as well as the crucial principles behind the product reliability. Dr. Ning-Cheng Lee, Indium Corporation, looks into the choice of solders: “What I Have to Know about the Choice of Solders to prevail in the new Era?” This course will bring the answer, with the most updated information on the new solder materials developed, and will also help to justify the selection of solder types which fit best for the applications. The course is divided into two parts, with part one addressing the cost and reliability, and part two addressing the low temperature soldering.

Focus of the conference: Panel Level Packaging and Consumer Electronics

The conference of SMT Hybrid Packaging 2017 takes place in the morning on the second and third exhibition day. Practical oriented and fascinating topics await the participants.

“On the first half-day, we take a look at the Panel-Level Technology for which the demand is constantly increasing and the capabilities of Consumer-Packages especially in the automotive- and aircraft industry. With assembly- and product examples as well as several tutorials, SMT Hybrid Packaging will deal intensively with the Panel-Level Technology. The second half-day is dedicated to the question, how Consumer Electronics could also be used in the automotive and aircraft industry. The focus is on reliability methodology as well as on test equipment,” explains the committee chairman Prof. Dr. Klaus-Dieter Lang, Fraunhofer IZM, Berlin, Germany, the main topics of the event.

Securing early booking discount
Early bird rates are available until 3 April 2017. Beside the conference, participants can learn the latest technologies and meet new contacts in the exhibition halls.

SMT Hybrid Packaging takes place from 16 – 18 May 2017 in Nuremberg, Germany. The international exhibition and conference is the only event in Europe which takes a comprehensive view of system integration in micro-electronics, from the initial idea and its development right through to the production of all technical processes during the manufacture of electronic assemblies.

The complete conference program and further information about the tutorials can be found online on smthybridpackaging.com/conference.

About Mesago

Mesago, founded in 1982 and located in Stuttgart, specializes in exhibitions and conferences on various topics of technology. The company belongs to the Messe Frankfurt Group. Mesago operates internationally and is not tied to a specific venue. With 130 members of staff Mesago organizes events for the benefit of more than 3,300 exhibitors and over 110,000 trade visitors, conference delegates and speakers from all over the world. Numerous trade associations, publishing houses, scientific institutes and universities work with Mesago closely as advisers, co-organizers and partners. Mesago comprises three companies: Mesago Messe Frankfurt GmbH, Mesago Messemanagement GmbH and Mesago PCIM GmbH.

(mesago.com)

 

Related Stories

EIPC Events view all events

Publications view all publications

  • WECC Report 2016

    By KWestenberg@eipc.org

    WECC Global PCB Production Report For 2016 FREE of charge EIPC membership service A Product of the Partnership among the WECC Member Associations on Behalf of their Members in the Electronic Circuits Industry Worldwide

  • Proceedings EIPC Summer Conference Birmingham 2017

    By KWestenberg@eipc.org

    The Conference was held on June 1 & 2, 2017.

Industry Directory view directory

  • Cicor Group

    www.cicor.com

    Cicor is a globally active group of leading companies in the electronics industry. The group’s companies provide complete outsourcing services and a broad range of technologies for the manufacture of highly complex PCBs, 3D-MID solutions, hybrids circuits, electronic modules, plastic injection molding and box-building.

  • Isola Group

    www.isola-group.com

    Corporate Responsibility. The responsible stewardship of the environment and sustainable business practices is important to long-term success. Committed to operating our business in a manner that creates better social, economic and environmental outcomes for all those involved in the electronics industry.

SITEMAP FEEDBACK

Please provide some more details

FIND OUT MORE

Please login or register

Layer-70

EIPC membership has many advantages, both financially and in services. Such as:

REGISTER NOW

You must be a member to view this content

Layer-70

EIPC membership has many advantages, both financially and in services. Such as:

REGISTER NOW

Please Login / Register

IM NOT REGISTERD TO EIPC
IM REGISTERD TO EIPC

Please provide some more details

Please provide some more details

Thank you!

An EIPC staff member will contact you soon to arrange payment.

Please fill in the form

EIPC will send an invoice to you through email and discuss your yearly fees.