Schweizer Electronic AG fulfils expectations for turnover and earnings and takes a confident view of perspectives for 2016
Preliminary figures for the business year 2015
• Order book jumped by 25% to record level
• Turnover increases to 115.5 million euro
Schramberg, February 29, 2016 – According to preliminary figures Schweizer Electronic AG has closed the accounts for the fiscal year 2015 with a record turnover of 115.5 million euro. The order book climbed to a record level of 149.1 million euro by the end of the year 2015 (previous year 119.2 million euro), presenting a promising starting position for further growth.
A particularly strong fourth quarter substantially contributed to the positive development of order income, which jumped by 25% to 145.4 million euro. Order activities of the automotive customers were very satisfying with an increase of 20.8 million euro to 105.5 million euro.
Moreover, SCHWEIZER aims at a narrowly-focused enlargement of its customer portfolio and has already received significant new orders from customers of the aviation industry. The company exactly met its expectations with earnings before interest and tax (EBIT) of 8.5 million euro (previous year €10.0m), which corresponds to an EBIT margin of 7.4 percent (previous year 9.1%). The EBIT was affected by two exceptional expenses:
Firstly, the development of the euro currency in relation to the US dollar had negative effects on SCHWEIZER’s earnings, as significant volumes are purchased in the US and in Asia and secondly, the EBIT was burdened by one-time personnel expenses. Excluding these non-recurring items making up a total of 2.1 million euro in 2015, the EBIT would amount to 10.6 million euro (previous year €10.0m), which corresponds to an EBIT margin of 9.2 percent (previous year 9.1%).
“Thanks to our leading position in the growth markets of fuel efficiency and CO2 reduction as well as ADAS (advanced driver assistance systems) we expect to continue to grow faster than our reference markets also in the years to come Depending on the business development with our Asian partners e.g. in the field of high frequency technology and under consideration of the rather cautious forecasts for the overall economy as well as for the global PCB market, we expect a turnover increase of 3 to 5 percent in 2016”, comments Dr. Maren Schweizer, CEO of Schweizer Electronic AG.
Based on the planned customer and product portfolio, the company expects stable operative business results, which should correspond to the slightly positive turnover forecast for 2016. The dynamic business environments on the energy-, industrial metal- and currency markets, however, will involve risks as well as opportunities.
Furthermore, the increasing share of products from Asian partners will increase turnover in absolute figures, but due to the nature of trading operations, the margins will be lower than those generated by the sale of own products. The exclusion of one-time personnel expenses will have positive effects on the EBIT margin.
Due to growing activities in its subsidiaries, SCHWEIZER decided to publish an additional consolidated financial statement based on the IFRS rules for 2015. Final figures for the fiscal year 2015 will probably be published on March 30, 2016.
Key figures of Schweizer Electronic AG (HGB) in million euro 2015 2014 Change Order income 145.4 116.3 +25.0%
Order book 149.1 119.2 +25.1%
Revenues 115.5 110.2 +4.8%
EBITDA 12.3 14.2 -13.3%
EBITDA margin (%) 10.7 12.9
EBITDA before special effects 14.4 14.2 +1.4%
EBITDA margin before special effects (%) 12.5 12.9
EBIT 8.5 10.0 -14.9%
EBIT margin (%) 7.4 9.1
EBIT before special effects 10.6 10.0 +6.0%
EBIT margin before special effects (%) 9.2 9.1
Earnings after taxes 5.5 5.6 - 2.6%
Schweizer Electronic AG stands for state-of-the-art technology and consultancy competence. SCHWEIZER’s premium printed circuit boards and innovative solutions and services for automotive, solar, industry and aviation electronics address key challenges in the areas of Power Electronics, Embedding and System Cost Reduction. Its products are distinguished for their superior quality and their energy-saving and environmentallyfriendly features. Together with its partners Elekonta Marek GmbH & Co. KG, Meiko Electronics Co. Ltd. and WUS Printed Circuit Co., Ltd., the company offers in its division electronics cost- and production-optimised solutions for small, medium and large series. Together with its partner Infineon Technologies AG, SCHWEIZER plans to jointly tap the chip embedding market in future.
24th FED Conference – 15th & 16th September 2016, Berlin.
In the autumn this year the FED will hold their 24th annual conference at the Maritim Hotel in Bonn on the 15th & 16th September.
The FED umbrella covers the design manufacturing and management processes for electronic assemblies, and is thus a logical partner of EIPC who will be attending the event. The FED Conference, for nearly a quarter of a century, has been the most important platform in the field of development and manufacturing of electronics.
Combining a wealth of papers from professionals, information acquisition and knowledge transfer form the main theme, along with an exhibition and live demonstrations which can be seen during the various breaks in the conference programme.
FED are calling for papers for consideration for inclusion in their programme, for which the closing date is 15th March.
The range of topics covers development and design, 3D technologies, 3D printing, energy storage, energy harvesting, PCBs and assemblies for high-reliability in the fields of aviation, medical and automotive electronics as well as outer space amongst a raft of applicable subjects.
If you have something to talk about that you feel might be of interest, please do contact
FED e. V.
Tel. +49 (0)30 8447 1445
Smart Systems Integration 2016: Attractive conference program with many highlights
The anniversary event of Smart Systems Integration offers in its conference a wide range of topics and casts an intensive glance at current trends and future developments in the industry.
Latest digital solutions regarding the interconnection of sensors, equipment or products and their data analysis play an important role.
“The 10th Smart Systems Integration Conference addresses applications as well as aspects of basic research, and will show a snapshot of the international work in the field of smart systems integration. The event focuses on the hardware for the Internet of Things and the increasing electronic application on flexible substrates”, summarizes committee chair Prof. Dr. Thomas Gessner, Fraunhofer ENAS, Chemnitz, this year’s conference focus.
Conference topics: user-oriented and industry required In five keynotes, 50 lectures, two special sessions by EPoSS, a panel discussion on “Printing of Smart Systems” and two poster sessions with more than 30 posters, the latest research results and developments will be presented user-oriented and industry required to the following key topics:
Participants of both EPoSS sessions have the chance to get comprehensive and detailed information about the topics “Strategies and opportunities for smart systems research in Horizon2020” as well as “Smart Systems Integration in the JTI ECSEL”.
The exhibition: Presentation platform with job board
The conference is accompanied by an exhibition where e.g. R&D institutes, manufactures of components and systems in the sectors microsystems and nanotechnology, microelectronics, sensor technology and wireless communication present their products and solutions.
For the first time, visitors and participants can look forward to a free career coaching, an application check and a job board in the context of the exhibition. This career tool offers the opportunity to inform themselves about current job offers of the exhibiting and cooperating companies and research institutions and to contact the potential employers directly on-site.
Time for networking and innovation
An attractive social program will complete the event. The pre-field trip on 8 March 2016 is going to the Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT in Munich. Participants expect a guided tour to the institute with selected stations and demonstrators and exhibits, short presentations and networking.
The traditional conference dinner on 9 March 2016 is taking place in the restaurant 181 on top of the Olympic Tower in the Olympia Park Munich.
For the second time the conference Smart Systems Integration with its accompanying exhibition takes place in Germany.
Having taken place in Dresden in 2011, Munich is this year’s venue from 9 – 10 March 2016.
For the conference registration please visit smartsystemsintegration.com/registration. The complete conference program and further information are available at smartsystemsintegration.com.
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