2018 Winter Conference

Lyon, France

February 1 & 2

“Future Trends for successful positioning of Europe’s place in the Global Supply Chain” 

EIPC selected Alstom France, for their Winter event. The conference was held on 1st & 2nd February 2018.Those who were both fortunate and sensible enough to have attended the EIPC WINTER CONFERENCE in Lyon at the end of January will know what an outstanding success it all was.

For those who had less luck and were not able to go, the consolation will be the pure technical prose contained within the pages of Pete Starkey’s superb review, in which he captures the mood, feeling and content of the fascinating presentations given by a distinguished coterie of speakers from all over the world.

When the airline pilot urges you to “sit back, relax, and enjoy the flight” whilst you are defying gravity in a metal tube at an outside temperature of -55ᵒC, the same message pertains here, but now you can remain earthbound in the warm comfort of your own home or office and appreciate the material contained in the links shown below:

Here are the links to the review of the Conference Day 2 by Pete Starkey as they appeared in the columns of I-Connect007, to whom we send your kind attention.

Conference Programme Day 1, Thursday February 1
08:00-08:30 Conference Registration and Table Top & Poster Exhibition
08:30-08:45 Welcome by the EIPC Chairman Alun Morgan, EIPC, UK

Keynote Session: Business, Technology & New Developments
08:45-09:30 Business Outlook: Global Electronics Industry Walt Custer,
Custer Consulting, USA

09:30-10:00 From Semiconductor Die to PCB: Changing Landscapes
and Future Requirements
Dr. Andrej Ivankovic, Yole Developpement, FR

10:00-10:30 Present and future solutions for the Electronics Industry in
Heinz Gach, AT & S Austria Technologie & Systemtechnik
Aktiengesellschaft, AT

10:30-10:45 Panel discussion
10:45-11:15 Coffee break

Session 1: Trends and capabilities in PCB fabrication

11:15-11:35 Future automotive requirements Dr. Christian Klein,
Robert Bosch GmbH, DE

11:35-11:55 s. mask: solder mask 4.0 Dr. Lothar Weitzel, Würth Elektronik
GmbH & Co. KG, DE

11:55-12:15 Miniaturized Hermetic Modules for Sensor Integration Dr. Marc Hauer, Dyconex AG, CH

12:15-12:35 ULDk for high speed loss designs Tamara den Daas-Wijnen, Ventec
International Group, NL

12:35-13:45 Networking Lunch Hotel Restaurant

13:45-14:15 PCB material toolbox for today’s 3 and 4G networks and
future high speed needs in 5G in the most cost effective and
environmental way
Stig Källman, Ericsson, SE

14:15-14:35 5G design feature driven PCB Technology & Process and
presented Erkko Helminen, TTM,

14:35-14:55 Panel discussion
Session 2: Reliability Moderator: Emma Hudson,

14:55-15:15 PCB Incoming Inspection and Analysis Speaker tbc

15:15-15:35 Defects through Ionic Contamination. Process and finish
product control using IEC 61189-5
Graham Naisbitt, Gen3 Systems Ltd, UK

15:35-16:05 Reliability of multi-level HDI structures and Reliability of
Back-drilling Bill Birch, PWB Interconnect Solutions, CA

16:05-16:25 Electronic requirments for global Railway / Trains markets Thomas Boutaric, Alstom, FR
16:25-16:40 Panel discussion

16:45-18:45 Tour Alstom

18:45-21:45 Network Dinner Brasserie Georges Lyon Centre

22:00 Return and arrival at Headquarter Hotel Ibis

Conference Programme Day 2, Friday February 2
Session 3: Process Improvements

09:00-09:20 Future PCB fabrication and material requirements for the global
industry segments Grace O’Malley, iNEMI, UK

09:20-09:40 Using Raw Data to develop an Intelligent Manufacturing
Solution for the problem of registration control within the PCB
“Smart Factory” Andrew Kelley, Xact PCB, UK

09:40-10:00 Does the Pre-treatment Influence the Layer Characteristics of
Organic Surface Preservatives? Rick Nichols, Atotech, DE

10:00-10:20 Redefining your solder mask needs with ink jetting Don Monn, Taiyo, US

10:20-10:40 Panel discussion
10:40-11:10 30 minutes Coffee break Table Top & Poster Display Area

Session 4:
European needs for New Technology, Product Safety and Training

11:10-11:30 Safety and reliability Standarization IEC standards and the role
of UL in the global market Emma Hudson, UL, UK

11:30-11:50 Printed Electronics for Flexible and Conformal Applications Neil Chilton,
Printed Electronics, UK

11:50-12:10 DuPont Photovoltaic and Advanced Materials for Printed
Electronics Joshua Morris, CCI Eurolam, SP

12:10-12:40 FED Training Programme “Certified Electronics Designer” Christoph Bornhorn + Erika Reel,

12:40-13:00 3D printer Dragon Fly for PCB prototyping and electronics
manufacturing Speaker tbc

13:00-13:15 Panel Discussion
13:15-13:20 Chairman closing remarks – End of conference day 2
13:20-14:30 Networking Lunch Hotel Restaurant


MEMBERS (early) 600

MEMBERS (regular) 725

NON-MEMBERS (early) 780

NON-MEMBERS (regular) 900



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