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Ventec International Group to unveil new ‘tec-speed’ brand for high speed/low loss materials at DesignCon 2016

13 January 2016

13th January, 2015 – Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, will exhibit in Booth 118 at DesignCon 2016 (January 20th to 21st 2016, Santa Clara, CA, USA) where the company will launch a new brand identity, tec-speed, for its high speed/low loss product line. With the launch, Ventec will unveil a new logo, marketing collateral and technical specifications.

The creation of the brand name ‘tec-speed’ is a move to unite Ventec’s high speed/low loss product portfolio and better position the range under a single identity, connecting the products through a clear and cohesive visual presentation.

Martin Cotton, Director OEM Technology, commented: “The tec-speed brand now unites one of the most comprehensive range of products in high speed/low loss PCB material technology. Every tec-speed product provides technological innovation, high performance and quality to customers to perfectly meet their needs.”

Ventec International Group’s COO USA & EUROPE, Mark Goodwin added: “With the growing demand for high reliability and high speed computing & storage applications, and a pipeline of new innovative additions to our range, the timing is right to give our product line a clear identity. More than that, our unique approach to supply chain ownership, with a manufacturing and distribution network that covers the relevant markets globally, ensures fast delivery of quality materials”.

 A selection of products will be highlighted at the show, including:

tec-speed 6.1 (Dk 3.2, Df 0.004 RC 50%) – Ultra-Low Loss High Tg material available with all copper styles, including HVLP. Uses Low Dk spread glass to improve Skew and Jitter. Applications include Telecom, Router, Servers etc. Specifically, backplane and daughter card designs where good Signal Integrity is essential. This material has excellent Thermal properties.

tec-speed 4.0 (Dk 3.8, Df 0.007) – Low-Loss High Tg material available with all copper styles, including HVLP. Applications focus on High Frequency & High Speed designs, Automotive and Satellite communication, Navigation, GPS, etc. are typical applications. This material has excellent thermal properties.

tec-speed 1.0 (Dk 3.9, Df 0.012 @ 10GHz RC75%) – Mid-Loss Mid Tg Halogen Free material available with all copper styles. Applications include hand-held products, specifically those that require high frequency high speed materials. This material has excellent thermal properties.

For more information about Ventec’s solutions and the company’s wide variety of products, please visit www.venteclaminates.com or download to the Ventec APP.

 

About Ventec International

With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and quick-turn CCL manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, visit www.venteclaminates.com, www.ventec-usa.com or www.ventec-europe.com.

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