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19 January 2016

Ventec International Group and TMT Trading announce intention to merge

 Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, announced the intention to merge with TMT Trading GmbH, a leading distributor of PCB base-materials including consumables and flex- & rigid-flex circuit board materials. The merger is expected to take effect in early 2016.

The management of Ventec International, headquartered in Suzhou, China, and TMT Trading GmbH, headquartered in Kirchheimbolanden, Germany, announced today that they have entered into discussions to merge TMT with the Ventec International Group. The merger is planned for early 2016. Until that time, both companies will remain fully independent entities and business will continue as usual.

The merger will widen Ventec’s product offering to include complementary products such as back-up, entry & routing materials, foils, clean room products and coatings, offering a one-stop-shop for customers of laminates and PCB base materials.

Tony Lau, Ventec International Group’s CEO commented: “Our combined company will be in a stronger position for continued growth over the long term. We will have enhanced product offerings, allowing us to better serve our global clients, as well as the opportunity to attract new customers and expand into new niche markets.”

Thomas Michels, CEO of TMT and Managing Director of Ventec Central Europe added: “TMT has been working in partnership with Ventec for a number of years. A merger is a natural progression in the relationship, which will greatly benefit both our customer bases through the synergies our partnership bring.”

For more information about Ventec’s solutions and the company’s wide variety of products, please visit www.ventec-usa.com or www.ventec-europe.com.

 

Smart Systems Integration 2016 – Conference registration now open

Smart Systems Integration 2016 will take place at the Holiday Inn Munich – City Centre in Munich, Germany from 9 – 10 March 2016.

SSI focuses on complex systems up to their components. The presented contents are user- and industry-oriented and show the research and development potential worldwide. Conference participants can expect the following highlights:

 

  • Five keynotes by skilled experts from the European Commission, Infineon Technologies, Robert Bosch GmbH, Fraunhofer Institute for Reliability and Microintegration IZM as well as Friedrich Schiller University Jena
  • 50 lectures by top speakers from science and industry
  • Two special sessions by EpoSS on „Strategies and opportunities for smart systems research in Horizon2020“ and „Smart Systems Integration in the JTI ECSEL“
  • A panel discussion on “Printing of Smart Systems”
  • More than 30 poster presentations

First class speakers from renowned companies and research institutions present innovations, applications and trends to the following topics with high actuality:

 

  • System integration and packaging
  • Test and reliability
  • Smart medtech systems
  • Hardware for the Internet of Things
  • Printed / stretchable and flexible electronics

 

The exhibition as a presentation platform for the industry

The conference is accompanied by an exhibition where e.g. R&D institutes, manufactures of components and systems in the sectors microsystems and nanotechnology, microelectronics, sensor technology and wireless communication present their products and solutions. Exhibitors meet a highly specialized, international audience of experts, users and scientists.

 Participants of the anniversary event may also look forward to further highlights: The Wall of Fame of the previous Best Paper and Best Poster Award winners and the Job-Board. This enables visitors and participants to learn about current job offers of the exhibiting and cooperating companies and research institutions and to contact the potential employers directly on-site.


The social program 2016 – time for networking and innovation

An attractive social program will complete the event. The pre-conference field trip on 8 March 2016 is going to Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT in Munich. The guided tour will present a close-up view into the five main topics of research of the institute: Sensor materials, Sensors and actuators, Microdosage systems, Flexible systems and Design and test.

The traditional conference dinner on 9 March 2016 is taking place in the restaurant 181 on top of the Olympic Tower in the

Olympiapark in Munich. After a guided tour through the rock

museum, that is located within the Olympic Tower, the dinner

offers the opportunity for intensive discussions and networking. During the dinner the Best Paper and Best Poster Award of

SSI 2015 will be presented.

 

Registration

 For the conference registration please visit www.smartsystemsintegration.com/registration. Early bird prices are available until 31 January 2016.

The complete conference program and further information can be found at www.smartsystemsintegration.com

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