MEMBER LOGIN

NEWS

News from Austria

23 March 2017

AT&S makes advances in PCB, module and packaging technologies

AT&S is actively participating in key industry consortia to develop GaN processes and panel-level packaging.  For years, AT&S has worked towards process and technology development to meet the challenges of continued miniaturization and the demand for better energy efficiency. In this context, the company is involved in various research and development programmes. One current example is the Horizon 2020 EU Research and Innovation programme, in which 11 key European actors are collaborating on the GaNonCMOS project. AT&S is also participating in the Panel-Level Packaging Consortium managed by Fraunhofer IZM.

Optimized energy efficiency with GaN

Over the next four years, the GaNonCMOS project consortium – including AT&S – intends to develop cost‑effective and reliable GaN-based processes, components, modules and integration approaches. In particular, the project aims to exploit the energy-efficiency advantages of GaN (gallium nitride), targeting the production of several demonstrators with GaN power switches and CMOS drivers, as well as new magnetic core materials that will enable switching frequencies up to 200 MHz. Together with optimized embedded PCB technology, the developments should lead to new integrated power components for low-cost, high-reliability systems. Working alongside AT&S on this project are the University of Leuven, Epigan, Fraunhofer, IBM Research, IHP, Tyndall National Institute, PNO Innovation, Recom, NXP Semiconductors and X-FAB Semiconductor.

Advancing miniaturisation with panel-level packaging
The Panel-Level Packaging Consortium has also now been formed. It comprises international partners such as Intel, ASM Pacific, Hitachi Chemical, AT&S, Evatec, Nanium, Süss MicroTec, Unimicron, Brewer Science, Fujifilm Electronic Materials U.S.A., ShinEtsu, Mitsui Chemicals Tohcello and Semsysco. Together with Fraunhofer IZM as the development hub, the plan is to implement fan-out panel-level packaging (FOPLP), one of the newest packaging trends in microelectronics. FOPLP has a very high miniaturisation potential in both package volume and package density.

During the consortium’s two-year term, known technological elements in wafer-level packaging will be transferred to a large panel format. The technological basis for FOPLP is a reconfigured, moulded panel with embedded components and a thin-film redistribution layer, which together yield an SMD-compatible package. The main advantages of FOPLP are a very thin, substrateless package, low thermal resistance, and good RF characteristics. In addition, passive components such as capacitors, resistors, inductors and antenna structures can be integrated into the redistribution layer. This makes the technology suitable for creating multi-chip packages and System-in-Packages (SiPs).

Related Stories

EIPC Events view all events

Publications view all publications

  • WECC Report 2016

    By KWestenberg@eipc.org

    WECC Global PCB Production Report For 2016 FREE of charge EIPC membership service A Product of the Partnership among the WECC Member Associations on Behalf of their Members in the Electronic Circuits Industry Worldwide

  • Proceedings EIPC Summer Conference Birmingham 2017

    By KWestenberg@eipc.org

    The Conference was held on June 1 & 2, 2017.

Industry Directory view directory

  • Cicor Group

    www.cicor.com

    Cicor is a globally active group of leading companies in the electronics industry. The group’s companies provide complete outsourcing services and a broad range of technologies for the manufacture of highly complex PCBs, 3D-MID solutions, hybrids circuits, electronic modules, plastic injection molding and box-building.

  • Isola Group

    www.isola-group.com

    Corporate Responsibility. The responsible stewardship of the environment and sustainable business practices is important to long-term success. Committed to operating our business in a manner that creates better social, economic and environmental outcomes for all those involved in the electronics industry.

SITEMAP FEEDBACK

Please provide some more details

FIND OUT MORE

Please login or register

Layer-70

EIPC membership has many advantages, both financially and in services. Such as:

REGISTER NOW

You must be a member to view this content

Layer-70

EIPC membership has many advantages, both financially and in services. Such as:

REGISTER NOW

Please Login / Register

IM NOT REGISTERD TO EIPC
IM REGISTERD TO EIPC

Please provide some more details

Please provide some more details

Thank you!

An EIPC staff member will contact you soon to arrange payment.

Please fill in the form

EIPC will send an invoice to you through email and discuss your yearly fees.