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EVENTS

2017 Summer Conference

Birmingham-Solihull

June 1 & 2

Conference venue: Best Western Plus Manor Hotel, Solihull, UK.

The Bonus Programme will include a visit & network dinner to the National Motorcycle Museum.

Conference Programme Day 1, Thursday June 1

08:00-08:30 Conference Registration and Table Top & Poster Exhibition build up    Table Top & Poster Display Area
08:30-08:45 Welcome by the EIPC Chairman    Alun Morgan, EIPC, UK

Keynote Session: Business, Technology & New Developments
08:45-09:30 Business Outlook: Global Electronics Industry
Walt Custer, Custer Consulting, USA

09:30-09:50
Sharing experience in Embedding of Active and Passive Components in Organic PCBs for more reliability and miniaturization
Thomas Hofmann, Hofmann Leiterplatten, DE

09:50-10:10
CHIRP: A Lab-on-PCB microsystem for children-friendly patches against an emerging diabetes epidemic in Turkey
Dr. Despina Moschou, University of Bath, UK

10:10-10:25    Panel discussion
10:25-11:00    Coffee break

Session 1: High frequency & power
11:00-11:20
Copper roughness and enhancements in signal integrity modeling techniques
Martyn Gaudion, Polar Instruments, UK

11:20-11:40
Impact of Copper roughness
Wim Ongenae, MEC Europe, BE

11:40-12:00
Ultra Low Profie Copper Foil For Very Low Loss Material
Thomas Devahif, Circuit Foil, LU

12:00-12:20
The impact of New generation chemical Treatment systems on high Frequency Signal Integrity
Alun Morgan, HDP User Group, UK

12:20-12:40
Comparative Testing of Electrical Performance of PCB Base Materials
Alexander Ippich, Isola Group, DE

12:40-12:50    Panel discussion
12:50-14:00    Networking Lunch    Hotel Restaurant

Session 2: Thermal Management
14:00-14:20
New Phosphorus-based Curing Agents for PWB
Andrew Pitrowski, ICL, NL

14:20-14:40
Thermal Management Solutions for PCB’s based upon our manufacturing experience in our Wetter factory
Pádraig McCabe, Schoeller Electronics Systems, DE

14:40-15:00
Title to be announced
Jake Kelly, Viking Test, UK

15:00-15:20
FR-15 – the new higher temperature “FR-4” material for UL Recognized Boards
Emma Hudson, UL VS Ltd., UK

15:20-15:30    Panel discussion
15:30-16:00    Panel discussion on issues facing the PCB materials supply chain
Isola-Ventec

16:30    Departure National Motorcycle Museum
17:00-21:30    Tour & Network Dinner National Motorcycle Museum
21:30-22:00    Return and arrival at Hotel

Conference Programme Day 2, Friday June 2

Session 3: Processes and materials for flexible PCBs
09:00-09:20
New material and performance characteristics and material differentiation
Thomas Michels, Ventec Europe, DE

09:20-09:40
Flex PCB based technology for randomly shaped circuits
Prof. Vanfleteren, IMEC, BE

09:40-10:00
A New dimension of flexibale PCBs
Philip Johnston, Trackwise, DE

10:00-10:20
PCB multilayer lay-up technologies and bonding processes prior to the pressing of the multilayers
Bernd Gennat, DIS Technology, USA

10:20-10:50
An overview of Registration for Multilayer Printed Circuit Boards
Paul Waldner, MIE Multiline International Europa LP, DE

10:50-11:00    Panel discussion
11:00-11:30    30 minutes Coffee break    Table Top & Poster Display Area

Session 4: Soldermask & Conformal Coatings
11:30-11:50
Soldermask for Direct Imaging
Don Monn, Taiyo America, USA

11:50-12:10
Title to be announed
Uwe Altmann, Orbotech, BE

12:10-12:30
Conformal Coatings Today and in the Future
Stefan Schröder, Lackwerke Peters, DE

12:30-12:50    Multi-wavelength UV-LED technology for direct imaging of solder mask
Michel van den Heuvel, Ucamco, BE

12:50-13:00    Panel Discussion
13:00-13:10    Chairman closing remarks – End of conference day 2
13:10-14:00    Networking Lunch    Hotel Restaurant

Download here the Registration form Birmingham 2017.

Price

MEMBERS (early) 600.-

MEMBERS (regular) 725.-

NON-MEMBERS (early) 780.-

NON-MEMBERS (regular) 900.-

REGISTER ONLINE

Sponsors

    Other Sponsors

  • VIG_Logo_Chinese_website_2017Viking Logo 072 smallPolar logo small 2017Adeon logo PMS109C 2014 smallIsola LogoCuster Consulting logo 2010 small

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