08:30-09:00 Conference Registration and Table Top & Poster Exhibition build up Table Top & Poster Display Area
09:00-09:15 Welcome by the EIPC Chairman Alun Morgan, EIPC, UK
09:15-10:00 Business outlook: Global electronics industry:
12:55-13:55: Networking Lunch
14:00 Departure visit AIRBUS Defence & Space
15:00 Arrival @ AIRBUS Defence & Space
17:00 Departure @ AIRBUS Defence & Space
18:30 Networking Dinner @ Munich City
20:30 Return to Hotel
21:00 Arrival at hotelConference Programme Day 2, Friday February 6Session 2: Copper cleaning and advanced material solutions
09:00-09:10 Welcome day 2 and Introduction
09:10-09:35 Correlating established and emergent methodologies for measurement and modeling of PCB Cu Foil roughness profiles: Polar Instruments, UK
09:35-10:00 Impact of Cu topography on signal loss in high frequency applications → FlatBond: MEC Europe, BE
10:00-10:25 Copper activation in PCB fabrication. New Universal Processes to improve first pass yield and reduce cost: KIV PCB ProfiChem, DE
10:25-10:40: 15 minutes Coffee Break Table Top & Poster Display Area
10:40-11:05 Recyclable and Environmental-friendly Etchant for Copper Surface Pretreatment: Atotech Deutschland, DE
11:05-11:30 A designed experiment for the influence of copper foils and oxide replacement on the electrical performance of PCBs: Isola Group, DE
11:30-11:55 Is IMS the only way to resolve Thermal Issues, Ventec International Group, UK
11:55-12:10: 15 minutes Panel Discussion
12:10-13:10: Networking LunchSession 3: Advanced Imaging & Soldermask
13:10-13:35 The New Way of Imaging: Orbotech, BE
13:35-14:00 Solder mask advancements in the digital age: Taiyo America, US
14:00-14:25 Photo-imageable solder masks – an overview of today’s material capabilities and limitations
Lackwerke Peters, DE
14:25-14:50 UL recognition of solder resists and adding them to your UL recognized PCB: UL International (UK) Ltd., UK
14:50-15:00: 10 minutes Panel Discussion
15:00-15:15: 15 minutes Coffee Break Table Top & Poster Display AreaSession 4: PCB 4.0 How to make PCBs smart and ready for Industry 4.0
Industry 4.0 and Smart Manufacturing
: an open discussion session led by a panel of industry experts.
Industry 4.0 makes smart objects necessary. What are the most important objects in an electronics factory? Of course the PCBs. The best way to make PCBs ready for the next generation of electronics production is to add an RFID function to them. so that they have a communication address and memory. This session will illustrate the most efficient ways to add RFID to PCBs. This can happen either on the assembly line, by adding an RFID module, or during PCB production, by embedding an RFID into the board. A comparison of RFID types will be made. Actual use cases and projects will illustrate the added value of smart PCBs for different stakeholders over the product life cycle that can increase the commercial value of PCBs. Upcoming additional functionalities such as adding sensors or a digital interface will also be discussed.
15:15-15:30 Murata, DE
15:30-15:40 ASM / SIPLACE, DE
15:40-15:50 Micronex, DE
15:50-16:00 Schmoll Maschinen, DE
16:00-16:10 OEM t.b.d.
16:10-16:40 30 minutes Panel Discussion
16:40-16:50 Chairman Closing Remarks
16:50 End of Conference
The EIPC is not responsible for the content and the presentation of the technical papers, which rests with the presenters. Changes in the programme may occur, due to circumstances, for which the EIPC may not be held responsible.
As part of the Winter Conference, we will be visiting the Airbus Defence & Space complex at Manching, Bavaria in the afternoon of February 5. One of the areas to be seen will be the final assembly line of the Eurofi ghters destined for various European air forces.
Visitor guide Airbus DS Manching